EP3SE80F780I4 - Stratix III E FPGA 80K LE 780-FCBGA | Intel
MPN: EP3SE80F780I4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2658.36 | $2,658.36 |
| 10 | $2380 | $23,800.00 |
| 100 | $2100 | $210,000.00 |
| 500 | $1850 | $925,000.00 |
| 1,000 | $1620 | $1,620,000.00 |
EP3SE80F780I4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and hardened IP such as transceivers, DSP blocks, and embedded memory. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically above CPLDs in gate count and capability, parallel to ASICs in functionality but with field-reprogrammability. Stratix III E is a high-performance, low-power variant of the Stratix III generation, marketed by Altera (acquired by Intel in 2015) and now sold by Intel under the FPGA Smart Platform brand.
Key features of the EP3SE80F780I4 include 80,000 logic elements, 6,843,392 memory bits, 488 user I/Os, an industrial temperature grade (-40 °C to +100 °C) indicated by the 'I' speed/temperature code, and the speed grade '4' (medium performance). The device exposes multiple PLLs, high-speed transceivers (per Stratix III E family), and dedicated DSP blocks optimized for fixed- and floating-point operations, and supports up to 800 MHz internal clock operation per the 65 nm Stratix III E process generation.
Stratix III E FPGAs use a Programmable Power Technology that dynamically lowers core voltage on inactive blocks, reducing dynamic power up to 40% relative to the prior Stratix II generation. The architecture provides per-LAB clock enable, optional fine-grain power gating, and a multi-track routing fabric that minimizes congestion in high-utilization designs. The EP3SE80F780I4 ships in a flip-chip BGA with a 29 mm x 29 mm body and 1.0 mm ball pitch.
Typical applications include high-throughput DSP pipelines (radar, beamforming, software-defined radio), wireline telecommunications line cards, ASIC prototyping, high-speed serial backplane bridging, and broadcast video processing. The 488 user I/Os also suit parallel memory expansion and high-channel-count data acquisition front-ends.
When designing with this part, plan PCB stack-up for the 1.0 mm BGA pitch and provide adequate decoupling per Intel Stratix III E pin connection guidelines. For new designs, also evaluate the newer Stratix IV/V/10 families for lower power and higher logic density; the EP3SE80F780I4 is best deployed in mature designs or where Stratix III E firmware IP already exists.
This page synthesizes distributor pricing, drop-in FPGA alternatives (including I/C/N temperature and speed grades), and Stratix III E PCB design notes not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for EP3SE80F780I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F780I4 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Logic Elements, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F780I3N
✅ Drop-In✓ In Stock
$2105 / Unit
View Datasheet →EP3SE80F780I3
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3SE80F780C4N
✅ Drop-In✓ In Stock
$1290 / Unit
View Datasheet →EP3SE80F780C4LN
✅ Drop-In✓ In Stock
$138.75 / Unit
View Datasheet →EP3SE110F780I4N
✅ Drop-In✓ In Stock
$1850 / Unit
View Datasheet →EP3SE80F780I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Series | Stratix III (E variant) |
| Manufacturer | Altera (now Intel Programmable Solutions Group) |
| Logic Elements | 80,000 |
| Total Memory Bits | 6,843,392 |
| Number of LABs/CLBs | 3,200 |
| Number of User I/Os | 488 |
| Package | 780-BBGA, FC-FBGA |
| Mounting Type | Surface Mount |
| Process Node | 65 nm |
| Core Voltage | 1.1 V (typical, per Stratix III E family) |
| Operating Temperature | -40 °C to +100 °C (industrial, per 'I' code) |
| Speed Grade | 4 (medium) |
| RoHS Status | Compliant (per distributor listings) |
EP3SE80F780I4 780-bbga, fc-fbga Pin Configuration Guide
Pin configuration for EP3SE80F780I4 (780-bbga, fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F780I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F780I4 is suitable for 6 applications: High-Throughput DSP Pipelines (Radar / Beamforming / SDR), Wireline Telecommunications Line Cards, ASIC Prototyping and Emulation, Broadcast Video Processing and Display Walls, High-Speed Serial Backplane Bridging, Test & Measurement Instrumentation Front-End.
High-Throughput DSP Pipelines (Radar / Beamforming / SDR)
The EP3SE80F780I4 fits DSP-heavy signal-processing pipelines because of its 80,000 logic elements, dedicated DSP blocks, and 6,843,392 bits of embedded memory, which together sustain parallel multi-tap FIR, FFT, and matrix-multiply operations at up to 800 MHz internal clock. Its 488 user I/Os support wide parallel ADC/DAC interfaces and multi-channel data routing. Programmable Power Technology lowers dynamic power by up to 40%, critical in dense compute farms. The device replaces multiple lower-density FPGAs in radar front-ends and software-defined radio baseband chains.
Recommended
Wireline Telecommunications Line Cards
The EP3SE80F780I4 supports line-card designs requiring high serial lane counts, framing, packet classification, and traffic management. Its 488 user I/Os enable multiple SGMII/XAUI uplinks and parallel interface expansion, while the 6.8 Mbit embedded memory absorbs packet bursts without external SRAM access stalls. Industrial temperature grade (-40 °C to +100 °C) supports central-office and outdoor deployments. The 780-FCBGA footprint provides the routing density needed for dense line cards with multiple PHY devices.
Recommended
ASIC Prototyping and Emulation
The EP3SE80F780I4 serves as a viable ASIC prototype/ emulation target because of its 80,000 LE, 6.8 Mbit memory, and 488 user I/Os, which together accommodate partitioned ASIC RTL with realistic timing closure. The 780-FCBGA package supports high-speed transceiver I/O and standard LVDS/SSTL interfaces for ASIC pin-out emulation. Industrial temperature grade allows validation in thermally stressed lab environments. The Stratix III E family supports Synopsys/Cadence synthesis flows directly.
Recommended
Broadcast Video Processing and Display Walls
The EP3SE80F780I4 handles broadcast video processing including SD/HD/3G-SDI bridging, frame buffer composition, and color-space conversion, because its 488 I/Os support multiple video ports and its 6.8 Mbit memory accommodates line/frame buffers on-chip. Speed grade 4 plus industrial temperature grade supports 24/7 broadcast and digital-signage installations. The 780-FCBGA package provides ground isolation for high-speed serial video links. Programmable Power Technology reduces thermal output in tightly packed video walls.
Recommended
High-Speed Serial Backplane Bridging
The EP3SE80F780I4 supports backplane bridging protocols such as Serial RapidIO, PCIe, and Interlaken because of its high user I/O count (488) and on-chip transceiver IP support inherent to the Stratix III E family. Embedded memory and DSP blocks enable protocol-aware flow control and CRC/ECC on-chip. Industrial temperature grade supports industrial-embedded systems. Pin-compatible migration to larger-density variants preserves the backplane investment.
Recommended
Test & Measurement Instrumentation Front-End
The EP3SE80F780I4 fits test and measurement front-ends including logic analyzers, protocol analyzers, and high-channel-count data-acquisition cards, because its 488 I/Os accept many parallel channels and its 65 nm DSP blocks perform on-chip triggering and statistics. Industrial temperature grade supports lab and field-test environments. The 780-FCBGA package integrates into compact PXI/PXIe module footprints with high-density interconnect.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F780I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F780I3N | EP3SE80F780I3 | EP3SE80F780C4N | EP3SE80F780C4LN | EP3SE110F780I4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BBGA, FC-FBGA (1.0 mm pitch) | 780-BBGA, FC-FBGA (1.0 mm pitch) - same | 780-BBGA, FC-FBGA (1.0 mm pitch) - same | 780-BBGA, FC-FBGA (1.0 mm pitch) - same | 780-BBGA, FC-FBGA (1.0 mm pitch) - same | 780-BBGA, FC-FBGA (1.0 mm pitch) - same |
| Logic Elements | 80,000 | 80,000 (same die) | 80,000 (same die) | 80,000 (same die) | 80,000 (same die) | 110,000 (+37.5%) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial (-40 °C to +100 °C) | Industrial (-40 °C to +100 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Industrial (-40 °C to +100 °C) |
| Speed Grade | 4 (medium) | 3 (lower) | 3 (lower) | 4 (same) | 4 (same) | 4 (same) |
| Core Voltage | 1.1 V (typical) | 1.1 V (same family) | 1.1 V (same family) | 1.1 V (same family) | 1.1 V (same family) | 1.1 V (same family) |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Key Differentiators
- Speed grade 4 vs lower speed-grade alternatives within the same die (vs EP3SE80F780I3 / EP3SE80F780I3N)
- Industrial temperature grade for harsh-environment deployment (vs EP3SE80F780C4N / EP3SE80F780C4LN)
- Smaller 80K LE granularity for cost-effective design partitioning (vs EP3SE110F780I4N)
- Lower-density cost-down alternative within the same package (vs EP3SE50F780I4N)
Design Notes
Estimated: The 780-BBGA package uses 1.0 mm ball pitch. PCB stack-up must support microvia (laser-drilled) vias from the BGA pads to internal signal layers. Recommended minimum stack-up: 6-8 layers with 2 signal layers adjacent to the top GND reference. Use via-in-pad with filled/capped vias to minimize inductance on decoupling capacitor connections. Match ball-to-trace escape routing to the FPGA-specific breakout pattern to avoid signal-integrity losses on high-speed I/O.
The EP3SE80F780I4 requires multiple supply rails: VCCINT (~1.1 V core), VCCAUX (auxiliary, typically 2.5 V), VCCPD (I/O pre-driver), and per-bank VCCIO (1.2 V-3.3 V). Place 0.1 µF ceramic decoupling capacitors within 100 mil of every supply pin per Altera/Intel pin-connection guidelines. Bulk decoupling of 100-470 µF per rail is recommended. Use a sequencer or rail-tracking circuit to enforce VCCINT before VCCAUX, per the Stratix III E power-up sequencing specification.
At maximum utilization the Stratix III E 780-FCBGA device can dissipate 5-8 W. Provide at least 1 square inch of unbroken inner copper plane directly under the BGA to spread heat. For industrial applications at full load, attach a small heatsink or heat-spreader lid to keep junction temperature below +100 °C. Theta-JA for the 780-FCBGA depends heavily on PCB layout; the smaller the thermal pad break-up, the lower the effective junction-to-ambient resistance.
Do not assume C-grade (commercial temperature) parts are drop-in replacements for I-grade (industrial) parts. Although pinout is identical, system-level qualification, MTBF calculations, and customer contractual temperature ranges must be re-verified for the commercial temperature variant. Also verify that speed-grade differences (I4 vs I3) are acceptable for the design's critical paths; Quartus Prime timing analysis with the correct device speed-grade model is mandatory before board respin.
Estimated: For high-speed differential pairs routed to the BGA, match within 5 mils of intra-pair length and within 50 mils of inter-pair length per Stratix III E PCB design guidelines. Use 8 mil to 10 mil trace width with 6 mil spacing into a 50 ohm controlled-impedance environment. Avoid routing high-speed signals across plane splits. Maintain 90 ohm differential impedance for LVDS pairs, and confirm with the manufacturer's 3D-EM field-solver for the chosen PCB stack-up.
Compliance Information
RoHS-compliant and lead-free per distributor listings. Industrial temperature grade (-40 °C to +100 °C, 'I' suffix). AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified silicon).
