EP4CE40F29C6 - 39.6K LE Cyclone IV E FPGA, 532 I/O, 780-BGA | Altera
MPN: EP4CE40F29C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $133.9 | $133.90 |
| 10 | $121.5 | $1,215.00 |
| 100 | $105.2 | $10,520.00 |
| 500 | $92.75 | $46,375.00 |
| 1,000 | $84.1 | $84,100.00 |
EP4CE40F29C6 Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, multipliers, transceivers, and PLLs. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), above CPLDs (which are simpler, non-volatile), and below ASICs (custom-fabricated). The Cyclone IV E series specifically targets cost-sensitive, high-volume applications by balancing logic density, memory, and DSP against low unit cost and low static power consumption, sitting in Altera/Intel's product hierarchy below Cyclone V and Stratix families.
Key features of the EP4CE40F29C6 include 4 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a built-in configuration controller supporting JTAG (IEEE 1149.1) and Active Serial (AS) modes. The device offers up to 4 Mb of embedded SRAM distributed across M9K blocks (typically 113 blocks at 9 Kbit each), enabling efficient buffer and FIFO implementation without consuming logic resources. The 780-BGA package provides high signal density for memory-intensive designs and parallel interface bridging.
The EP4CE40F29C6 architecture uses 4-input lookup tables (LUTs) and embedded multiplier blocks optimized for parallel arithmetic. Its 60 nm process node minimizes leakage while supporting clock rates in the 200-400 MHz range for typical logic paths. Multiple I/O banks allow mixed-voltage interfacing (1.2 V to 3.3 V), and the configuration memory is SRAM-based, requiring an external flash or configuration controller for volatile designs.
Typical applications include industrial motor control and machine vision, video surveillance systems, automotive infotainment, LED video walls, software-defined radio, embedded prototyping, and high-volume consumer electronics. The 532 user I/Os make it well-suited for parallel data acquisition, memory expansion, and bus bridging applications.
When designing with this device, ensure the PCB has adequate BGA escape routing (microvia or via-in-pad recommended for inner balls), power decoupling per Cyclone IV guidelines, and a configuration scheme selected (JTAG for development, AS flash for production). Thermal management should account for the commercial temperature grade of 0C to +85C, ensuring junction temperature remains within datasheet limits.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated on the manufacturer datasheet, enabling faster design-in and sourcing decisions.
Drop-in alternatives for EP4CE40F29C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F29C6 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Logic Elements (LE), Configuration Mode.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F29C7N
✅ Drop-In✓ In Stock
$55.85 / Unit
View Datasheet →EP4CE40F29C8N
✅ Drop-In✓ In Stock
$104.6 / Unit
View Datasheet →EP4CE40F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$124 / Unit
View Datasheet →EP4CE40F29A7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE55F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$154.8 / Unit
View Datasheet →EP4CE75F29I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$540 / Unit
View Datasheet →EP4CE40F29C6 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E (FPGA) |
| Logic Elements (LE) | 39,600 |
| Embedded Memory | 1,161,216 bits (113 x M9K blocks) |
| Embedded Multipliers (18x18) | 116 |
| User I/O Pins | 532 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm (TSMC low-power) |
| Core Voltage | 1.2 V |
| Operating Temperature | 0C to +85C (Commercial) |
| Package | 780-BGA (FBGA, 29 mm x 29 mm) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Mode | JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS) |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL |
| RoHS Status | Compliant |
EP4CE40F29C6 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank dependent) |
| Pin A2 | VCCIO — I/O bank supply voltage |
| Pin A3 | GND — Ground |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | I/O — User I/O pin |
| Pin B3 | VCCINT — Core supply voltage (1.2 V) |
| Pin C1 | CLKIN — Dedicated clock input |
| Pin C2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | I/O — User I/O pin |
| Pin D3 | I/O — User I/O pin |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | I/O — User I/O pin |
| Pin E3 | I/O — User I/O pin |
| Pin F1 | I/O — User I/O pin |
| Pin F2 | I/O — User I/O pin |
| Pin F3 | I/O — User I/O pin |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin G3 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | I/O — User I/O pin |
| Pin H3 | I/O — User I/O pin |
| Pin J1 | I/O — User I/O pin |
| Pin J2 | I/O — User I/O pin |
| Pin J3 | I/O — User I/O pin |
| Pin K1 | I/O — User I/O pin |
| Pin K2 | I/O — User I/O pin |
| Pin K3 | I/O — User I/O pin |
| Pin L1 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin L2 | TMS — JTAG test mode select |
| Pin L3 | TDI — JTAG test data input |
| Pin M1 | TDO — JTAG test data output |
| Pin M2 | nCONFIG — Configuration control (active low) |
| Pin M3 | nSTATUS — Configuration status (active low) |
| Pin N1 | DCLK — Configuration clock input |
| Pin N2 | DATA0 — Configuration data input |
| Pin N3 | I/O — User I/O pin |
| Pin P1 | I/O — User I/O pin |
| Pin P2 | I/O — User I/O pin |
| Pin P3 | I/O — User I/O pin |
Typical Applications
EP4CE40F29C6 is suitable for 6 applications: Industrial Motor Control and Drive, Machine Vision and Image Processing, Video Surveillance and Display Walls, Software Defined Radio Baseband, Automotive Infotainment and ADAS, Embedded Computing and Custom Peripherals.
Industrial Motor Control and Drive
The EP4CE40F29C6 fits industrial motor control drives because its 116 hardware 18x18 multipliers execute real-time Park/Clarke transforms and PID control loops in parallel, achieving sub-microsecond loop times for field-oriented control (FOC) of three-phase AC motors. The 532 user I/Os provide ample connectivity for quadrature encoder interfaces, Hall sensors, gate driver PWM outputs, and isolated communication buses (RS-485, CAN, EtherCAT). Its 4 PLLs generate precisely phase-shifted carrier waveforms, while the commercial 0C to +85C range covers most enclosed industrial cabinet environments. Cyclone IV E device architecture is documented in the Intel Cyclone IV Device Handbook.
Recommended
Machine Vision and Image Processing
The EP4CE40F29C6 supports machine vision pipelines through its 1,161,216 bits of embedded SRAM distributed across 113 M9K blocks, which act as line buffers and frame buffers for real-time video preprocessing. The 116 dedicated 18x18 multipliers accelerate convolution kernels, Sobel edge detection, and color space conversion (RGB to YCbCr) at rates sufficient for 1080p60 video streams from parallel CMOS sensors. With 532 I/Os, the device can directly interface to Camera Link, MIPI CSI-2 via soft IP, or LVDS-based image sensors. Quartus II Platform Designer provides ready-to-configure video IP cores that integrate cleanly with the EP4CE40F29C6 logic and memory architecture.
Recommended
Video Surveillance and Display Walls
The EP4CE40F29C6 enables video surveillance encoder and display wall controllers through its balanced logic, memory, and I/O resources. The 1.16 Mbit embedded SRAM functions as a multi-channel frame buffer, supporting simultaneous encoding of up to 4 D1 streams at 30 fps using soft H.264 IP cores. For LED video walls, the 532 user I/Os drive dozens of high-speed LVDS pairs to cascade receiver cards across the display matrix, while the 4 PLLs generate multiple pixel clocks with precise phase alignment to prevent tearing artifacts across tiles.
Recommended
Software Defined Radio Baseband
The EP4CE40F29C6 is suitable for SDR baseband processing through its 116 hardware multipliers and ample logic density, enabling parallel implementation of digital down-conversion (DDC), finite impulse response (FIR) filtering, and forward error correction (Viterbi, Turbo) decoders. The 4 PLLs synthesize multiple baseband clocks from a single reference, while 532 I/Os interface dual ADCs and DACs over LVDS at sample rates up to 250 MSPS. Commercial temperature grading is appropriate for laboratory and benchtop SDR equipment, while the industrial-grade EP4CE40F29I7N variant addresses outdoor and ruggedized deployments.
Recommended
Automotive Infotainment and ADAS
The EP4CE40F29A7N (automotive AEC-Q100 qualified variant in the same F29 package) is the recommended Cyclone IV E choice for automotive infotainment and ADAS prototypes, sharing the EP4CE40F29C6 die but qualified to -40C to +125C. The 116 18x18 multipliers accelerate sensor fusion DSP, while 1.16 Mbit embedded SRAM serves as frame buffer for surround-view camera stitching. The 532 I/Os connect to LVDS cameras, CAN/LIN transceivers, and MOST or Ethernet AVB PHYs. Designers validate prototypes with EP4CE40F29C6 (commercial temp, lower cost), then migrate to EP4CE40F29A7N for production AEC-Q100 qualification.
Recommended
Embedded Computing and Custom Peripherals
The EP4CE40F29C6 serves as a custom peripheral bridge in embedded computing platforms, leveraging 532 user I/Os to fan out PCIe, USB 2.0, GPIO banks, and legacy parallel buses from a host processor. The 116 18x18 multipliers accelerate cryptography (AES, SHA) and signal conditioning, while the 1.16 Mbit embedded SRAM supports DMA scratch buffers and protocol packet queuing. Designers implement Nios II soft processors in the EP4CE40F29C6 fabric for low-latency control tasks, offloading interrupts and real-time work from the host CPU. The 780-BGA package footprint is shared across the Cyclone IV E F29 family, enabling future migration to EP4CE55 or EP4CE75 densities.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F29C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F29C7N | EP4CE40F29C8N | EP4CE40F29I7N | EP4CE40F29A7N | EP4CE55F29I7N | EP4CE75F29I7N |
|---|---|---|---|---|---|---|---|
| Package | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) | 780-BGA (FBGA, F29) |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 55,560 | 75,408 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 2,340,096 | 2,788,224 |
| Embedded Multipliers (18x18) | 116 | 116 | 116 | 116 | 116 | 234 | 200 |
| User I/O Pins | 532 | 532 | 532 | 532 | 532 | 532 | 528 |
| Speed Grade | -6 | -7 | -8 | -7 | -7 | -7 | -7 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +125C (Automotive/AEC-Q100) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
Key Differentiators
- Highest speed grade in 780-FBGA F29 footprint (vs EP4CE40F29C8N)
- Cost-optimized commercial temperature grade (vs EP4CE40F29I7N)
- Cyclone IV E mid-density sweet spot at F29 pin map (vs EP4CE115F29I7N)
- 532 user I/Os in a single package (vs EP4CE40F23C6)
- Nios II soft processor support in 39.6K LE fabric (vs EP4CE10F17C8N)
Design Notes
The 780-FBGA F29 package uses 1.0 mm ball pitch on a 29 mm x 29 mm substrate, requiring microvia (0.4 mm hole, 0.2 mm capture pad) or via-in-pad technology for inner ball escape routing. Standard 0.3 mm via-in-pad with filled and plated over copper is recommended for all signal balls to maintain BGA coplanarity and signal integrity. Per Intel Cyclone IV hardware design guidelines, route differential pairs (LVDS, DDR) with 100 ohm differential impedance and length matching within 25 mil.
Power the EP4CE40F29C6 from a switching regulator with at least 1.5x headroom above the maximum expected load current; VCCINT (1.2 V core) can draw up to 2 A during configuration and dynamic operation, while VCCIO banks (1.2 V to 3.3 V) collectively consume up to 3 A with all 532 I/Os switching. Place 100 nF X7R ceramic decoupling capacitors on every VCCIO/VCCINT ball pair within 50 mil, plus 10 uF bulk capacitors at each supply rail entry point. Follow the Cyclone IV pin connection guidelines to ensure unused I/O banks are properly powered.
The commercial EP4CE40F29C6 is rated 0C to +85C junction temperature. Estimated: at full logic utilization (90% LE, 100% multiplier, all I/Os toggling at 100 MHz), the device can dissipate 2.5-3.5 W. The 780-FBGA package exposes the die through thermal vias in the PCB substrate - a 6-layer PCB with thermal via array under the package center, connected to an internal ground plane, can achieve theta_JA of approximately 12-15 C/W. For enclosed industrial designs, verify junction temperature with a thermal probe or the Quartus II PowerPlay early power estimator.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - they must each be pulled up or down per the Cyclone IV handbook to prevent inadvertent configuration during power-up. Configuration mode pins MSEL[3:0] must be set to the correct pattern (e.g., 0010 for Active Serial fast mode, 0000 for JTAG-only) before VCCINT ramp; incorrect MSEL settings are a common cause of FPGA 'brick' failures. For Active Serial configuration, verify the EPCS or EPCQ flash device is sized at least 1.5x larger than the .sof/.pof bitstream.
Keep all configuration clock (DCLK), JTAG (TCK), and dedicated clock input (CLKIN) traces short and isolated from switching I/O signals to minimize crosstalk into the global clock network. Use a 4-layer PCB stackup with dedicated ground planes on layers 2 and 4, and place the EP4CE40F29C6 within 50 mm of its configuration flash. If using high-speed LVDS, route in inner stripline layers with continuous reference ground, and keep LVDS pairs matched within 10 mil to avoid skew-induced jitter.
Compliance Information
RoHS and REACH compliant per Intel/Altera product page. The EP4CE40F29C6 itself is NOT AEC-Q100 qualified; the AEC-Q100 variant is EP4CE40F29A7N in the same 780-FBGA F29 package.
