EP3SL340F1760C4N - 340K LE Stratix III L FPGA | Intel | 1120 I/O
MPN: EP3SL340F1760C4N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2650 | $26,500.00 |
| 100 | $2350 | $235,000.00 |
| 500 | $2050 | $1,025,000.00 |
| 1,000 | $1820 | $1,820,000.00 |
EP3SL340F1760C4N Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that can be reconfigured by the user after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism and deterministic latency. The Stratix III L family specifically targets logic-rich, memory-intensive applications with a low-power variant of the Stratix III architecture, balancing per-element static power against raw logic density.
Key features of the EP3SL340F1760C4N include 13,500 Logic Array Blocks (LABs) organized around 337,500 logic elements, 1,125 embedded 18x18 multipliers for DSP operations, and multi-gigabit transceivers supporting protocols up to 6.5 Gbps depending on speed grade. The device integrates 1120 general-purpose user I/Os plus high-speed serial I/O and external memory interface logic. Configuration is handled via the standard Stratix III configuration scheme, supporting JTAG, passive serial, fast passive parallel, and Active Serial configuration from an external flash.
Typical applications for this Stratix III L variant include ASIC and ASSP prototyping, high-definition video processing, telecom line-card aggregation, high-throughput signal processing, and test & measurement instrumentation. The 1760-ball FC-FBGA package supports the dense I/O and high-performance signal-integrity requirements of these applications, while the 65 nm process node keeps dynamic dissipation manageable in well-designed thermal envelopes. The 'N' suffix indicates lead-free / Pb-free termination per JEDEC J-STD-609 marking conventions.
When designing with the EP3SL340F1760C4N, plan thermal management using the published theta-JA for the 1760-ball FC-FBGA package - expect active cooling at high toggle rates. Use Intel Quartus II (legacy) or Quartus Prime design software for synthesis, place-and-route, and timing closure; legacy device support is provided in modern Quartus versions through the Cyclone/Stratix legacy support flow. Confirm long-term availability with Intel PSG before committing to new designs, as Stratix III is in mature lifecycle status.
This page synthesizes distributor pricing, verified drop-in alternatives from the Stratix III L family, and practical design notes that complement the official Intel datasheet. Engineers evaluating the EP3SL340F1760C4N should review the supply chain, lead times, and lifecycle status as of 2026-09-09.
Drop-in alternatives for EP3SL340F1760C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1760C4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Embedded Memory Bits, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL340F1760C4LN
β Drop-Inβ In Stock
$15200 / Unit
View Datasheet βEP3SL340F1760C3N
β Drop-Inβ In Stock
$2950 / Unit
View Datasheet βEP3SL340F1760C2N
β Drop-Inπ Reference alternative (not in catalog)
EP3SL340F1760C4L
β Drop-Inβ In Stock
$3100 / Unit
View Datasheet βEP3SL340F1760C4
β Drop-Inβ In Stock
$9750 / Unit
View Datasheet βEP3SL340F1760C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Embedded Memory Bits | 18,822,144 bits |
| Embedded 18x18 Multipliers | 1,125 |
| User I/O Count | 1120 |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 450 MHz |
| Package | 1760-ball FC-FBGA |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free (Pb-Free) | Yes (N suffix per JEDEC J-STD-609) |
| RoHS Status | Compliant (lead-free BGA balls) |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
EP3SL340F1760C4N 1760-ball fc-fbga Pin Configuration Guide
Pin configuration for EP3SL340F1760C4N (1760-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1760C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1760C4N is suitable for 6 applications: ASIC and ASSP Prototyping, High-Throughput DSP and Signal Processing, Telecom Line-Card Aggregation, High-Definition Video Processing, Test and Measurement Instrumentation, Industrial Control and Machine Vision.
ASIC and ASSP Prototyping
The EP3SL340F1760C4N's 337,500 logic elements and 18,822,144 bits of embedded memory make it a strong fit for ASIC and ASSP prototyping, where the design must fit on a single FPGA before tape-out. According to the Intel Stratix III Device Handbook, the L family provides the per-element static-power efficiency needed for long burn-in sessions on prototype boards. The 1760-ball FC-FBGA package exposes 1120 user I/Os, enough to break out large ASICs with parallel external memory busses. Designers using Quartus II can target this device for ASIC emulation and use the same pin assignments for verification. Source: Intel Stratix III Device Handbook, Volume 1.
Recommended
High-Throughput DSP and Signal Processing
The EP3SL340F1760C4N integrates 1,125 embedded 18x18 multipliers organized in DSP blocks, supporting high-throughput DSP pipelines for radar, software-defined radio, and baseband processing. According to Intel documentation, each DSP block can be configured for 9-bit, 18-bit, or 36-bit word widths, and multiple blocks can be cascaded for higher-precision filter chains. The Stratix III L family balances DSP throughput against static leakage for cooler operation in rack-mounted signal-processing chassis. Use the 450 MHz internal fabric clock and the 1120 user I/Os to feed wide ADC/DAC converter arrays.
Recommended
Telecom Line-Card Aggregation
The EP3SL340F1760C4N is well-suited for telecom line-card aggregation, where multi-gigabit serial transceivers and large packet buffers converge on a single fabric device. With 18,822,144 bits of embedded memory, the device can buffer line-rate packets without external SRAM, simplifying board layout and lowering BOM cost. The 1120 user I/Os of the 1760-ball FC-FBGA package accommodate multiple SFP+/QSFP cages, network processors, and external memory channels. Stratix III L low-static-power design helps meet NEBS thermal budgets in central-office racks.
Recommended
High-Definition Video Processing
The EP3SL340F1760C4N's logic and memory capacity suits high-definition video processing pipelines such as broadcast switchers, multi-screen video walls, and real-time video format transcoders. The 337,500 LEs accommodate wide parallel datapaths and frame-store controllers, while 18 Mbits of embedded memory buffer line/frame data without external SRAM. The 1120 user I/Os of the F1760 package support HDMI/DPI/DisplayPort aggregation with auxiliary audio and control channels. Quartus II IP cores for video processing accelerate time-to-market versus custom RTL.
Recommended
Test and Measurement Instrumentation
The EP3SL340F1760C4N's combination of high logic density, large embedded memory, and 1120 user I/Os makes it appropriate for test and measurement instruments such as protocol analyzers, BERT testers, and logic-analyzer backends. According to the Stratix III Device Handbook, the L variant's low static power supports long-duration bench testing without active airflow, while the device's high toggle rate enables real-time stimulus generation. Pair the FPGA with high-speed ADCs and DACs via the abundant user I/Os for mixed-signal test platforms.
Recommended
Industrial Control and Machine Vision
The EP3SL340F1760C4N's logic capacity, 1,125 multipliers, and 1120 user I/Os serve multi-axis machine-vision controllers and high-channel-count industrial automation systems. The 18 Mbits of embedded memory buffer image lines in machine-vision pipelines, while the DSP blocks accelerate image preprocessing (filtering, edge detection) before host transfer. According to Intel, the Stratix III L family meets industrial thermal requirements when properly heatsinked. Pair the FPGA with GigE Vision or CoaXPress interfaces via FPGA IP.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1760C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1760C4LN | EP3SL340F1760C3N | EP3SL340F1760C2N | EP3SL340F1760C4L | EP3SL340F1760C4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FC-FBGA | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Speed Grade | C4 | C4 | C3 (faster) | C2 (fastest) | C4 | C4 |
| Embedded Memory Bits | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| Embedded 18x18 Multipliers | 1,125 | 1,125 | 1,125 | 1,125 | 1,125 | 1,125 |
| User I/O Count | 1120 | 1120 | 1120 | 1120 | 1120 | 1120 |
| Lead-Free Suffix | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Optional (L suffix) | No (no N suffix) |
Key Differentiators
- Highest logic density in Stratix III L family (vs EP3SL200F1760C4N)
- More user I/Os than smaller-package sibling (vs EP3SL340F1517C4N)
- More logic and memory than E-family counterpart (vs EP3SE260F1152C4N)
Design Notes
The 1760-ball FC-FBGA package has a published theta-JA that varies with PCB copper-pour area and airflow; in still air at 0 CFM, junction temperature rises can exceed 50 C/W without a heatsink. Estimated: at 25 W dissipation in still air on a 4-layer board with 1 oz copper, expect roughly 45-55 C junction rise. Active cooling or a high-performance thermal interface material is required for sustained high utilization. Source: Intel Stratix III Device Handbook thermal chapter.
Use Intel's published 1760-ball FC-FBGA land-pattern and breakout recommendations - via-in-pad with filled and capped vias is recommended to maintain package coplanarity and signal integrity for high-speed serial links. Decoupling must follow the Stratix III PDN guide: place 0402-size 0.1 uF and 0.01 uF capacitors within 100 mil of each power pin. Differential pairs (transceivers, DDR) must be length-matched within the tolerance specified in Quartus II pin-planner reports.
Do not confuse Stratix III L (low-power, EP3SL) with Stratix III E (enhanced, EP3SE) - the L family has lower DSP and transceiver density for the same logic count. Do not assume C4 is faster than C3 - Intel speed-grade numbering runs C2 (fastest) -> C3 -> C4 -> C5 (slowest). Confirm voltage-rail sequencing per the Stratix III Power Management Guide; failure to sequence POR and auxiliary rails can latch-up the device.
Place configuration flash within 4 inches of the FPGA to meet fast passive parallel timing; longer traces cause configuration failures at high VCC ramp rates. Use JTAG chain ordering that puts the EP3SL340F1760C4N as the first device in the chain so debugging is not blocked by a failed downstream device. Reserve MSEL pins to the correct mode per the configuration scheme chosen (AS, PS, FPP, JTAG).
Compliance Information
RoHS compliant per N suffix (JEDEC J-STD-609 lead-free marking). Not AEC-Q100 qualified - this is a commercial-grade FPGA. Halogen-free status not explicitly listed in the verified data; consult the Intel material declaration for definitive confirmation. Conflict-minerals compliance per Intel corporate policy.
