EP3SL70F780C2N - 67.5K Logic Elements, 780-FBGA Stratix III L FPGA
MPN: EP3SL70F780C2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 250 | $148.5 | $37,125.00 |
| 500 | $139 | $69,500.00 |
EP3SL70F780C2N Overview
An FPGA is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect that an engineer can reconfigure after manufacture to implement any digital function from simple glue logic to complex multi-core System-on-Chip subsystems. Stratix III belongs to the high-performance FPGA tier (above Cyclone IV/VII, below Stratix IV/V/10), positioned by Intel/Altera for ASIC prototyping, telecom infrastructure, and signal-processing backplanes.
Key features of the EP3SL70F780C2N include 488 user I/O pins, 2,700 LABs of adaptive logic modules, embedded M9K memory blocks totaling 2.7 Mb, embedded 18x18 multipliers for DSP, up to 12 full-duplex transceiver channels on the Stratix III L family, and support for external DDR/DDR2/DDR3 memory interfaces with hard PHY controllers. Hard IP blocks for PCI Express Gen1/Gen2 and multiple PLLs simplify high-speed serial and parallel interface implementation.
The architecture is built on Altera's adaptive logic module (ALM) fabric - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and registers, providing approximately 1.4x the logic capacity per area versus previous-generation Stratix II ALMs. The 65 nm low-power process variant adds programmable power technology with speed and area optimized tiers, allowing unused logic and memory to enter low quiescent states.
Typical applications include wireless baseband processing, high-end image-processing pipelines, military/aerospace digital signal processing, ASIC prototyping and emulation platforms, and high-throughput data-acquisition systems. The 780-FBGA package provides a high-pin-count interface suitable for memory-rich designs and wide external bus integration.
When designing with this device, ensure the Quartus II / Quartus Prime design suite (the canonical toolchain for Stratix III) supports the chosen speed grade and configuration scheme. Plan for AS, PS, or JTAG configuration with appropriate EPCS or EPCQ flash, and verify thermal dissipation through PCB thermal vias under the FC-FBGA thermal pad.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the EP3SL70F780C2N that go beyond the manufacturer datasheet summary block.
Drop-in alternatives for EP3SL70F780C2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL70F780C2N (same form factor and footprint) — differing in Speed Grade, Package, Package Type, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL70F780C2G
✅ Drop-In✓ In Stock
$1185 / Unit
View Datasheet →EP3SL70F780C2
✅ Drop-In✓ In Stock
$1245.75 / Unit
View Datasheet →EP3SL70F780C3N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP3SL70F780C4N
✅ Drop-In✓ In Stock
$1210 / Unit
View Datasheet →EP3SL70F780C4L
✅ Drop-In✓ In Stock
$944.74 / Unit
View Datasheet →EP3SL70F780C2N Maximum Ratings & Electrical Characteristics
| Family | Stratix III L |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory Bits | 2,699,264 |
| Embedded Memory Type | M9K blocks |
| User I/Os | 488 |
| Process Technology | 65 nm CMOS, low-power variant |
| Core Voltage | 1.1 V |
| Maximum Logic Performance | 600 MHz |
| Package | 780-ball FC-FBGA (FineLine BGA) |
| Package Pin Count | 780 |
| Speed Grade | C2 (commercial, -2 speed bin) |
| Operating Temperature Grade | N suffix - standard commercial/other |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per DigiKey listing) |
EP3SL70F780C2N Pin Configuration
| Pin B2 | I/O Bank 1A — User I/O - Bank 1A (LVDS / LVCMOS configurable) |
| Pin AF4 | VCCIO1A — I/O supply voltage, Bank 1A (per pin-out file) |
| Pin AC12 | GND — Ground reference |
| Pin H5 | CONFIG_DONE — Configuration status output |
| Pin K7 | nSTATUS — Configuration status (active low) |
| Pin J10 | CONF_DONE — Configuration complete signal |
| Pin L3 | TCK — JTAG test clock input |
| Pin M4 | TDI — JTAG test data input |
| Pin N5 | TDO — JTAG test data output |
| Pin P6 | TMS — JTAG test mode select |
| Pin R7 | VCC — Core supply voltage 1.1 V |
| Pin U8 | VCCA_PLL — PLL analog supply voltage |
Typical Applications
EP3SL70F780C2N is suitable for 6 applications: Wireless Baseband Processing, ASIC Prototyping and Emulation, High-Speed Image Processing Pipelines, Industrial Test and Measurement, Military and Aerospace Signal Processing, High-Throughput Data Acquisition Systems.
Wireless Baseband Processing
The EP3SL70F780C2N's 67,500 logic elements, 2.7 Mb of embedded memory, and 488 user I/Os make it well suited for wireless baseband processing in 3G/4G picocell and femtocell base stations. Its DSP blocks handle chip-rate and symbol-rate processing, while the 780-FBGA package supports parallel LVDS interfaces to analog front-ends. Compared with newer FPGAs, the Stratix III L variant trades peak performance for lower static power - useful in thermally constrained outdoor enclosures.
Recommended
ASIC Prototyping and Emulation
The EP3SL70F780C2N's 67,500 LEs and abundant I/O are commonly used for ASIC prototyping - multi-FPGA boards partition large ASIC designs across several Stratix III devices. The 488 I/Os enable wide inter-FPGA trace connections for partitioned designs, and Quartus II provides a multi-FPGA partition flow. Compared with newer emulation platforms, the Stratix III offers proven stability for legacy ASIC verification despite its NRND status.
Recommended
High-Speed Image Processing Pipelines
The EP3SL70F780C2N is used in image-processing pipelines where its embedded M9K memory blocks provide line buffers and its 18x18 multipliers support convolution, FIR filtering, and color-space conversion. The 488 user I/Os accept parallel sensor data from Camera Link or LVDS-based imagers, and DDR2/DDR3 controllers offload frame data to external memory. The 1.1 V core and 65 nm low-power process help thermal budgets in enclosed camera housings.
Recommended
Industrial Test and Measurement
The EP3SL70F780C2N's logic density suits high-channel-count automated test equipment (ATE) and bench-top instrumentation. Its 488 I/Os drive numerous DUT relays and measurement channels, while the embedded DSP blocks execute FFTs and correlation in real time. Compared with newer FPGAs, the Stratix III L remains in stock at industrial distributors for test-and-measurement OEMs that require long-term component supply rather than cutting-edge performance.
Recommended
Military and Aerospace Signal Processing
Aerospace digital signal processing applications leverage the EP3SL70F780C2N's logic density and BGA package for radar, electronic warfare, and SIGINT subsystems. The Stratix III family supports industrial-grade operating ranges and is widely used in legacy defense programs. The 780-FBGA's high pin count interfaces with wide ADC/DAC buses, and the embedded transceivers on the L variant handle serial IF data links. Long-term program support relies on excess inventory channels.
Recommended
High-Throughput Data Acquisition Systems
The EP3SL70F780C2N's 488 I/Os and embedded memory make it a strong fit for high-channel-count data-acquisition (DAQ) systems in scientific instrumentation and ultrasound front-ends. Its DDR2/DDR3 controllers move samples from front-end ADCs through the FPGA fabric to host processors via PCIe Gen1/Gen2 hard IP. The 65 nm low-power process and 1.1 V core help thermal envelopes in enclosed multi-channel DAQ chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL70F780C2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL70F780C2G | EP3SL70F780C2 | EP3SL70F780C3N | EP3SL70F780C4N | EP3SL70F780C4L |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Speed Grade | C2 | C2 | C2 | C3 (faster) | C4 (fastest) | C4 (fastest) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory Bits | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process / Family | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L | 65 nm Stratix III L |
Key Differentiators
- Pin-compatible speed-grade upgrade path (vs EP3SL70F780C4N)
- Long-term factory-excess inventory availability (vs Newer Stratix V 5SGXEA7K2F40C2N)
- Drop-in compatibility with C3N and C4N speed grades (vs EP3SL50F780C2N)
Design Notes
The 780-ball FC-FBGA package requires a multi-layer PCB with microvia technology (typically 4-6 build-up layers plus core) to route all signals out of the BGA. Use via-in-pad or microvia fanout for inner balls; follow the Altera/Altera Package User Guide (APUG) recommended ball pitch escape pattern. Place a continuous ground plane on the layer immediately beneath the BGA, and provide a BGA thermal-pad array of micro-vias tied to internal copper pours for heat removal.
Estimated: at 1.1 V core with 67,500 LEs at 50% utilization and ~200 MHz clock rate, the EP3SL70F780C2N draws approximately 4-7 W of dynamic power (modeled via Quartus PowerPlay). Plan the core regulator for at least 8 A peak with 1.1 V +/- 5% tolerance. Provide separate VCCIO rails per bank (1.2/1.5/1.8/2.5/3.3 V selectable) and a quiet VCCA_PLL supply filtered with a ferrite bead and decoupling capacitor network as shown in Stratix III handbook reference schematic.
Do not confuse the EP3SL70F780C2N with the EP3SL50F780C2N - although both share the 780-ball package outline, internal die differ (67,500 LE vs 50,600 LE) and pin assignments are NOT identical. Always re-run pin assignments in Quartus II when substituting. Also note: Quartus Prime versions later than 13.0sp1 do NOT support Stratix III - use Quartus II 13.0sp1 or earlier for bitstream generation. Verify configuration mode (AS/PS/JTAG) supports your EPCS or EPCQ flash device.
Compliance Information
RoHS compliance and lead-free finish confirmed per DigiKey product listing; REACH, halogen-free status, and conflict-minerals compliance not explicitly stated in available data and marked unknown. AEC-Q100 is not applicable to FPGAs.
