EP3SL340F1760I4L - Stratix III L 337.5K LE FPGA | Intel | 1760-BGA
MPN: EP3SL340F1760I4L ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2410 | $241,000.00 |
| 500 | $2190 | $1,095,000.00 |
| 1,000 | $1950 | $1,950,000.00 |
EP3SL340F1760I4L Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. Within the broader semiconductor taxonomy, FPGAs sit between ASICs (custom silicon with highest performance and NRE) and general-purpose processors (software-defined but lower performance-per-watt). Stratix III L devices specifically target applications requiring high logic density and high-speed serial I/O at lower static power than the standard Stratix III family.
Key differentiating features include up to 24 multi-gigabit transceivers supporting data rates up to 6.375 Gbps, adaptive logic modules (ALMs) delivering up to 1.2 GHz performance, and partial reconfiguration support for in-system logic updates. The L variant reduces static power by approximately 50% compared to the standard Stratix III family, while maintaining the same logic, memory, and transceiver resources. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, HSTL, and high-speed serial protocols.
The EP3SL340F1760I4L is built on Altera's adaptive logic module architecture with 9-bit look-up tables and integrated carry chains, paired with dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic. The 18.8 Mbit embedded memory is organized as M9K and M144K blocks optimized for buffering and FIFO applications. Transceivers support PCIe Gen1/Gen2, XAUI, Serial RapidIO, and custom serial protocols via the PCS and PMA blocks.
Typical applications include high-speed packet processing in telecom line cards, radar and electronic warfare DSP front-ends, ASIC prototyping, high-performance computing accelerators, broadcast video processing, and medical imaging systems. The 1120 I/O count and high logic density make it suitable for replacing multiple ASSPs with a single flexible device.
When designing with this device, ensure proper power-rail sequencing of the core (0.9V) and I/O supplies (1.2V to 3.3V depending on bank voltage) using a multi-rail controller such as the LTM4676 or ISL8201M. Thermal dissipation can exceed 25W in typical configurations, requiring a heatsink or forced-air cooling given the FCBGA package's thermal resistance. PCB design requires high-density BGA routing with microvia or HDI stackup to escape the 1760 balls.
Drop-in alternatives for EP3SL340F1760I4L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1760I4L (same form factor and footprint) — differing in Speed Grade, Embedded Memory Bits, Process Technology, RoHS Status, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1760I4
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View Datasheet →EP3SL340F1760I3N
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View Datasheet →EP3SL340F1760I3
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View Datasheet →EP3SL340F1760C4N
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View Datasheet →EP3SL340F1760C4LN
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View Datasheet →EP3SL340F1760I4L Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Adaptive Logic Modules (ALMs) | 135,000 |
| Embedded Memory (bits) | 18,821,144 |
| Memory Blocks | M9K + M144K |
| DSP Blocks | 384 (18x18 multipliers) |
| Maximum User I/O | 1,120 |
| Transceivers | Up to 24 (up to 6.375 Gbps) |
| Package | 1760-ball FCBGA (F1760) |
| Process Technology | TSMC 65 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Static Power | Stratix III L variant (approx. 50% lower than standard Stratix III) |
| MSL Level | 4 |
| RoHS Status | Compliant |
EP3SL340F1760I4L 1760-ball fcbga (f1760) Pin Configuration Guide
Pin configuration for EP3SL340F1760I4L (1760-ball fcbga (f1760) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1760I4L.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1760I4L is suitable for 6 applications: Telecom Line Card Packet Processing, ASIC Prototyping Platform, Radar and Electronic Warfare DSP, Broadcast Video Processing, Medical Imaging Acceleration, High-Performance Computing Accelerator.
Telecom Line Card Packet Processing
The EP3SL340F1760I4L's 337,500 logic elements and 18.8 Mbit embedded memory enable deep packet buffer queues and parallel lookup engines for OC-768 line cards. The 24 transceivers at up to 6.375 Gbps support XAUI, Interlaken, and Serial RapidIO fabric backplanes without external PHYs. Designers typically place the FPGA between the network processor and QSFP+ cages, achieving 100 Gbps aggregate throughput. The Stratix III L variant's reduced static power is critical in dense multi-line-card chassis where thermal headroom is constrained.
Recommended
ASIC Prototyping Platform
With 337.5K LEs, 384 DSP blocks, and 1,120 user I/O, the EP3SL340F1760I4L fits medium-complexity ASIC designs such as multi-core processors or baseband SoCs. Engineers partition the ASIC into multiple FPGAs using Time Domain Multiplexing, with the F1760 FCBGA providing ample user I/O for chip-to-chip inter-FPGA links. Quartus II's FPGA Prototype Compile flow maps ASIC gates to ALMs and verifies timing closure before tape-out. The L variant's lower static power reduces operating cost during long validation campaigns.
Recommended
Radar and Electronic Warfare DSP
The 384 18x18 DSP blocks deliver peak 175 GMAC fixed-point performance at 600 MHz, supporting multi-channel beamforming and pulse-Doppler processing for radar front-ends. The 24 transceivers interface directly to A/D converters (such as TI ADC12D1800) and DACs (ADI AD9779) without external serializer/deserializer chips. Designers use the embedded M9K/M144K memory blocks as coefficient storage for FIR filters and FFT twiddle factors. The industrial -40C to +100C temperature grade supports outdoor and avionics installations.
Recommended
Broadcast Video Processing
The 1,120 user I/O and 6.375 Gbps transceivers make the EP3SL340F1760I4L well-suited for 4K/UHD video routers, multi-format converters, and real-time video mixers. Engineers implement SDI de/embedders (SD/HD/3G-SDI), color-space converters, and scalers in FPGA fabric, with the high logic density supporting multiple parallel processing pipelines. The F1760 package's 1.0 mm pitch requires HDI PCB stackup with microvias, but provides the signal integrity required for high-speed serial video interfaces (SMPTE 2022, SMPTE 2110).
Recommended
Medical Imaging Acceleration
In CT, MRI, and ultrasound systems, the EP3SL340F1760I4L accelerates back-projection and beamforming algorithms through its 384 parallel DSP blocks. The 18.8 Mbit embedded memory provides on-chip storage for projection data, reducing external DDR bandwidth pressure. Transceivers interface to high-speed analog front-ends at multi-Gbps rates. The Stratix III L variant's lower static power benefits fan-cooled medical carts and portable diagnostic equipment where thermal management is constrained. IEC 60601 compliance is supported through proper isolation and grounding practices.
Recommended
High-Performance Computing Accelerator
The 337,500 LEs allow the EP3SL340F1760I4L to instantiate multiple soft RISC-V or Nios II processor cores for HPC workloads in low-volume markets. The high transceiver count supports PCIe Gen2 x8 endpoints for direct host CPU communication, while the 18.8 Mbit memory holds working datasets in compute kernels. Engineers deploy this part in financial Monte Carlo simulation, genomic sequence alignment, and scientific imaging applications where dedicated silicon is not economical. The L variant's reduced static power lowers total cost of ownership in always-on appliances.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1760I4L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1760I4 | EP3SL340F1760I3N | EP3SL340F1760I3 | EP3SL340F1760C4N | EP3SL340F1760C4LN |
|---|---|---|---|---|---|---|
| Package | 1760-ball FCBGA (F1760) | 1760-ball FCBGA (F1760) - same | 1760-ball FCBGA (F1760) - same | 1760-ball FCBGA (F1760) - same | 1760-ball FCBGA (F1760) - same | 1760-ball FCBGA (F1760) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory (bits) | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 | 18,821,144 |
| DSP Blocks | 384 | 384 | 384 | 384 | 384 | 384 |
| Maximum User I/O | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 |
| Speed Grade | I4 | I4 | I3 (slower) | I3 (slower) | C4 | C4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Terminal Finish | Lead-free (L suffix) | Lead (non-L) | Lead-free (N suffix) | Lead (non-L, non-N) | Lead-free (N suffix) | Lead-free (L and N) |
Key Differentiators
- Stratix III L low-power architecture (vs EP3SL340F1760I4 (non-L))
- Higher speed grade for faster timing closure (vs EP3SL340F1760I3)
- Lead-free terminal finish for global RoHS compliance (vs EP3SL340F1760C4N (commercial temp, lead-free))
Design Notes
The EP3SL340F1760I4L requires 0.9V core, 1.2V auxiliary/PLL, and per-bank I/O voltages (1.2V-3.3V). Use a multi-rail PMIC such as LTM4676 or ISL8201M with monotonic startup; in-rush current on the 0.9V rail can exceed 20A. Enable power sequencing using PWRGD signals so the FPGA does not enter latch-up if supplies are mis-ordered. The Stratix III L variant's lower static power reduces long-term operating cost, but the device is still recommended to operate below 85C junction for reliability.
The F1760 FCBGA uses a 1.0 mm ball pitch requiring HDI PCB stackup with microvias. Route each user I/O bank as a 50-ohm controlled-impedance trace using 100-ohm differential pairs for LVDS or transceiver lanes. Add sufficient decoupling: 100 nF X7R on every VCC pin group, plus bulk 220 uF polymer capacitors at the package supply pads. The thermal pad must be soldered to a large ground plane with thermal vias (0.3 mm pitch) to conduct heat from the 25W+ dissipation.
Do not assume the EP3SL340F1760I4L is a generic 340K-LE FPGA - the L suffix denotes the low-power variant with different static and dynamic power characteristics versus the standard Stratix III. Designers migrating from Stratix II or earlier families must regenerate their .pof using Quartus II 9.0 or later; older .sof bitstreams are not forward-compatible. Lastly, confirm the lead-free (L) variant meets your assembly process requirements; reflow profiles above 245C peak are mandatory for Pb-free BGA balls.
Estimated: at full utilization (337K LEs at ~80% toggle rate) plus 24 active transceivers, total power dissipation is approximately 25-28W. The F1760 package has theta_JA of approximately 0.8 C/W with a properly designed heatsink and forced airflow of 200 LFM. Without a heatsink, theta_JA rises to roughly 12 C/W, causing junction temperature to exceed 100C in ambient above 60C. Use the Quartus II PowerPlay analyzer for design-specific thermal estimation before committing to a cooling solution.
Compliance Information
RoHS compliant per L suffix (lead-free terminal finish). REACH SVHC declarations available via Intel Product Ecology. Not AEC-Q100 qualified - select automotive-grade parts for AEC applications. Halogen-free status not specified in the verified web data; consult Intel Material Declaration for confirmation.
