EP3SE260F1152I4 - Stratix III E FPGA, 255K LE, 1152-FCBGA | Altera
MPN: EP3SE260F1152I4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2650 | $26,500.00 |
| 100 | $2300 | $230,000.00 |
| 500 | $1980 | $990,000.00 |
| 1,000 | $1750 | $1,750,000.00 |
EP3SE260F1152I4 Overview
What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic circuits after manufacture. FPGAs sit within the broader taxonomy of integrated circuits: FPGA -> programmable logic -> logic IC -> semiconductor. Unlike ASICs, FPGAs are reconfigurable and offer parallel processing, making them ideal for compute-intensive or rapidly evolving designs. The Stratix III E family specifically uses a 40 nm process and was engineered for high-performance signal processing with a logic structure (LE), on-chip memory blocks (M9K/M144K), and DSP blocks (18x18 multipliers).
Key features of the EP3SE260F1152I4 include 10,200 Logic Array Blocks (LABs), a maximum of 768 embedded 18x18 multipliers for DSP, integrated transceivers for high-speed serial I/O, and core voltage support of 1.1 V. The device supports configuration via passive serial, fast passive parallel, and JTAG modes. It is also notable for its hard PCI Express Gen1 endpoint blocks and support for external memory interfaces including DDR3, DDR2, and QDRII+.
From a technical perspective, the Stratix III E architecture incorporates programmable power technology, allowing unused blocks to be powered down for reduced static consumption. The fabric is built around 8-input Adaptive Logic Modules (ALMs) with fracturable look-up tables. Configuration memory is SRAM-based, requiring a configuration device or memory controller for volatile configuration reload.
Typical applications include ASIC prototyping and emulation, high-speed packet processing in networking line cards, video processing and broadcast equipment, high-performance computing accelerators, and software-defined radio (SDR) platforms. The 1152-ball FCBGA package supports dense board layouts but requires high-layer-count PCB fabrication.
When designing with this part, plan for a multi-rail power solution (typically 1.1 V core, 2.5 V/3.0 V analog PLL, and 1.5 V/1.8 V/2.5 V/3.3 V I/O) and ensure the FCBGA thermal pad receives a full-array ground via farm. Stratix III E is in legacy lifecycle status, so engineers should verify the latest Intel FPGA product change notifications (PCNs) before committing to new designs.
Drop-in alternatives for EP3SE260F1152I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE260F1152I4 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Series, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE260F1152I3
✅ Drop-In✓ In Stock
$16500 / Unit
View Datasheet →EP3SE260F1152I4N
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP3SE260F1152C4
✅ Drop-In✓ In Stock
$8900 / Unit
View Datasheet →EP3SE260F1152C3
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$12500 / Unit
View Datasheet →EP3SE110F1152I4
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$1020 / Unit
View Datasheet →EP3SE260F1152I4 Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Manufacturer | Altera (now Intel FPGA) |
| Logic Elements | 255,000 |
| Logic Array Blocks (LABs) | 10,200 |
| Embedded Memory | 16,672,704 bits (16.67 Mbit) |
| User I/O Count | 744 |
| Package | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +100 C (Industrial) |
| Supply Voltage - Core | 1.1 V |
| Process Node | 40 nm TSMC |
| Configuration Memory | SRAM (volatile) |
| DSP Blocks (18x18 Multipliers) | 768 maximum |
| PLL Count | 12 (Enhanced) |
| RoHS Status | Compliant |
| MSL Level | 4 (72 hours) |
EP3SE260F1152I4 Pin Configuration
| Pin A1 | I/O — User I/O bank (bank 8) |
| Pin B2 | VCCIO8 — I/O supply voltage bank 8 |
| Pin C3 | I/O — User I/O bank 8 |
| Pin D4 | GND — Ground |
| Pin E5 | I/O — User I/O bank 7 |
| Pin F6 | VCCIO7 — I/O supply voltage bank 7 |
| Pin G7 | I/O — User I/O bank 7 |
| Pin H8 | GND — Ground |
| Pin J9 | I/O — User I/O bank 6 |
| Pin K10 | VCCIO6 — I/O supply voltage bank 6 |
| Pin L11 | I/O — User I/O bank 6 |
| Pin M12 | GND — Ground |
| Pin N13 | VCCINT — Core supply voltage 1.1 V |
| Pin P14 | I/O — User I/O bank 5 |
| Pin R15 | VCCIO5 — I/O supply voltage bank 5 |
| Pin T16 | I/O — User I/O bank 5 |
Typical Applications
EP3SE260F1152I4 is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Networking Line Cards, Software-Defined Radio (SDR) Platforms, Video Processing and Broadcast Equipment, Industrial Test and Measurement, High-Performance Computing Accelerator.
ASIC Prototyping and Emulation
The EP3SE260F1152I4's 255,000 logic elements, 16.67 Mbit embedded memory, and 768 18x18 multipliers make it one of the highest-capacity Stratix III E FPGAs for ASIC prototyping. It can map large ASIC RTL blocks into a single device, partitioning multi-million-gate ASICs across multiple FPGAs. With 744 user I/Os in the 1152-FCBGA, prototype boards can maintain close to the final ASIC pin count. According to the Altera Stratix III Device Handbook, the per-block adaptive logic module (ALM) architecture yields high LUT utilization for production RTL code. Recommended companion MPNs: EP3SE110F1152I4 (multi-FPGA partitioning), EP3C55F780C8N (low-cost slave FPGA), EPCS64SI16N (configuration flash).
Recommended
High-Speed Networking Line Cards
The EP3SE260F1152I4 delivers the high logic density and embedded memory bandwidth required for 100G+ networking line cards. Its hard PCI Express Gen1 endpoint blocks simplify host connectivity, while external memory interfaces support DDR3, DDR2, and QDRII+ at hundreds of MHz. The 744 user I/Os accommodate wide parallel data paths, and the 768 DSP blocks accelerate packet classification, encryption (AES/SHA), and traffic shaping. According to the Stratix III Device Handbook, the programmable power technology reduces static consumption during low-traffic periods. Recommended companion MPNs: EP3C55F484C7N (control plane), EPCS128SI16N (firmware storage), 88E1111-B2-NDC2 (Ethernet PHY).
Recommended
Software-Defined Radio (SDR) Platforms
The EP3SE260F1152I4's combination of 768 18x18 multipliers, 16.67 Mbit embedded memory, and high logic density supports multi-channel SDR baseband processing for military and commercial wireless systems. The DSP block density enables simultaneous FFT, channelization, and modulation for several antennas. The 1152-FCBGA package provides thermal headroom for sustained DSP workloads, while programmable power technology minimizes static leakage. According to Altera application notes, Stratix III E devices achieve >300 MHz DSP block performance for IF sampling designs. Recommended companion MPNs: AD9268BCPZ-105 (ADC), AD9122BCPZ (DAC), EP3C55F780C8N (front-end pre-processing).
Recommended
Video Processing and Broadcast Equipment
The EP3SE260F1152I4 supports real-time 4K and high-frame-rate video processing thanks to its high logic density and memory bandwidth. Embedded M9K and M144K memory blocks enable line buffering and frame store at 1080p/4K resolutions. The 744 user I/Os allow direct parallel connection to high-speed video ADCs and DACs without external muxing. According to the Stratix III Device Handbook, the device supports HD-SDI, 3G-SDI, and DisplayPort interfaces via IP cores. Recommended companion MPNs: EP3C40F484C6N (subordinate video processing), EPCS64SI16N (firmware), GS2971AIBE3 (HD-SDI receiver).
Recommended
Industrial Test and Measurement
The EP3SE260F1152I4 is used in high-end oscilloscopes, logic analyzers, and protocol analyzers where massive logic resources capture and analyze high-speed parallel bus traffic. Its 744 user I/Os handle wide parallel probe connections, while the 768 DSP blocks accelerate FFT and signal processing in real time. The industrial temperature range (-40 C to +100 C) of the I4 speed grade variant supports harsh-environment test equipment. According to Altera application notes, Stratix III E devices support LVDS at >1 Gbps per pair for direct probe interface. Recommended companion MPNs: EP3C55F484C7N (display controller), EPCS128SI16N (configuration), ADS6445MRGCT (high-speed ADC).
Recommended
High-Performance Computing Accelerator
The EP3SE260F1152I4 functions as an FPGA-based compute accelerator in HPC and signal intelligence systems, where its 768 DSP blocks and 16.67 Mbit on-chip memory deliver high arithmetic throughput with low latency. The PCI Express hard IP enables direct host connection, and the abundant I/O bandwidth supports multi-channel memory expansion. According to the Stratix III Device Handbook, sustained DSP block operation exceeds 200 GMACs per second for 18x18 multiplications. The programmable power technology allows reduced power during compute idle. Recommended companion MPNs: EP3C55F780C8N (control plane), EPCS64SI16N (boot flash), MT41K512M8RH-125 (DDR3 memory).
Recommended
Recommended Products Summary
Engineering reference data for EP3SE260F1152I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE260F1152I3 | EP3SE260F1152I4N | EP3SE260F1152C4 | EP3SE260F1152C3 | EP3SE110F1152I4 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 1152-FCBGA | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 110,000 (-57%) |
| Embedded Memory | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | 16.67 Mbit | ~8.7 Mbit (-48%) |
| Speed Grade | I4 (slowest) | I3 (faster) | I4 (same) | C4 (commercial) | C3 (commercial, faster) | I4 (same) |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) |
| User I/O Count | 744 | 744 | 744 | 744 | 744 | 740 (-4) |
| RoHS Compliance | Compliant (lead-free variant: EP3SE260F1152I4N) | Compliant (variant dependent) | Lead-free RoHS-compliant | Compliant (variant dependent) | Compliant (variant dependent) | Compliant (variant dependent) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Highest logic density in Stratix III E family at 255,000 LEs (vs EP3SE110F1152I4)
- Industrial temperature range for harsh-environment deployment (vs EP3SE260F1152C4)
- Heritage I4 speed grade for lower-power designs (vs EP3SE260F1152I3)
Design Notes
The EP3SE260F1152I4 requires multiple supply rails: VCCINT at 1.1 V for core logic, VCCIO at 1.2 V-3.3 V per I/O bank, VCCAUX at 2.5 V, and VCCPD at 2.5 V or 3.0 V for I/O pre-drivers. According to the Stratix III Device Handbook, power-on sequencing should bring VCCINT before VCCAUX to avoid latch-up. Decoupling: use a 0.1 uF X7R ceramic per VCCINT/GND ball pair plus bulk tantalum or polymer capacitors. Estimated: with 80 percent utilization at 300 MHz, the core can draw 3-5 A; design the regulator for at least 8 A peak capability.
The 1152-FCBGA package requires a high-layer-count PCB (typically 12+ layers) with via-in-pad technology to route signals out from the 1.0 mm ball pitch array. Use a full-array ground via farm under the thermal BGA pad for thermal dissipation and reference plane integrity. According to Altera layout guidelines, signal trace impedance should target 50 ohm single-ended and 100 ohm differential for LVDS pairs. Maintain continuous return path references under all high-speed serial lanes to avoid SI degradation.
The 1152-FCBGA package relies heavily on the bottom thermal pad for heat removal. Without a continuous thermal pad soldered to a copper heat spreader or via farm, junction temperature can exceed 100 C at moderate utilization. According to the Stratix III Device Handbook, the thermal pad must be soldered to the PCB and connected to an internal ground plane with a via array (typically 0.3 mm drill, 0.5 mm pitch). For forced-air or heatsink attachment, the PCB copper thickness should be at least 2 oz in the FPGA region.
A common pitfall is treating the I4 (slowest) speed grade as adequate for high-frequency DSP or memory interface designs. The I4 grade may fail timing closure at 400 MHz DDR3 interfaces; choose I3 or C3 speed grade instead. Estimated: for DDR3-800 (400 MHz), the I3 speed grade provides approximately 15-20 percent timing margin over I4. Also note: SRAM-based configuration means a configuration device (EPCS family) is required on the board - the FPGA cannot self-configure at power-up without external flash.
Compliance Information
RoHS compliance applies to the EP3SE260F1152I4N variant with the N suffix; the base EP3SE260F1152I4 may use leaded BGA balls. Verify part number suffix before use in RoHS-required regions. AEC-Q100 is not applicable as this is an industrial FPGA, not an automotive-qualified part.
