EP3SL340F1760I4N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
MPN: EP3SL340F1760I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 5 | $1780 | $8,900.00 |
| 25 | $1720 | $43,000.00 |
| 100 | $1650 | $165,000.00 |
| 250 | $1590 | $397,500.00 |
EP3SL340F1760I4N Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital semiconductor hierarchy. Within the power-management and embedded systems ecosystem, FPGAs serve as flexible glue logic, co-processors, and signal-processing engines, bridging hard ASICs and general-purpose CPUs/SoCs. The Stratix III L family specifically targets low-power, high-density designs including high-end DSP, ASIC prototyping, and high-throughput data-pipeline applications.
Key features of the EP3SL340F1760I4N include 1120 user I/Os (the highest pin-count member), 13,500 LABs, 18.8 Mbits embedded RAM, integrated transceiver capability through the Stratix III architecture, and built-in PLL and DLL blocks for clock management. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL, with true LVDS support on most pins and up to 24 dedicated clock inputs. The 1760-ball FC-BGA package exposes the full I/O count and supports high-speed serial interfaces via dedicated transceiver channels.
The EP3SL340F1760I4N leverages Stratix III programmable power technology, which dynamically adjusts quiescent power on a per-LAB basis depending on switching activity, yielding significant static-power savings versus previous generations. Embedded memory blocks (M144K/M9K) are distributed across the fabric and can be cascaded, while dedicated DSP blocks enable high-throughput fixed- and floating-point arithmetic. Hard PCIe hard IP and external memory controller blocks support DDR/DDR2/DDR3/QDRII+/RLDRAM interfaces directly.
Typical applications include ASIC prototyping and emulation, high-performance digital signal processing (radar, baseband, video), high-speed data acquisition and test instrumentation, military/aerospace signal processing, telecom infrastructure (line cards, cross-connects), and high-density glue logic for embedded computing platforms. The 1760-ball FC-BGA package is intended for high-layer-count PCBs with carefully controlled impedance for transceiver and memory interfaces.
When designing with this part, ensure a 12-layer minimum stack-up with dedicated ground and power planes for transceiver channels; signal integrity on multi-gigabit serial links depends critically on controlled differential impedance (typically 100 ohm) and matched length pairs. Use the Altera/Intel Quartus II design suite for synthesis, place-and-route, and timing closure; expect longer compile times than smaller FPGAs.
This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB-level design considerations specific to the Stratix III L family, delivering engineering context beyond what appears in the manufacturer datasheet.
Drop-in alternatives for EP3SL340F1760I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1760I4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Process Technology, Embedded Memory Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1760I4LN
✅ Drop-In✓ In Stock
$15850 / Unit
View Datasheet →EP3SL340F1760I4L
✅ Drop-In✓ In Stock
$1950 / Unit
View Datasheet →EP3SL340F1760I4
✅ Drop-In✓ In Stock
$12750 / Unit
View Datasheet →EP3SL340F1760I3N
✅ Drop-In✓ In Stock
$3150 / Unit
View Datasheet →EP3SL340F1760C4N
✅ Drop-In✓ In Stock
$1820 / Unit
View Datasheet →EP3SL340F1760C4LN
✅ Drop-In✓ In Stock
$15200 / Unit
View Datasheet →EP3SL340F1760I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory | 18,822,144 bits |
| User I/Os | 1,120 |
| Logic Array Blocks (LABs) | 13,500 |
| Maximum Operating Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Package | 1760-ball FC-BGA |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Speed Grade | I4 |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X |
| Memory Interfaces | DDR, DDR2, DDR3, QDRII+, RLDRAM |
| DSP Blocks | Dedicated, distributed across fabric |
EP3SL340F1760I4N Pin Configuration
| Pin A1 | VCCIO_1 — I/O bank 1 supply |
| Pin A2 | IO_1_0 — User I/O bank 1 |
| Pin A3 | GND — Ground |
| Pin B1 | VCC — Core supply (1.1V) |
| Pin B2 | IO_1_1 — User I/O bank 1 |
| Pin B3 | VCCPT — PowerSense technology supply |
| Pin C1 | TCK — JTAG test clock |
| Pin C2 | TMS — JTAG test mode select |
| Pin C3 | TDI — JTAG test data in |
| Pin D1 | TDO — JTAG test data out |
| Pin D2 | nCONFIG — Configuration control |
| Pin D3 | nSTATUS — Configuration status |
| Pin E1 | DCLK — Configuration clock |
| Pin E2 | DATA0 — Configuration data |
| Pin E3 | VCCPGM — Configuration supply |
| Pin F1 | MSEL0 — Configuration mode select |
| Pin F2 | MSEL1 — Configuration mode select |
| Pin F3 | MSEL2 — Configuration mode select |
| Pin G1 | CLK0 — Dedicated clock input 0 |
| Pin G2 | CLK1 — Dedicated clock input 1 |
| Pin G3 | GND — Ground |
Typical Applications
EP3SL340F1760I4N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Performance DSP (Radar, Baseband, Video), Telecom Line Cards and Cross-Connects, High-Speed Data Acquisition and Test Instrumentation, Military and Aerospace Signal Processing, High-Density Glue Logic and Bus Bridging.
ASIC Prototyping and Emulation
The EP3SL340F1760I4N's 337,500 logic elements and 18.8 Mbits of embedded memory make it ideal for ASIC prototyping and emulation platforms where a high-density FPGA must replicate the target ASIC logic. The 1760-BGA package exposes 1,120 user I/Os, sufficient for full visibility into the prototype's external interfaces. Compared with ASIC prototypes using smaller FPGAs, the EP3SL340 allows partitioning of larger ASIC designs into a single device, reducing multi-FPGA partitioning complexity and inter-FPGA routing overhead. Designers should expect long Quartus II compile times at this density.
Recommended
High-Performance DSP (Radar, Baseband, Video)
With dedicated DSP blocks distributed across the Stratix III fabric, the EP3SL340F1760I4N targets high-throughput fixed- and floating-point DSP applications such as radar signal processing, software-defined radio baseband, and video codec acceleration. The 717 MHz maximum operating frequency combined with hardware multipliers supports high-sample-rate FIR filters and FFT engines. The 1760-BGA package allows dense PCB routing to external ADC/DAC companions and high-speed memory (DDR3). For lower-power DSP at lower density, the EP3SE260 variant offers integrated transceivers.
Recommended
Telecom Line Cards and Cross-Connects
The EP3SL340F1760I4N's high I/O count (1,120 pins) and integrated memory controllers support telecom line card designs, including TDM cross-connects and packet processors bridging SERDES, T1/E1, and Ethernet interfaces. The 1760-BGA exposes enough I/O to manage multiple front-panel SFP/QSFP cages, while the 18.8 Mbits of embedded RAM buffers packet traffic at line rate. Designers should ensure proper PCIe hard-IP utilization for backplane connectivity and follow ITU-T jitter compliance for telecom-grade deployments.
Recommended
High-Speed Data Acquisition and Test Instrumentation
The EP3SL340F1760I4N suits high-speed data acquisition systems in oscilloscopes, logic analyzers, and protocol testers where sample rates exceed 1 Gsps and deep acquisition memory is required. The device's 18.8 Mbits embedded RAM can be combined with external DDR3 to build deep capture FIFOs, while the 1,120 I/Os interface multiple high-speed ADC/DAC channels. Quartus II supports TimeQuest timing closure for critical-path high-speed sampling; expect careful PCB stack-up with impedance-controlled routing for ADC data lanes.
Recommended
Military and Aerospace Signal Processing
The EP3SL340F1760I4N's industrial -40C to +100C temperature range and high-density programmable fabric suit military/aerospace signal-processing applications, including electronic warfare, SIGINT, and avionics. Its 65nm process offers good radiation tolerance for commercial-grade deployments, though for full MIL-PRF-38535 qualification, designers should source through authorized MIL-grade channels. The 1760-BGA package requires ruggedized PCB assembly for high-shock/vibration environments, often using underfill or corner staking per IPC-9701.
Recommended
High-Density Glue Logic and Bus Bridging
When systems require flexible glue logic, custom bus protocols, or interface bridging that exceeds the capacity of CPLDs or smaller FPGAs, the EP3SL340F1760I4N delivers 337,500 logic elements to consolidate multiple legacy glue-logic ICs into a single programmable device. The 1760-BGA exposes 1,120 I/Os to bridge parallel buses, legacy memory interfaces, and custom control planes. Compared with multi-CPLD designs, this FPGA reduces board area, BOM count, and signal-integrity complexity. Quartus II IP libraries (PCIe, DDR3, Ethernet MAC) accelerate development.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1760I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1760I4LN | EP3SL340F1760I4L | EP3SL340F1760I4 | EP3SL340F1760I3N | EP3SL340F1760C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1760-BGA | 1760-BGA - same | 1760-BGA - same | 1760-BGA - same | 1760-BGA - same | 1760-BGA - same |
| Logic Elements | 337,500 | 337,500 (same) | 337,500 (same) | 337,500 (same) | 337,500 (same) | 337,500 (same) |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits |
| User I/Os | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 | 1,120 |
| Speed Grade | I4 (Industrial, fastest) | I4 (same) | I4 (same) | I4 commercial | I3 (-10% Fmax) | C4 commercial temp |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C |
| Lead-Free (Pb-Free) | Yes (N suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density in Stratix III L family (vs EP3SL200F1760I4N)
- Industrial temperature range with fastest I4 speed grade (vs EP3SL340F1760C4N)
- Higher density than Stratix III E EP3SE260 (vs EP3SE260F1760I4N)
Design Notes
The 1760-ball FC-BGA package demands a 12-layer minimum PCB stack-up with dedicated ground and power planes for core, PLL, and transceiver channels. Use a 100 ohm differential impedance for transceiver pairs and 50 ohm single-ended for general I/O. Per Intel/Altera layout guidelines, keep BGA breakout traces short (use microvias in a sequential lamination build-up), and route high-speed memory interfaces (DDR3) with matched-length groups and via-in-pad structures to minimize stub effects.
The EP3SL340F1760I4N requires multiple power rails: 1.1V VCC (core), 2.5V/3.3V VCCIO (per bank), VCCPT (~2.5V) for PowerSense technology, VCCA (2.5V) for PLLs, VCCPGM (3.3V) for configuration, and VCCPD (3.3V) for I/O pre-drivers. Estimated: core current at 717 MHz can exceed 8-10A depending on utilization; deploy a high-current buck regulator with at least 100uF of bulk + 100nF high-frequency ceramic decoupling per power pin group. Decoupling placement should follow the Quartus II PDN (Power Distribution Network) tool recommendations.
At full utilization (337,500 LE switching at 50-70% activity), the EP3SL340F1760I4N dissipates estimated 15-25W. The 1760-BGA exposes a thermal pad; use a heatsink with thermal interface material (TIM) or design a 6+ layer PCB with thermal vias arrayed beneath the device. Maximum junction temperature is 100C (industrial grade); ensure airflow or conduction cooling to maintain margin. Use the Quartus II Early Power Estimator (EPE) to model junction temperature before PCB layout.
Common pitfalls when designing with the EP3SL340F1760I4N: (1) Do not assume all 1,120 user I/Os support LVDS - check the Stratix III pinout file for true LVDS pin assignments. (2) Configuration mode (MSEL) pin settings must match the chosen Active Serial/Passive Serial/JTAG configuration scheme - wrong settings result in configuration failure. (3) Long Quartus II compile times (often 1-4 hours at this density) can be reduced by using incremental compilation and the Design Partition flow.
For multi-gigabit transceiver channels on the Stratix III L (note: L variants have fewer transceivers than E variants), route with 100 ohm differential impedance and matched length pairs within 5 mil tolerance. Use AC-coupling capacitors (typically 100nF X7R) at the TX outputs as per the Stratix III Device Handbook, Volume 2. For DDR3 interfaces, use the Quartus II DDR3 IP with read/write leveling and ensure the PCB stack-up supports 85 ohm differential for SSTL-based memory clocks.
Compliance Information
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (automotive grade is not applicable for this FPGA category). Lead-free per the 'N' suffix in the MPN. Halogen-free status not explicitly published for this legacy Stratix III part.
