EP3SL340F1760I4LN - 337500-Cell Stratix III L FPGA, FCBGA-1760
MPN: EP3SL340F1760I4LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19846.8 | $19,846.80 |
| 5 | $18900 | $94,500.00 |
| 10 | $17900 | $179,000.00 |
| 25 | $16800 | $420,000.00 |
| 50 | $15850 | $792,500.00 |
EP3SL340F1760I4LN Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, memory, and hardened IP blocks that can be re-programmed to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy below application-specific standard products (ASSPs) and above discrete logic ICs, and they are widely used for high-throughput parallel processing, hardware acceleration, and rapid prototyping. The Stratix III family specifically targets high-performance DSP, memory-rich, and transceiver-based designs.
Key features include 337,500 logic elements, 13,500 Logic Array Blocks (LABs), 18,822,144 bits of embedded memory, 1120 user I/O pins, and an integrated Adaptive Logic Module (ALM) architecture. The "L" designation indicates the lower-power variant of Stratix III with reduced static power versus the base EP3S family. The package exposes a flip-chip BGA land pattern with 1760 balls across the substrate, requiring careful PCB design with controlled-impedance routing and BGA breakout fan-out.
Architecturally, the EP3SL340F1760I4LN combines 9-input fracturable ALMs with M9K/M144K memory blocks, variable-precision DSP blocks (up to 18x18 multipliers), and PLL-based clock management. The high logic and memory ratio makes it particularly suited to memory-mapped processing pipelines and large buffer-based DSP functions, where on-chip storage reduces external memory bandwidth bottlenecks.
Typical applications include high-end telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcast infrastructure, ASIC prototyping, and high-throughput image processing. The combination of 18 Mbits of embedded memory and 1120 I/O pins allows direct interfacing with DDR2/DDR3 SDRAM, QDRII SRAM, and parallel ADC/DAC devices commonly used in these designs.
When designing with this part, ensure the PCB uses microvia stack-ups compatible with 1.0 mm pitch BGA escape routing, and provide sufficient decoupling per Altera's Stratix III pin connection guidelines. The I4LN suffix indicates the industrial temperature grade (-40C to +100C), 1760-ball FCBGA package, and lead-free / Pb-free finish compliant with modern environmental directives.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalogue, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SL340F1760I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1760I4LN (same form factor and footprint) — differing in Speed Grade, Embedded Memory Bits, Process Technology, RoHS Status, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1760I4L
✅ Drop-In✓ In Stock
$1950 / Unit
View Datasheet →EP3SL340F1760I4
✅ Drop-In✓ In Stock
$12750 / Unit
View Datasheet →EP3SL340F1760I3N
✅ Drop-In✓ In Stock
$3150 / Unit
View Datasheet →EP3SL340F1760I3
✅ Drop-In✓ In Stock
$1450 / Unit
View Datasheet →EP3SL340F1760C4N
✅ Drop-In✓ In Stock
$1820 / Unit
View Datasheet →EP3SL340F1760C4LN
✅ Drop-In✓ In Stock
$15200 / Unit
View Datasheet →EP3SL340F1760I4LN Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Logic Array Blocks (LABs) | 13,500 |
| Number of I/O | 1120 |
| Embedded Memory Bits | 18,822,144 |
| Operating Frequency (Max) | 375 MHz |
| Core Voltage | 0.9 V |
| Process Technology | 65 nm CMOS |
| Package Type | 1760-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Lead Free | Yes |
| RoHS Status | Compliant |
| Number of Pins | 1760 |
| Supplier Device Package | 1760-BGA |
EP3SL340F1760I4LN 1760-bga Pin Configuration Guide
Pin configuration for EP3SL340F1760I4LN (1760-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1760I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1760I4LN is suitable for 6 applications: Telecommunications Line Cards, Software-Defined Radio Baseband, ASIC Prototyping, Video Broadcast Infrastructure, High-Throughput Image Processing, Industrial Test & Measurement.
Telecommunications Line Cards
The EP3SL340F1760I4LN fits telecom line-card designs because its 337,500 logic elements and 18,822,144 embedded memory bits handle multi-channel packet processing and traffic-management queues. Its 1120 user I/O pins allow direct interfacing to multiple SFI/SPI lanes, external DDR2/DDR3 SDRAM, and QDRII SRAM without glue logic. The Stratix III L family provides hardened SERDES blocks and PLLs needed for clock-data recovery on backplane links. Placed on a baseboard with controlled-impedance differential routing, the FPGA processes ingress traffic at line rate while dissipating lower static power than the base Stratix III family.
Recommended
Software-Defined Radio Baseband
The EP3SL340F1760I4LN is well suited to SDR baseband processing because 18 Mbits of embedded memory buffer I/Q sample streams while 337k LEs implement parallel DDC/DUC paths. Its 1120 user I/O pins mate directly to high-speed ADC/DAC devices used in SDR front-ends, and integrated DSP blocks perform 18x18 multiplications for FIR filtering. Industrial temperature grade -40C to +100C allows deployment in outdoor base-station enclosures. The 65 nm process balances performance against leakage, an important factor in continuously-running baseband processors.
Recommended
ASIC Prototyping
The EP3SL340F1760I4LN serves ASIC prototyping because 337,500 logic elements approximate mid-size ASIC gate counts and 1120 user I/O pins map to a wide range of peripheral interfaces. Quartus II software supports incremental compile flows that map ASIC RTL blocks to physical FPGA regions. The 1760-ball FCBGA exposes enough pins to break out multiple DDR channels plus all peripheral buses simultaneously. Industrial temperature grading is convenient when the prototype must run in target environment chambers.
Recommended
Video Broadcast Infrastructure
The EP3SL340F1760I4LN handles video broadcast processing because its memory bandwidth supports uncompressed HD/4K frame buffers and its 337k LEs implement multi-stream codec pipelines. The 1120 I/O pins drive SDI, HDMI, and DisplayPort interfaces through external PHY devices. Embedded DSP blocks accelerate motion-estimation and deinterlacing kernels. Industrial temperature grade ensures 24/7 operation in headend equipment racks.
Recommended
High-Throughput Image Processing
The EP3SL340F1760I4LN accelerates image-processing pipelines because 337k LEs implement SIMD pixel processors and 18 Mbits of embedded memory hold line buffers and lookup tables. Integrated DSP blocks perform convolution and morphological operations at line rate. The 1120 user I/O pins accept multiple camera sensor lanes (LVDS/MIPI via bridge) and drive display outputs. The 65 nm Stratix III L architecture delivers this performance with lower static power than the standard Stratix III family.
Recommended
Industrial Test & Measurement
The EP3SL340F1760I4LN fits ATE and T&M equipment because 337k LEs implement parallel stimulus/response engines and 1120 I/O pins drive hundreds of synchronized channels. On-chip memory stores waveform tables, and DSP blocks perform FFT-based spectrum analysis. Industrial -40C to +100C rating supports factory-floor and outdoor installations. The lead-free FCBGA package is compatible with modern environmental directives for global equipment shipments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1760I4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1760I4L | EP3SL340F1760I4 | EP3SL340F1760I3N | EP3SL340F1760I3 | EP3SL340F1760C4N |
|---|---|---|---|---|---|---|
| Package | 1760-BBGA FCBGA | 1760-BBGA FCBGA - same | 1760-BBGA FCBGA - same | 1760-BBGA FCBGA - same | 1760-BBGA FCBGA - same | 1760-BBGA FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory Bits | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| User I/O Count | 1120 | 1120 | 1120 | 1120 | 1120 | 1120 |
| Speed Grade | I4 (fastest) | I4 - same | I4 - same | I3 - lower speed | I3 - lower speed | C4 - commercial temp |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) |
| Lead-Free (LN suffix) | Yes (Pb-free) | Varies by carrier code | Varies | Yes (Pb-free) | Varies | Yes (Pb-free) |
| Approximate Unit Price (qty 1) | $19,846.80 | Similar (~$19k) | Similar (~$19k) | Lower (~$17-18k) | Lower (~$17-18k) | Lower (~$16-17k) |
Key Differentiators
- Highest-density Stratix III L FPGA with 337,500 logic elements in the 1760-ball FCBGA package (vs EP3SL200F1517I4N)
- Lowest-power Stratix III variant with full industrial temperature range (vs EP3SL200F1760I4N)
- Wide sourcing flexibility via drop-in speed-grade and temperature-grade alternatives (vs EP3SL340F1760I3N)
Design Notes
The 1760-ball FCBGA package requires a 1.0 mm pitch BGA escape strategy. Recommended stack-up uses laser-drilled microvias for the top layer and staggered vias for inner layers, with a minimum 8-layer PCB to maintain signal integrity on the 1120 user I/O pins. Follow Altera's Stratix III pin connection guidelines for unused-pin termination, differential-pair routing rules, and decoupling capacitor placement.
Estimated: at typical Stratix III L utilization (~60% logic toggling), junction temperature may approach 85C with a 0.9 V core and ambient of 25C. Provide a thermal pad area on the PCB top layer with at least 16 thermal vias to inner copper planes. Industrial temperature grade ensures operation to +100C junction with proper thermal management.
The EP3SL340F1760I4LN requires multiple power rails: 0.9 V core, 1.1 V/1.2 V PLLs, 1.5 V/1.8 V/2.5 V/3.3 V I/O banks, and auxiliary voltages. Use a dedicated sequencer (such as the Altera-supported PowerTree controller) to enforce Altera's recommended power-up sequence. Decoupling follows the Stratix III handbook: bulk capacitors per rail plus 0.1 uF and 0.01 uF ceramics adjacent to each power pin.
Do not assume the I3 speed grade is freely interchangeable with I4: timing closure may fail on critical paths above ~300 MHz. The C4 commercial grade is not interchangeable for industrial deployments exceeding 85C ambient. When migrating between variants, re-run Quartus II timing analysis across all corners. Verify JTAG, configuration, and clock pin assignments remain identical across the chosen drop-in alternative.
Compliance Information
Lead-free finish (LN suffix) per Altera's product page. RoHS compliance verified via distributor listings. AEC-Q100 is not applicable for FPGAs of this density; industrial temperature grade I4 (-40C to +100C) covers most non-automotive applications.
