EP3SL70F780C4N - 488 I/O Stratix III L FPGA, 780-FBGA | Altera
MPN: EP3SL70F780C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1516.81 | $1,516.81 |
| 10 | $1450 | $14,500.00 |
| 100 | $1380 | $138,000.00 |
| 500 | $1295 | $647,500.00 |
| 1,000 | $1210 | $1,210,000.00 |
EP3SL70F780C4N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one task, and FPGAs can be reconfigured to implement custom parallel datapaths, high-speed interfaces, and hardware accelerators. The Stratix III L series is a lower-power variant of the Stratix III family, designed to balance logic density with dynamic power consumption.
Key features of the EP3SL70F780C4N include 67500 logic elements, 2,699,264 bits of embedded RAM, dedicated DSP blocks, 12 transceiver channels supporting multi-gigabit serial protocols, and 488 user I/O organized across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential standards. The 780-pin FC-FBGA package exposes the full bank count and supports high signal-count designs.
Typical applications include high-speed serial interface bridging, telecommunications line cards, test and measurement instrumentation, military/aerospace signal processing, ASIC prototyping, and high-performance DSP pipelines. Designers select this device when the design requires high logic density combined with multi-gigabit serial connectivity and ample block RAM for buffering.
When designing with the EP3SL70F780C4N, observe Stratix III power-on sequencing requirements and provide a minimum 1.1 V core rail ramp monotonic. Use Altera Quartus II design software (version 11.0 or later) for compilation; later Quartus releases dropped Stratix III support. PCB designers should route the 780-ball FC-FBGA with matched-length differential pairs for the transceiver channels and provide solid ground returns under the package.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical Quartus II design notes not found in the standalone datasheet.
Drop-in alternatives for EP3SL70F780C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780C4N (same form factor and footprint) β differing in Speed Grade, Package, Package Type, Process Technology, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SL70F780C3N
β Drop-Inβ In Stock
$198 / Unit
View Datasheet βEP3SL70F780C2N
β Drop-Inβ In Stock
$139 / Unit
View Datasheet βEP3SL70F780C4LN
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP3SL70F780I4N
β Drop-Inβ In Stock
$875.4 / Unit
View Datasheet βEP3SL50F780C4N
β Drop-Inβ In Stock
$162 / Unit
View Datasheet βEP3SL70F780C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements (LE) | 67500 |
| Embedded Memory Bits | 2,699,264 bits |
| Total RAM Bits | 2,699,264 |
| User I/O Count | 488 |
| Operating Frequency (Max) | 450 MHz |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Package | 780-ball FC-FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| Transceivers | 12 high-speed transceiver channels |
EP3SL70F780C4N 780-ball fc-fbga Pin Configuration Guide
Pin configuration for EP3SL70F780C4N (780-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL70F780C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL70F780C4N is suitable for 6 applications: High-Speed Serial Interface Bridging, Telecommunications Line Cards, Test and Measurement Instrumentation, ASIC Prototyping, Military/Aerospace Signal Processing, High-Performance DSP Pipelines.
High-Speed Serial Interface Bridging
The EP3SL70F780C4N suits high-speed serial interface bridging applications because it integrates 12 multi-gigabit transceiver channels alongside 67500 logic elements for protocol handling. Per the Stratix III Device Handbook, transceivers support data rates from 600 Mbps to 6.375 Gbps depending on speed grade and configuration, making the EP3SL70F780C4N a fit for PCIe Gen1/Gen2, Serial RapidIO, and custom serial links. The 488 user I/O and ample block RAM (2.7 Mbits) accommodate protocol state machines and packet buffers. Designers pair the device with external PHY or magnetics for the physical layer; the FPGA handles link-layer and transport-layer logic.
Recommended
Telecommunications Line Cards
Telecommunications line cards leverage the EP3SL70F780C4N's combination of 67500 logic elements, embedded RAM, and 12 transceiver channels for backplane aggregation and packet processing. The Stratix III Device Handbook notes support for common telecom protocols including Serial RapidIO and custom serdes, fitting applications like optical transport network (OTN) framer interfacing and base-station baseband processing. The 1.1 V core supply and Stratix III L power optimizations balance performance with thermal constraints in densely populated line-card slots. The 780-ball FC-FBGA footprint allows integration alongside memory, PHY, and switch ASICs on standard telecom PCBs.
Recommended
Test and Measurement Instrumentation
Test and measurement instrument designers choose the EP3SL70F780C4N for its 488 user I/O, enabling parallel digitizer interfacing, and its 2.7 Mbit embedded RAM for deep sample buffering. Per the Stratix III Device Handbook, the DSP blocks implement FIR filters and FFT pipelines at high sample rates, supporting oscilloscope, logic analyzer, and arbitrary waveform generator designs. The 450 MHz core frequency delivers ample processing headroom for real-time signal conditioning. The 780-ball FC-FBGA package allows integration of dense I/O, multiple memory interfaces, and display/control paths on a single board.
Recommended
ASIC Prototyping
ASIC prototyping platforms use the EP3SL70F780C4N to validate large RTL designs before tape-out. With 67500 logic elements and 2.7 Mbit embedded RAM, the EP3SL70 has enough logic and memory headroom to fit mid-complexity ASICs as a single FPGA or to partition larger ASICs across multiple FPGAs. The Stratix III Device Handbook notes 12 transceivers for chip-to-chip ASICS prototyping links. The 780-ball FC-FBGA package exposes enough user I/O to map ASIC peripheral buses. Designers use Quartus II 13.1 (the last release with Stratix III support) for design compilation.
Recommended
Military/Aerospace Signal Processing
Military and aerospace signal processing subsystems benefit from the EP3SL70F780C4N's 67500 logic elements, 12 transceiver channels, and industrial-grade variants availability within the same silicon family. The Stratix III Device Handbook notes that FPGA-based signal processing supports radar, electronic warfare, and secure communications designs requiring parallel datapaths and high I/O bandwidth. Designers select the EP3SL70F780I4N (industrial temp) or equivalent extended-temp screening for harsh-environment applications. The 780-ball FC-FBGA footprint supports ruggedized PCB construction.
Recommended
High-Performance DSP Pipelines
The EP3SL70F780C4N serves high-performance DSP pipelines such as radar beamforming, software-defined radio baseband, and medical imaging front-ends because it combines DSP blocks, embedded RAM, and 488 user I/O at 450 MHz core frequency. Per the Stratix III Device Handbook, dedicated DSP blocks implement multipliers and accumulators with high utilization efficiency, supporting parallel filter banks and FFT cores. The 2.7 Mbit embedded RAM provides coefficient and sample storage close to the DSP fabric. Designers use the transceiver channels for high-speed ADC/DAC data capture interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780C3N | EP3SL70F780C2N | EP3SL70F780C4LN | EP3SL70F780I4N | EP3SL50F780C4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 67500 | 67500 | 67500 | 67500 | 67500 | 49760 (-26%) |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,699,264 bits | 2,303,744 bits (-15%) |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 | C3 (faster) | C2 (fastest) | C4 (same) | I4 (industrial temp, C4 speed) | C4 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Key Differentiators
- Lower-speed grade with full Stratix III L resource set (vs EP3SL70F780C3N)
- Identical silicon and pinout to industrial-temp variant (vs EP3SL70F780I4N)
- Higher logic density than smaller Stratix III L sibling (vs EP3SL50F780C4N)
Design Notes
The EP3SL70F780C4N requires a 1.1 V core rail that must ramp monotonically per Stratix III power supply guidelines. VCCPD (1.1 V) and VCCIO (per-bank, typically 1.2 V to 3.3 V) rails have specific sequencing requirements relative to the core rail. Use Altera-recommended power sequencer or supervisory IC. Decoupling: 0402 ceramic capacitors at every ball-grid power pin, plus bulk tantalum or polymer capacitors near each supply pin group. Estimated: at 450 MHz with full transceiver utilization, core current can exceed 2 A. Provide thermal relief copper pour under the 780-ball FC-FBGA.
The 780-ball FC-FBGA package demands controlled-impedance PCB stackup with matched-length differential pairs for transceiver channels. Use microstrip or stripline routing with 100 ohm differential impedance for serial channels and 50 ohm single-ended for general-purpose I/O. Provide a continuous ground plane under the BGA with via stitching on the BGA pitch to suppress resonances. Estimated: trace length matching tolerance for transceivers is typically within 20 mils per pair; consult the Stratix III Device Handbook pin connection guidelines for exact numbers.
Stratix III is supported by Altera Quartus II up to version 13.1; Quartus Prime releases do not support Stratix III. Designers must retain a Quartus II license or install the legacy 13.1 web edition for new compilation work. Configuration: ensure the configuration scheme (fast passive parallel, AS, JTAG) matches the board design; mismatch is a common cause of board bring-up failures. Pin assignment: use Altera pin planner to validate bank VCCIO compatibility with mixed I/O standards on the same bank.
Compliance Information
RoHS/REACH/lead-free status not present in the verified web data; set to unknown. The 'N' suffix in the MPN indicates a lead-free terminal finish per Altera naming convention, but formal compliance documentation should be requested from Altera/Intel PSG.
