EP3SL340F1760C3 - Stratix III L FPGA, 337500 Cells, 1760-FBGA | Intel
MPN: EP3SL340F1760C3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16850.17 | $16,850.17 |
| 5 | $15420 | $77,100.00 |
| 10 | $14280 | $142,800.00 |
| 25 | $13050 | $326,250.00 |
| 50 | $12480 | $624,000.00 |
EP3SL340F1760C3 Overview
A field-programmable gate array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory, and DSP functions in silicon after fabrication. FPGAs sit above fixed-function ASICs in design flexibility and below microprocessors in programmability granularity, occupying a unique role in parallel processing pipelines. Within the Stratix III L sub-family, the 'L' suffix denotes the lower-static-power variant, optimized for power-sensitive applications while preserving the high-performance adaptive logic module (ALM) fabric. Stratix III devices support transceiver rates up to 6.375 Gbps, embedded transceivers, and hard IP for PCI Express Gen1/Gen2, depending on the die variant.
Key features include 337,500 logic elements, 18,822,144 RAM bits distributed across TriMatrix memory blocks, 1120 general-purpose I/O, integrated DSP blocks with up to 224 GMACs of throughput, and a high-speed serial interface supporting multi-gigabit transceivers. The 1760-pin FC-FBGA package provides ample signal headroom for parallel buses and memory interfaces common in image processing and telecom line-card designs. Industrial design tools such as Intel Quartus Prime provide synthesis, place-and-route, and timing closure for the device, with pre-verified IP cores available for DDR2/DDR3 memory controllers, PCIe, and Ethernet MACs.
Architecturally, the EP3SL340F1760C3 employs a logic-array block (LAB) structure composed of adaptive logic modules (ALMs) with eight inputs and dedicated carry chains for arithmetic operations. The 65 nm process node balances leakage and dynamic power, while the 'L' designation specifically targets reduced static power consumption. The device integrates PLLs, high-speed serial interface channels, and dedicated hardware multipliers for DSP, simplifying complex SoC designs and reducing external component count.
Typical applications include high-speed image processing, telecom line cards, military and aerospace signal processing, ASIC prototyping, and high-performance DSP compute engines. The combination of 337,500 logic elements and 1120 I/O suits designs requiring many parallel interfaces.
When designing with this FPGA, ensure proper power-rail sequencing and adequate decoupling per Quartus Prime power-supply design guidelines. The large FC-FBGA package requires multi-layer PCB stack-up with controlled-impedance routing and matched-length traces for DDR memory interfaces.
Drop-in alternatives for EP3SL340F1760C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL340F1760C3 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL340F1760C2
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View Datasheet →EP3SL340F1760I3
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View Datasheet →EP3SL340F1760C4N
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$1820 / Unit
View Datasheet →EP3SE260F1517I3N
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View Datasheet →EP3SE260F1152I3N
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View Datasheet →EP3SL340F1760C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory (bits) | 18,822,144 |
| Maximum User I/O | 1120 |
| Maximum Operating Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Package | 1760-ball FC-FBGA |
| Speed Grade | C3 |
| Operating Temperature | Commercial (0C to +85C) |
| Mounting Type | Surface Mount |
| Family Variant | Stratix III L (low static power) |
| RoHS Status | Compliant |
| Total Memory Bits | 18822144 |
| IC Function | Field Programmable Gate Array (FPGA) |
EP3SL340F1760C3 1760-ball fc-fbga Pin Configuration Guide
Pin configuration for EP3SL340F1760C3 (1760-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL340F1760C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL340F1760C3 is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line Card Signal Processing, High-Speed Image Processing Pipelines, Military and Aerospace Signal Processing, High-Performance DSP Compute Engines, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL340F1760C3's 337,500 logic elements and 18,822,144 bits of embedded memory make it an excellent platform for ASIC prototyping and emulation. Engineers map complex ASIC RTL designs onto the Stratix III L fabric, taking advantage of the abundant ALM resources, dedicated DSP blocks, and 1120 user I/O. The 1760-ball FC-FBGA package provides signal integrity for multi-clock-domain emulation. Compared to smaller FPGAs, the EP3SL340F1760C3 supports full-chip emulation of mid-complexity ASICs without partitioning, dramatically accelerating pre-silicon validation and software bring-up.
Recommended
Telecom Line Card Signal Processing
The EP3SL340F1760C3 fits telecom line-card designs requiring packet processing, traffic management, and high-throughput I/O aggregation. With 1120 user I/O and 337500 logic elements, the device can host multiple SERDES lanes, packet classifiers, and QoS engines. The 65 nm Stratix III L process provides low static power suited for dense line-card chassis. Combined with hard PCIe Gen1/Gen2 IP, the FPGA integrates host interface and framer functions, reducing board complexity and BOM cost compared to processor-plus-ASIC solutions.
Recommended
High-Speed Image Processing Pipelines
The 337500 logic elements, embedded TriMatrix memory, and 1120 user I/O make the EP3SL340F1760C3 suitable for image-processing pipelines including video format conversion, real-time filtering, and multi-channel surveillance aggregation. The dedicated DSP blocks deliver up to 224 GMACs of throughput, sufficient for HD video scaling and chroma resampling. The 1760-FBGA package accommodates wide parallel sensor interfaces. Compared to GPU-based solutions, the FPGA delivers deterministic low-latency processing required for industrial vision and machine-vision systems.
Recommended
Military and Aerospace Signal Processing
The EP3SL340F1760C3 supports military and aerospace signal-processing applications including radar front-end processing, software-defined radio baseband, and electronic warfare subsystems. While the C3 commercial speed grade limits operating temperature, designs using industrial-grade EP3SL340F1760I3 share the same die. The high logic density supports real-time FFT, beamforming, and adaptive filtering. Combined with on-chip transceivers and DSP blocks, the FPGA replaces multiple DSP chips in legacy radar architectures, reducing SWaP-C.
Recommended
High-Performance DSP Compute Engines
The EP3SL340F1760C3 integrates dedicated DSP blocks supporting up to 224 GMACs of throughput, ideal for high-performance compute engines running FFT, FIR filtering, encryption, and matrix operations. The 18,822,144 bits of embedded memory provide high-bandwidth data storage for streaming DSP workloads. Designers can implement multi-channel FFT pipelines, real-time encryption cores, and convolutional neural network accelerators. The 'L' suffix indicates low static power, beneficial for dense compute farms where power and cooling are constrained.
Recommended
Test and Measurement Instrumentation
The EP3SL340F1760C3 supports test and measurement instrumentation such as protocol analyzers, logic analyzer backends, and arbitrary waveform generators. The 1120 user I/O accommodate parallel probe interfaces, while the 337500 logic elements and 18 Mbit memory enable deep capture buffers and pattern generators. The 717 MHz fMAX supports high-speed serial protocol decoding (PCIe, SATA, USB 3.0). Combined with hard PCIe IP, the FPGA streams captured data directly to host PCs at multi-gigabit rates, reducing test time and improving throughput.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL340F1760C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL340F1760C2 | EP3SL340F1760I3 | EP3SL340F1760C4N | EP3SE260F1517I3N | EP3SE260F1152I3N |
|---|---|---|---|---|---|---|
| Package | 1760-ball FC-FBGA | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1760-ball FC-FBGA - same | 1517-ball FC-FBGA - different | 1152-ball FC-FBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV E | Stratix IV E |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | ~254,000 | ~254,000 |
| Speed Grade | C3 | C2 | I3 | C4 | I3 | I3 |
| Temperature Grade | Commercial | Commercial | Industrial | Commercial | Industrial | Industrial |
| Maximum User I/O | 1120 | 1120 | 1120 | 1120 | ~888 | ~744 |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | ~14,688,000 | ~14,688,000 |
Key Differentiators
- Highest density in the Stratix III L family at 337500 LE (vs EP3SE260F1517I3N (Stratix IV E))
- 1120 user I/O with 1760-ball FC-FBGA (vs EP3SE260F1152I3N (1152-FBGA))
- Stratix III L low-static-power 65 nm process (vs EP3SE260F1517I3N (Stratix IV E))
Design Notes
Estimated: At typical Stratix III L operating power of approximately 8-12 W for the EP3SL340F1760C3, the 1760-ball FC-FBGA requires a thermal management solution. With theta_JA in the range of 8-12 C/W for this large BGA, junction temperature rise above ambient can reach 100C without airflow. Designers should implement a heatsink with thermal interface material or forced-air cooling for sustained operation, and follow Quartus Prime thermal-modeling reports for junction temperature estimation.
The 1760-ball FC-FBGA package requires a multi-layer PCB stack-up with microvia technology and controlled-impedance routing. Use a high-density interconnect (HDI) process with stacked microvias to break out all signal balls, and provide at least 4 PCB layers dedicated to ground planes for return-path integrity. Matched-length traces are essential for DDR memory interfaces, with length-matching tolerance per the Stratix III Device Handbook DDR3 guidelines.
Do not exceed the absolute maximum core voltage of 1.15 V or I/O voltage limits per the Stratix III handbook. Always program the device through the JTAG or Active Serial configuration interface before applying full power, and provide proper power-rail sequencing (1.1 V core before 1.5 V/1.8 V/2.5 V/3.3 V I/O). Quartus Prime software generates per-design pin assignments and power-rail sequencing scripts.
Place decoupling capacitors as close as possible to every power pin, with bulk decoupling (10uF to 100uF) distributed across the board. Isolate high-speed SERDES regions with their own ground-return paths to minimize crosstalk. Per the Stratix III Device Handbook, all PLL analog supply pins require dedicated filtering with ferrite beads and decoupling to achieve low jitter performance.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified (FPGA not for direct automotive qualification). Halogen-free per Intel FPGA packaging specifications.
