EP3SL70F484I3G - Stratix III L FPGA 67.5K LE, 484-FCBGA | Intel / Altera
MPN: EP3SL70F484I3G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP3SL70F484I3G Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric is configured via an SRAM or flash bitstream, enabling parallel hardware acceleration of algorithms that would be too slow on a CPU. The Stratix III family is positioned within Altera's high-end programmable logic portfolio, sitting above Cyclone low-cost FPGAs and below the Stratix V/Stratix 10 flagship generations. It addresses mid- to high-density designs in communications, signal processing, and embedded compute.
Key differentiating specifications of the EP3SL70F484I3G include its 24 transceiver channels, dedicated DSP blocks for high-throughput fixed- and floating-point operations, on-chip triplicated register and lockstep structures for single-event upset mitigation, and support for external memory interfaces including DDR3 SDRAM up to 800 MHz. The 484-pin FCBGA package provides a high-density ball grid that supports the wide I/O count and signal-integrity demands of multi-gigabit serial links.
Architecturally, the Stratix III L family uses a low-power variant of the Stratix III fabric with reduced static power consumption and 1.0V core operation, while retaining the same ALM architecture, MLAB memory blocks, and 8T/9T SRAM. Designers can compile bitstreams in Altera Quartus II and target a broad IP library for memory controllers, Ethernet MACs, PCIe Gen1/Gen2, and DSP kernels.
Typical applications include wireless baseband DSP, serial backplane aggregation, ASIC prototyping, test and measurement instrumentation, and high-speed serial protocol bridging. Designers choose Stratix III L when they need a balanced mix of logic density, transceiver bandwidth, and power efficiency.
When designing with this device, follow the Altera Stratix III handbook guidelines for PCB power-plane stacking, transceiver channel routing, and decoupling - the FCBGA substrate demands matched-length differential pairs and a controlled-impedance stackup. Configuration via JTAG or serial flash is supported.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SL70F484I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F484I3G (same form factor and footprint) — differing in Speed Grade, Operating Temperature, Package, Family, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F484I3
✅ Drop-In✓ In Stock
$1013.66 / Unit
View Datasheet →EP3SL70F484C4N
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →EP3SL70F484C4LN
✅ Drop-In✓ In Stock
$380 / Unit
View Datasheet →EP3SL70F484C3G
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP3SL70F484C4G
✅ Drop-In✓ In Stock
$1485 / Unit
View Datasheet →EP3SL70F484C4LG
✅ Drop-In✓ In Stock
$1450 / Unit
View Datasheet →EP3SL70F484I3G Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | Stratix III (low-power variant) |
| Logic Elements (LE) | 67,500 |
| Total Memory Bits | 2,699,264 |
| User I/O Pins | 296 |
| Transceivers | 24 |
| Package Type | 484-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Package Pin Count | 484 |
| Speed Grade | I3 |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Core Voltage | 1.0 V |
| Process Technology | 40 nm TSMC |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Interface | JTAG / Serial Passive / Active Serial |
EP3SL70F484I3G 484 Pin Configuration Guide
Pin configuration for EP3SL70F484I3G (484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F484I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F484I3G is suitable for 6 applications: Wireless Baseband DSP, Serial Backplane Aggregation, ASIC Prototyping, Test and Measurement Instrumentation, High-Speed Protocol Bridging, Industrial Automation Controllers.
Wireless Baseband DSP
The EP3SL70F484I3G's 67,500 logic elements combined with its dedicated DSP blocks deliver the parallel multiply-accumulate throughput required for LTE, WiMAX, and proprietary wireless baseband signal chains. The 2,699,264 bits of on-chip SRAM handle symbol buffering and channel-state storage without external memory contention. The 24 transceivers support CPRI/OBSAI fronthaul to remote radio heads, replacing multiple external SERDES chips with on-die channels. Industrial temperature rating -40C to +100C allows outdoor base-station deployments. Designers typically instantiate FFT/iFFT cores, channel encoders/decoders, and crest-factor reduction blocks via the Quartus II IP library; the FCBGA package's matched-length differential pair routing preserves signal integrity on multi-GHz serial links.
Recommended
Serial Backplane Aggregation
The 24 multi-gigabit transceivers on the EP3SL70F484I3G aggregate serial links across ATCA/AdvancedTCA backplanes, replacing multiple bridge ASICs with a single programmable device. Each channel supports protocol mapping for Ethernet, PCIe, Serial RapidIO, and Aurora, allowing the FPGA to perform protocol conversion between incompatible domains. The 296 user I/O pins provide ample parallel sideband connections to management controllers and timing references. The I3 speed grade and industrial temperature rating suit telco-central-office deployments where ambient temperatures fluctuate with HVAC load. Designers typically pair the device with external SFP+ cages and configure the transceiver reference clocks via the Stratix III L device handbook reference design.
Recommended
ASIC Prototyping
The EP3SL70F484I3G serves as an in-system ASIC prototype because its ALM-based architecture maps efficiently to synthesized ASIC netlists. Designers partition large ASIC designs across multiple Stratix III L devices using TDM-based multi-FPGA partitioning tools; the FCBGA package supports high-density board-to-board connectors carrying the partitioning signals. The 24 transceivers model ASIC SERDES channels at near-real throughput, allowing pre-silicon firmware development. Industrial temperature rating supports pre-silicon board bring-up in lab environments that simulate production operating conditions. Quartus II compilation, combined with ASIC-equivalent synthesis libraries, enables accurate timing closure analysis well before silicon tape-out.
Recommended
Test and Measurement Instrumentation
The EP3SL70F484I3G's high transceiver count and parallel processing capability suit it for digital oscilloscopes, protocol analyzers, and logic analyzers that capture multi-Gbps signals in real time. The 2,699,264 bits of on-chip SRAM serve as deep acquisition buffers, while the 296 I/O pins accommodate wide probe bus interfaces. The I3 industrial speed grade provides deterministic timing for high-accuracy trigger alignment, and the FCBGA package's signal integrity is essential for capturing fast edges without jitter degradation. Designers use the FPGA's DSP blocks to perform real-time FFT, eye-diagram analysis, and protocol decoding in-line with data acquisition.
Recommended
High-Speed Protocol Bridging
The EP3SL70F484I3G bridges between serial protocols such as PCIe, Ethernet, SATA, and Serial RapidIO by instantiating multiple soft IP controllers in parallel on a single FPGA. The 24 transceivers handle multiple lanes of each protocol simultaneously, eliminating the need for external bridge chips. The 296 I/O pins expose parallel system buses for legacy device interfaces, supporting hybrid designs that mix modern and legacy connectivity. Industrial temperature rating makes the device suitable for factory-floor and outdoor equipment. Quartus II IP cores provide pre-validated controller implementations, reducing time-to-market.
Recommended
Industrial Automation Controllers
The EP3SL70F484I3G operates reliably in -40C to +100C environments typical of industrial automation cabinets, with deterministic I/O timing required for motion control and servo loops. The 24 transceivers support industrial fieldbus protocols such as EtherCAT, Profinet, and CC-Link IE while 296 I/O pins connect to encoders, sensors, and safety relays. The device's 67,500 logic elements allow implementation of complete control law algorithms - PID loops, state machines, and trajectory planning - in parallel hardware rather than sequential firmware. The FCBGA package's robust thermal performance ensures long-term reliability in vibration-prone factory environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F484I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F484I3 | EP3SL70F484C4N | EP3SL70F484C4LN | EP3SL70F484C3G | EP3SL70F484C4G | EP3SL70F484C4LG |
|---|---|---|---|---|---|---|---|
| Package | 484-Ball FCBGA | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same | 484-Ball FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Memory Bits | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Transceivers | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Speed Grade | I3 | I3 | C4 (slower, commercial) | C4L (slower, low-power) | C3 (commercial) | C4 (commercial) | C4L (low-power) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
Key Differentiators
- Industrial temperature rating with I3 speed grade (vs EP3SL70F484C4N (commercial))
- Lead-free 'G' suffix variant (RoHS compliant) (vs EP3SL70F484I3 (no 'G'))
- Same-density drop-in within Stratix III L family (vs EP3SL50F484I3G (50K LE variant))
Design Notes
The 484-ball FCBGA package demands a controlled-impedance PCB stackup with matched-length differential pairs for transceiver channels. Follow the Stratix III L device handbook reference layout: 1.0V and 1.5V/2.5V/3.3V supply planes must be decoupled with a dense array of 0.1uF and 10uF capacitors within 100 mils of each ball. Thermal vias (8-12 per supply ball cluster) under the package spreader are required for industrial temperature operation. Estimated: at maximum toggle rate the device draws approximately 3-5W, manageable with 4-layer copper pours but requiring attention in high-density designs.
Transceiver channel routing must comply with the Stratix III L PCB design guidelines: 85 ohm differential impedance, 100 ohm common-mode, and intra-pair skew under 5 mils for 6 Gbps operation. Reference clock routes must be length-matched to within 50 mils. Use GND-coplanar waveguides with stitch vias every 200 mils for high-speed serial channels. Avoid routing high-speed signals over plane splits - reference planes must be solid beneath all transceiver traces.
Do not assume pin compatibility between I3 (industrial) and C3/C4 (commercial) speed grades - timing models differ significantly. Configuration mode selection via MSEL pins must match the boot memory interface (JTAG/AS/PS/FPP). Quartus II compilation requires the device-specific speed-grade settings; reusing bitstreams between grades is not allowed. When migrating from industrial to commercial, validate the application's worst-case timing closure at the higher (commercial) junction temperatures.
Compliance Information
RoHS/REACH compliant per Altera/Intel product declaration. AEC-Q100 does not apply to FPGAs (industrial-grade only). Lead-free (Pb-free) terminal finish per 'G' suffix.
