EP3SE80F1152I3 - Stratix III E 80K LE FPGA, 1152-FCBGA | Intel
MPN: EP3SE80F1152I3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3408.91 | $3,408.91 |
| 10 | $2950 | $29,500.00 |
| 100 | $2550 | $255,000.00 |
| 500 | $2200 | $1,100,000.00 |
| 1,000 | $1950 | $1,950,000.00 |
EP3SE80F1152I3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and on-chip memory that can be re-programmed to implement arbitrary digital logic after manufacturing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> digital logic ICs -> integrated circuits. Stratix III E series parts are positioned as high-density, performance-oriented members of Altera's (now Intel's) programmable logic portfolio, with the E variant tuned for digital signal processing and high-speed parallel interfaces.
Key features of the EP3SE80F1152I3 include 80,000 logic elements distributed across 3,200 LABs, dedicated DSP blocks, TriMatrix embedded memory totaling 6,843,392 bits, and 744 user I/O pins supporting multiple I/O standards. The part is offered in the -I3 industrial speed grade, indicating the third-fastest industrial temperature and timing bin, and is specified for an operating temperature range of 0C to 85C with a 1.0 V core supply and supporting I/O voltages typically ranging from 1.2 V to 3.3 V.
From an architectural standpoint, the device leverages Altera's adaptive logic module (ALM) and MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process with embedded memory and DSP blocks enables efficient implementation of high-throughput datapaths such as video processing, communications baseband, and protocol bridging, while the FCBGA-1152 package provides the pin density needed for the 744 I/O channels and the multi-gigabit transceiver interfaces typical of Stratix III E designs.
Typical applications include high-speed digital signal processing in telecommunications equipment, ASIC prototyping, high-performance computing accelerators, broadcast video processing, and high-bandwidth serial protocol interfaces. Industrial-grade temperature operation also suits factory automation controllers and medical imaging back-end pipelines.
Designers should plan PCB layout for the FCBGA-1152 package using a multi-layer PCB with controlled-impedance routing for high-speed I/O and adequate thermal vias under the package to manage power dissipation. Use the Quartus II design software for synthesis, place-and-route, and timing closure, and verify pin assignments and I/O standard support against the device handbook.
This page synthesizes distributor inventory and pricing, drop-in Stratix III E alternatives, and practical design considerations that go beyond the manufacturer handbook. All data is anchored to distributor and manufacturer sources current as of 2026-09-09.
Drop-in alternatives for EP3SE80F1152I3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152I3 (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Process Technology, RoHS Status, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F1152C3N
✅ Drop-In✓ In Stock
$1690 / Unit
View Datasheet →EP3SE110F1152I3N
✅ Drop-In✓ In Stock
$3980 / Unit
View Datasheet →EP3SE110F1152I3
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →EP3SE50F1152I3N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE50F1152I3
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE80F1152I3 Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Device Family | Stratix III E |
| Logic Elements | 80,000 |
| LABs / CLBs | 3,200 |
| Total RAM Bits | 6,843,392 |
| Number of I/O | 744 |
| Number of Pins | 1,152 |
| Package Type | 1152-BBGA, FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.0 V |
| Operating Temperature | 0C to 85C (Industrial) |
| Speed Grade | I3 |
| Internal Frequency | 500 MHz |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP3SE80F1152I3 35 mm x 35 mm Pin Configuration Guide
Pin configuration for EP3SE80F1152I3 (35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152I3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152I3 is suitable for 7 applications: Telecommunications Baseband Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, High-Speed Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing, Industrial Control and Factory Automation, Medical Imaging Back-End Processing.
Telecommunications Baseband Processing
The EP3SE80F1152I3 fits telecom baseband processing because its 80,000 logic elements and 6,843,392 bits of embedded TriMatrix memory deliver the parallel datapath throughput required for channel decoding and modulation. The FCBGA-1152 package exposes 744 user I/O channels, allowing direct interfacing to multiple high-speed ADC/DAC pairs and CPRI/OBSAI links. At I3 industrial speed grade with 500 MHz internal frequency, timing closure for DSP-heavy datapaths is achievable. Designers should pair this FPGA with external DDR2/QDR-II SRAM for packet buffering. Compared with smaller Cyclone parts, the EP3SE80F1152I3 adds DSP blocks that accelerate turbo-decoder and FFT implementations.
Recommended
ASIC Prototyping and Emulation
The EP3SE80F1152I3 is a strong fit for ASIC prototyping because 80,000 logic elements, distributed TriMatrix memory, and 744 user I/O pins provide the capacity needed to map mid-complexity ASIC RTL into FPGA gates with reasonable timing fidelity. The FCBGA-1152 package supports multiple FPGA-to-FPGA bridges for multi-FPGA ASIC prototypes. The I3 industrial speed grade offers predictable timing closure under 0C to 85C, matching typical ASIC verification environments. Designers commonly pair this part with companion FPGAs from the same Stratix III E family to scale prototyping capacity. Quartus II supports Design Partitions that simplify incremental compilation for ASIC emulation flows.
Recommended
Broadcast Video Processing
The EP3SE80F1152I3 supports broadcast video processing because its DSP blocks and 6,843,392 RAM bits deliver the throughput needed for SD/HD/3G-SDI processing, color-space conversion, and frame-rate conversion. The 744 user I/O pins allow multiple SDI links plus parallel video buses to be routed simultaneously. Operating up to 500 MHz internal frequency with I3 industrial speed grade, timing closure for multi-tap video pipelines is realistic. Designers typically instantiate video-over-IP protocols or compression codecs on this part. The FCBGA-1152 package requires a multi-layer PCB with controlled-impedance routing for SDI serializer/deserializer channels.
Recommended
High-Speed Industrial Imaging and Machine Vision
The EP3SE80F1152I3 fits machine vision pipelines where Camera Link, CoaXPress, or GigE Vision interfaces require parallel pixel processing at multi-megapixel resolutions. Its 80K logic elements, 6,843,392 bits of TriMatrix memory, and 744 user I/O pins expose enough bandwidth for several high-speed image sensors simultaneously. The I3 industrial speed grade and 0C to 85C operating temperature suit factory-floor deployments without active cooling. Designers should plan PCB layout with controlled-impedance routing for LVDS pairs. The Quartus II IP library includes Camera Link and CoaXPress reference designs that accelerate integration.
Recommended
Military and Aerospace Signal Processing
The EP3SE80F1152I3 supports defense signal processing workloads where FPGA-based radar, electronic warfare, and SIGINT pipelines demand high logic density and DSP throughput. With 80,000 logic elements and dedicated DSP blocks, this part implements beamforming, FFT, and digital down-conversion chains at the I3 industrial speed grade. Designers must consider the part's 0C to 85C operating range and the obsolete lifecycle when planning long-term defense programs; pairing with newer Arria 10 or Stratix 10 parts is recommended for new designs. Existing defense programs continue to use Stratix III E because of mature design IP libraries and validated tool flows.
Recommended
Industrial Control and Factory Automation
The EP3SE80F1152I3 fits industrial controllers that require deterministic real-time processing for motion control, PLC logic, and high-speed fieldbus interfaces such as EtherCAT, Profinet, or SERCOS. With 80K logic elements, 744 user I/O pins, and TriMatrix memory for fast context switching, the part delivers deterministic cycle times suitable for multi-axis servo control. The I3 industrial speed grade and 0C to 85C operating temperature suit factory-floor deployments. Designers should pair this FPGA with external PHY transceivers and consider ruggedized FCBGA-1152 PCB layouts. Quartus II provides industrial Ethernet IP cores that accelerate factory automation development.
Recommended
Medical Imaging Back-End Processing
The EP3SE80F1152I3 supports medical imaging back-end processing where MRI, CT, and ultrasound pipelines require high-throughput pixel processing and image reconstruction. With 80,000 logic elements, dedicated DSP blocks for FFT and convolution, and 6,843,392 bits of embedded memory for line buffers, the device handles real-time image reconstruction at clinical frame rates. The 744 user I/O pins support multiple high-speed ADC channels and image sensor links. Designers should plan for medical-grade PCB materials and thermal management for the FCBGA-1152 package. Quartus II provides image-processing IP libraries that accelerate DICOM and PACS integration work.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152I3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152C4N | EP3SE80F1152C3N | EP3SE110F1152I3N | EP3SE110F1152I3 | EP3SE50F1152I3N | EP3SE50F1152I3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Logic Elements | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 110,000 (+37.5%) | 50,000 (-37.5%) | 50,000 (-37.5%) |
| Speed Grade | I3 | C4 (commercial) | C3 (commercial) | I3 (industrial) | I3 (industrial) | I3 (industrial) | I3 (industrial) |
| Temperature Range | 0C to 85C (Industrial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Industrial) | 0C to 85C (Industrial) | 0C to 85C (Industrial) | 0C to 85C (Industrial) |
| Total RAM Bits | 6,843,392 | 6,843,392 | 6,843,392 | 9,838,400 (approx +44%) | 9,838,400 (approx +44%) | 4,225,536 (approx -38%) | 4,225,536 (approx -38%) |
| User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Mid-density Stratix III E with 80K LE and 744 user I/O in FCBGA-1152 (vs EP3SE50F1152I3)
- Industrial temperature range with 500 MHz internal frequency (vs EP3SE80F1152C4N)
- Established Stratix III E design ecosystem with Quartus II support (vs Cyclone III EP3C80U484I7)
Design Notes
The FCBGA-1152 package requires a high-density interconnect PCB with microvia (HDI) construction, laser-drilled blind/buried vias, and controlled-impedance routing for high-speed LVDS and differential pairs. Place decoupling capacitors on both top and bottom layers within 100 mils of each power pin to minimize inductance. Use a 1.0 V core supply with separate analog and digital ground planes stitched together under the package with multiple vias to reduce ground bounce.
Estimated: At 80 percent logic utilization and 500 MHz toggle rate, the EP3SE80F1152I3 can dissipate 8-12 W of power. The FCBGA-1152 package has a junction-to-ambient thermal resistance around 12-15 C/W without thermal vias, so a 25x25 mm thermal via array under the package center is required to keep junction temperature below 100 C in still air. Add a heatsink for continuous full-utilization workloads.
Differential I/O pairs (LVDS, DDR2, SERDES) require matched-length routing with skew under 25 ps and impedance tolerance of plus or minus 10 percent. Use the Quartus II pin planner to assign I/O standards, and follow the Stratix III device handbook board design guidelines for via pattern, trace width, and layer stack-up. Series-termination resistors may be required for SSTL and HSTL outputs to dampen reflections.
Do not confuse EP3SE80F1152I3 with EP3SE80F1152I3N - the N suffix indicates lead-free terminal finish only, both are functionally identical. Avoid the -I4 and -I2 speed grades unless your timing analysis specifically requires them, as these may have different power characteristics. The 1152-ball FCBGA package is incompatible with 780-pin FBGAs in the same family; verify the package pin count matches your PCB layout before procurement.
Compliance Information
RoHS compliant per distributor listings; lead-free variant EP3SE80F1152I3N is offered with lead-free terminal finish. Not AEC-Q100 qualified - FPGAs are not typically AEC-Q100 qualified, instead they are qualified to industrial or military temperature standards per the device handbook.
