Intel

EP4CE40F29C7 - Cyclone IV E FPGA, 39.6K LE, 780-FBGA | Intel

MPN: EP4CE40F29C7 ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS Rds(on) 780-ball FBGA (F29) Package 1,161,216 bits Memory
From $73.52 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $122.54 $122.54
10 $110.29 $1,102.90
100 $98.03 $9,803.00
500 $85.78 $42,890.00
1,000 $73.52 $73,520.00
ℹ️ All prices are in USD

EP4CE40F29C7 Overview

Intel EP4CE40F29C7 is a Cyclone IV E family field-programmable gate array (FPGA) built on a 60 nm low-power process, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 532 user I/O pins in a 780-ball fine-pitch BGA (FBGA) package. Core voltage is 1.2 V with multi-voltage I/O support.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic, DSP blocks, and memory functions. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors, combining hardware-level parallelism with software-like design iteration. The Cyclone IV E family specifically targets cost-sensitive, high-volume applications where low static power (sub-1.5 W typical) and high I/O density matter more than the highest possible logic throughput.

Key differentiating specifications include 4 embedded PLLs for clock synthesis, up to 113 embedded 18x18 multipliers for DSP, dedicated hardware for DDR/DDR2/QDR II memory interfaces, and support for LVDS, LVPECL, SSTL, and HSTL I/O standards. The device supports both asynchronous and synchronous external memory and includes configuration support via passive serial, active serial, and JTAG modes.

Architecturally, the EP4CE40F29C7 uses look-up-table (LUT) based logic blocks grouped into Logic Array Blocks (LABs), each containing 16 logic elements. Embedded memory is implemented as true dual-port M9K blocks, while DSP operations are accelerated by dedicated multiplier blocks, freeing fabric logic for control and routing. Hard PCIe, PLL, and memory controller silicon blocks reduce soft logic overhead and improve timing closure.

Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front-ends, telecom line cards, and embedded vision prototypes. The wide I/O count and DSP density also suit automotive infotainment pre-production boards and aerospace test instrumentation.

When designing with this FPGA, plan power sequencing for 1.2 V core before 2.5/3.3 V I/O, allocate sufficient decoupling (100 nF + 10 µF per supply rail), and verify JTAG chain integrity before attempting configuration. Quartus II design software (Cyclone IV device support) is required for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor pricing from DigiKey, Mouser, and Heisener, alongside drop-in same-family alternatives and engineering design notes not aggregated in any single manufacturer datasheet, providing a unique cross-reference for engineers evaluating this Cyclone IV E variant.

Drop-in alternatives for EP4CE40F29C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE40F29C7 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Process Technology, Configuration Modes.

Intel
Operating Temperature: 0C to +85C (Commercial)
Package: 780-BGA (FBGA, 29 mm x 29 mm)
Compare with EP4CE40F29C7 →
Intel
Operating Temperature: 0°C to +85°C (commercial)
Speed Grade: 6
Configuration Modes: Serial, JTAG, Passive Serial, AS
Compare with EP4CE40F29C7 →
Altera
Operating Temperature: 0 C to +85 C (Commercial)
Speed Grade: -7
Process Technology: 60 nm
Compare with EP4CE40F29C7 →
Intel
Operating Temperature: 0C to +85C (commercial, per speed-grade suffix)
Package: 780-ball FBGA (F29), 23x23 mm, 1.0 mm pitch
Speed Grade: C8 (commercial, slowest)
Compare with EP4CE40F29C7 →
Altera
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: -9 (fastest)
Process Technology: 60 nm low-power CMOS
Compare with EP4CE40F29C7 →
Intel
Process Technology: 60 nm
Compare with EP4CE40F29C7 →
Altera
Operating Temperature: -40 C to +100 C (industrial)
Speed Grade: 7
Process Technology: 60 nm (low-power)
Compare with EP4CE40F29C7 →
Altera
Operating Temperature: 0C to +85C (Commercial)
Package: 780-ball FBGA (29 x 29 mm, 1 mm pitch)
Process Technology: 60 nm
Compare with EP4CE40F29C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE40F29C8N

✅ Drop-In
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 bits · 116 · 532 · 4

✓ In Stock

$104.6 / Unit

View Datasheet →

EP4CE40F29C6

✅ Drop-In
Intel
📦 780-ball FBGA (F29)
Cyclone IV E · Cyclone IV E (FPGA) · 39,600 · 1,161,216 bits (113 x M9K blocks) · 116 · 532 · 4 · 20

✓ In Stock

$84.1 / Unit

View Datasheet →

EP4CE40F29C6N

✅ Drop-In
Intel
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 · 113 M9K blocks · 66 · 4 general-purpose · 532 · 780-ball FBGA (F29)

✓ In Stock

$77.51 / Unit

View Datasheet →

EP4CE40F29I7N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 · 126 · 116 · 532 · 4 · 20

✓ In Stock

$124 / Unit

View Datasheet →

EP4CE55F29C7

✅ Drop-In
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 55,856 · 3,491 · 2,396,160 · 156 · 4 · 374 · 472.5 MHz

✓ In Stock

$132.4 / Unit

View Datasheet →

EP4CE30F29C7

✅ Drop-In
📦 780-ball FBGA (F29)
29,440 LEs vs 39,600 LEs (-26%), 66 multipliers vs 113, same F29 footprint

📋 Reference alternative (not in catalog)

EP4CE40F29C7 Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 39,600
Embedded Memory Bits 1,161,216 bits
Embedded 18x18 Multipliers 113
User I/O Count 532
PLLs 4
Process Technology 60 nm (TSMC low-power)
Core Voltage 1.2 V
I/O Voltage Support 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
Package 780-ball FBGA (F29)
Mounting Type Surface Mount
Operating Temperature 0C to +85C (Commercial, C7 speed grade)
Configuration Modes Passive Serial, Active Serial, JTAG
Memory Interface Support DDR, DDR2, QDR II, SDR
I/O Standards LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS
RoHS Status Compliant
Lead-Free Yes

EP4CE40F29C7 780-ball fbga (f29) Pin Configuration Guide

Pin configuration for EP4CE40F29C7 (780-ball fbga (f29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fbga (f29) package pinout diagram for EP4CE40F29C7

No detailed pinout data available for EP4CE40F29C7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE40F29C7 is suitable for 6 applications: Industrial Motor Control, Video Processing Bridge, Software-Defined Radio Front-End, Telecom Line Card Interface, Embedded Vision Prototype, Test & Measurement Instrumentation.

🏭

Industrial Motor Control

The EP4CE40F29C7 fits industrial motor control because its 39,600 logic elements and 113 embedded 18x18 multipliers close timing on 3-axis field-oriented control loops at 32 kHz PWM without external DSP. The 4 PLLs generate the precise carrier frequencies needed for sinusoidal commutation, while 532 user I/Os accommodate parallel encoder feedback and gate-driver control. Compared with a discrete MCU+FPGA split, the integrated design reduces BOM cost and PCB area. Typical design: place QDR II memory on the dedicated DDR interface for commutation lookup tables, route incremental encoder inputs through LVDS pairs, and use the hardware multipliers for Park/Clarke transforms.

📺

Video Processing Bridge

Video format conversion and scaling benefit from the EP4CE40F29C7's 532 I/O count and DSP blocks, which absorb wide parallel RGB/YCbCr buses and run real-time deinterlacing or color-space conversion. The 780-ball FBGA package accommodates the dense BGA-to-board routing required for 24-bit parallel video interfaces at 150 MHz pixel clock. Embedded M9K memory blocks buffer scan-line and frame data, while the dedicated DDR2 controller interfaces to external SDRAM for full-frame storage. Compared with a dedicated ASSP, this FPGA allows late-stage resolution and frame-rate changes via Quartus II recompile.

🌐

Software-Defined Radio Front-End

Low-cost software-defined radio front-ends benefit from the EP4CE40F29C7's 113 hardware 18x18 multipliers and 1.16 Mbit of embedded memory, which together implement digital down-conversion, FIR filtering, and FFT processing at sample rates up to 80 MSPS. The 4 PLLs generate the ADC sample clock and IF LO independently, while LVDS I/O banks handle high-speed ADC/DAC data capture. The commercial C7 speed grade is sufficient for most narrowband protocols (FM, DAB, basic LTE). Power consumption stays below 1.5 W typical, making passive cooling feasible in portable SDR enclosures.

🌐

Telecom Line Card Interface

Telecom line cards benefit from the EP4CE40F29C7's multi-standard I/O support (LVDS, LVPECL, SSTL, HSTL), which lets one device bridge legacy TDM buses, modern SERDES lanes, and backplane fabrics on a single silicon platform. The 4 PLLs derive independent clocks for each interface domain, while the dedicated DDR2 controller handles packet buffering in conjunction with external SDRAM. Compared with a bank of ASSPs, this FPGA consolidates glue logic, protocol bridges, and packet classifiers into one device, reducing board area and BOM count on dense line cards.

🎥

Embedded Vision Prototype

Embedded vision prototypes benefit from the EP4CE40F29C7's parallel MIPI-CSI-2/LVDS sensor inputs and hardware DSP pipeline, which perform real-time edge detection, histogram equalization, or simple object detection at 30-60 fps. The 1.16 Mbit of embedded RAM buffers line-scan data without spilling to external memory, while 532 I/Os allow direct connection to image sensors without a bridge ASIC. Compared with running vision algorithms on a CPU, this FPGA delivers 10-50x speedup at the same BOM cost, making it ideal for early-stage prototype evaluation before ASIC conversion.

🔧

Test & Measurement Instrumentation

Test and measurement instruments benefit from the EP4CE40F29C7's combination of 532 user I/Os, 4 PLLs, and 113 hardware multipliers, which together implement arbitrary waveform generation, pattern generation, and protocol-aware triggering. The LVDS I/O banks connect directly to high-speed DACs and ADCs, while the dedicated DDR2 controller streams captured waveforms to host memory via PCIe soft cores. Commercial C7 speed grade is adequate for instruments up to 200 MHz bandwidth, and the same F29 footprint is shared across the EP4CE30/40/55 family for design migration.

Recommended Products Summary

EP4CE40F29C8N Altera Used in: Industrial Motor Control, Test & Measurement Instrumentation EPCS16SI8N Altera Used in: Industrial Motor Control EP4CE30F29C7 lower-density variant for single-channel 1080p60 designs Used in: Video Processing Bridge EPCQ16ASI8N Altera Used in: Video Processing Bridge EP4CE40F29C6N Intel Used in: Software-Defined Radio Front-End EPCQ32ASI8N 32-Mbit AS configuration flash Used in: Software-Defined Radio Front-End EP4CE55F29C7 Altera Used in: Telecom Line Card Interface EPCQ64ASI16N 64-Mbit AS configuration memory Used in: Telecom Line Card Interface EP4CE30F19A7N Intel Used in: Embedded Vision Prototype EPCS64SI16N 64-Mbit configuration flash for larger bitstreams Used in: Embedded Vision Prototype EPCQ128ASI16N 128-Mbit AS configuration flash for complex IP Used in: Test & Measurement Instrumentation
What is the logic element count of the EP4CE40F29C7?
The EP4CE40F29C7 contains 39,600 logic elements (LEs) in the Cyclone IV E family. According to the Intel Cyclone IV Device Handbook, this places it in the mid-density tier of the family, between the EP4CE30 (29,440 LEs) and EP4CE55 (55,440 LEs) variants, suitable for moderate-complexity control and signal-processing designs.
How many user I/O pins does the EP4CE40F29C7 provide?
The EP4CE40F29C7 in its 780-ball FBGA (F29) package provides 532 user I/O pins. This is among the highest I/O counts in the Cyclone IV E family, enabling wide parallel buses, multiple high-speed LVDS channels, and rich memory interfaces simultaneously without requiring an external I/O expander.
What is the difference between EP4CE40F29C7 and EP4CE40F29C8N?
The EP4CE40F29C7 is a commercial-temperature (0C to +85C) C7 speed-grade part, while the EP4CE40F29C8N is an industrial-temperature (-40C to +100C) C8 speed-grade part. Both share the same 780-ball FBGA F29 package footprint and are pin-compatible, but the C8N offers broader thermal range at the cost of slower Fmax on internal logic.
What is the operating voltage of EP4CE40F29C7?
The EP4CE40F29C7 operates from a 1.2 V core supply and supports 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O banks. Per the Cyclone IV Device Handbook, designers must power the core before the I/O banks to avoid back-powering through the ESD diodes; failure to sequence may cause latch-up or permanent damage.
Does the EP4CE40F29C7 support DDR2 memory interfaces?
Yes, the EP4CE40F29C7 includes dedicated hard memory controller blocks supporting DDR, DDR2, SDR, and QDR II interfaces up to 200 MHz. According to the Cyclone IV External Memory Interfaces Handbook, these hard blocks deliver 2-3x the throughput of soft-logic controllers while freeing fabric resources for application logic.
How many PLLs and multipliers does the EP4CE40F29C7 have?
The EP4CE40F29C7 integrates 4 general-purpose PLLs and 113 embedded 18x18 hardware multipliers. These resources support up to four independent clock domains and roughly 113 multiply-accumulate operations per cycle, sufficient for moderate DSP pipelines in motor control and baseband processing.
Where can I download the EP4CE40F29C7 datasheet PDF?
The official EP4CE40F29C7 datasheet is available in the Intel Cyclone IV Device Handbook (document cyiv-51001) at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyiv-51001.pdf. Third-party mirrors also host the same PDF; always cross-check the device-specific ordering code on page 1 to confirm coverage.
What is the lead time for EP4CE40F29C7?
As of 2026-09-10, distributor Heisener lists EP4CE40F29C7 with a confirmed-to-be-confirmed lead time and an estimated delivery window of March 16 to March 21. DigiKey typically stocks a small buffer quantity for active Intel/Altera FPGA parts; for production volumes, request a formal quote to lock pricing and schedule.
Is EP4CE40F29C7 in stock at major distributors?
Yes, as of 2026-09-10, Heisener reports 2,608 pieces of EP4CE40F29C7 in stock at a unit price of $122.54. DigiKey and Mouser also typically list the part under the Altera brand; check Octopart for aggregated real-time stock across all authorized channels before placing a purchase order.
What is the price of EP4CE40F29C7?
The EP4CE40F29C7 unit price is approximately $122.54 at quantity 1, as of 2026-09-10, per Heisener distributor data. Bulk pricing scales down to roughly $73.52 per unit at the 1000-piece tier; volume buyers should request a quote for OEM pricing, which can drop below $60 per unit on annual contracts.
EP4CE40F29C7 vs EP4CE30F29C7 - which is better for motor control?
For 3-axis motor control with sinusoidal commutation, the EP4CE40F29C7 (39,600 LEs) is the better choice because it has roughly 34% more logic elements and 113 DSP multipliers versus the EP4CE30's 66 multipliers. The extra resources let you close timing on field-oriented control loops at 32 kHz without spilling into external co-processors.
When should I choose EP4CE40F29C7 over EP4CE55F29C7?
Choose EP4CE40F29C7 when your design fits within 39,600 logic elements and 1.16 Mbit of embedded memory. Choose EP4CE55F29C7 when you need 55,440 LEs, 2.34 Mbit of RAM, or additional DSP throughput, and are willing to accept higher unit cost and possibly longer lead time. Both share the same F29 FBGA footprint, simplifying PCB migration.
What is the best drop-in replacement for EP4CE40F29C7?
The closest drop-in replacement for EP4CE40F29C7 is EP4CE40F29C8N, which uses the same F29 780-ball FBGA package and is pin-to-pin compatible while extending the temperature range to industrial (-40C to +100C). For purely commercial-temperature designs, EP4CE40F29C7N offers identical silicon in the same footprint with minor ordering-code differences for non-RoHS-exempt inventory.
What is the Lattice Semiconductor equivalent of EP4CE40F29C7?
The Lattice ECP5-45F (LFE5U-45F-8BG554C) is a functionally similar drop-in alternative with 45,000 LUTs, 1.9 Mbit embedded memory, and a 554-ball BGA package, though the package pin count differs from the Intel 780-ball FBGA. For pin-identical drop-in replacement within the 780-ball footprint, the Lattice LCMXO2-7000HE is too small, so a true cross-package migration to Lattice ECP5 is required.
Hey Google, can the EP4CE40F29C7 replace an EP4CE30F29C7?
Yes, the EP4CE40F29C7 is fully backwards-compatible with EP4CE30F29C7 board designs because both share the same 780-ball F29 FBGA footprint, identical pinout, and the same Quartus II device support files. The 34% increase in logic elements and additional DSP blocks will simply be unused on smaller designs, so no firmware or PCB changes are required.
What are the key specifications of EP4CE40F29C7 that engineers should know?
Key specifications engineers should know: 39,600 logic elements, 1,161,216 bits embedded RAM, 113 18x18 hardware multipliers, 532 user I/Os, 4 PLLs, 1.2 V core, 780-ball FBGA F29 package, commercial 0C to +85C temperature range, C7 speed grade, and DDR/DDR2/QDR II memory interface support. Source: Intel Cyclone IV Device Handbook.

Engineering reference data for EP4CE40F29C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE40F29C7 when your design requires 30,000 to 40,000 logic elements, fits within 1.16 Mbit of embedded memory, and operates in commercial-temperature (0C to +85C) environments. It sits in the sweet spot of the Cyclone IV E family: enough logic for 3-axis motor control, mid-density video bridges, or moderate SDR front-ends, without paying for the EP4CE55's extra resources. Choose EP4CE40F29C8N for industrial-temperature deployments and EP4CE40F29C6N for cost-sensitive commercial designs that can tolerate slightly slower Fmax. For designs needing more than 40K LEs or 1.16 Mbit RAM, migrate to the EP4CE55F29C7 on the same F29 footprint. Avoid the EP4CE30F29C7 unless your design fits within 29,440 LEs - the LE headroom matters for design closure and future feature additions.

Comparison with Alternatives

Parameter This Product EP4CE40F29C8N EP4CE40F29C6 EP4CE40F29C6N EP4CE40F29I7N EP4CE55F29C7 EP4CE30F29C7
Package 780-ball FBGA (F29) 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 39,600 39,600 39,600 39,600 39,600 55,440 29,440
Embedded Memory (bits) 1,161,216 1,161,216 1,161,216 1,161,216 1,161,216 2,340,000 608,256
18x18 Multipliers 113 113 113 113 113 154 66
User I/Os 532 532 532 532 532 532 532
PLLs 4 4 4 4 4 4 4
Operating Temperature 0C to +85C (Commercial) -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial)
Speed Grade C7 C8 C6 C6 I7 C7 C7

Key Differentiators

  • Highest user I/O count in mid-density Cyclone IV E tier (vs EP4CE30F29C7 (29,440 LEs))
  • Direct upgrade path to higher-density family member (vs EP4CE55F29C7 (55,440 LEs))
  • C7 speed grade balance of Fmax and cost (vs EP4CE40F29C6 (C6 speed grade))

Design Notes

The EP4CE40F29C7 requires a tightly regulated 1.2 V core supply capable of delivering up to 1.5 A peak during configuration transitions. Power-sequence the 1.2 V core before the 2.5/3.3 V I/O banks to prevent back-powering through ESD diodes, which can cause latch-up. Place 100 nF ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a bulk 10 µF tantalum or polymer cap per supply rail. Designers using the Cyclone IV device handbook recommendation should budget for at least 4-layer PCB with a dedicated ground plane.

Estimated: At a typical industrial workload (50% logic utilization, 100 MHz clock, DDR2 interface active), the EP4CE40F29C7 dissipates roughly 1.0 to 1.4 W. The 780-ball FBGA has a theta_JA of approximately 15 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of 15-21C. For enclosed designs with poor airflow, derate to C6 speed grade or attach a small copper heat spreader over the top of the BGA. Always cross-check with the official Cyclone IV thermal model for your specific board stack-up.

The 780-ball F29 FBGA has a 1.0 mm ball pitch requiring laser-drilled microvia stack-ups or 4-mil trace/space on outer layers. Route all differential pairs (LVDS, LVPECL) with 100 ohm differential impedance and length matching within 150 mils. Keep the JTAG chain (TCK/TMS/TDO/TDI) under 6 inches total to avoid signal integrity issues at 30 MHz configuration clock. Provide a clear keep-out zone beneath the BGA for escape vias; Intel provides reference PCB stack-ups in AN 542.

Three pitfalls to avoid: (1) Do not program the EPCS configuration flash with a bitstream larger than 16 Mbit without using EPCQ devices - the EPCS auto-detect logic will reject mismatched densities. (2) Do not leave unused I/O banks floating - configure as output drive low or input tri-state with weak pull-up to prevent oscillation. (3) Do not skip the CONF_DONE pull-up resistor; without it, the FPGA may fail to assert configuration done and appear non-responsive. Refer to the Cyclone IV Configuration Handbook for full checklists.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free status confirmed via distributor listings. Halogen-free status not explicitly listed in available data - marked unknown. Cyclone IV E family is not AEC-Q100 qualified; for automotive applications, consider Cyclone IV GX or later families.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CE40F29C7 EP4CE40F29C8N EP4CE40F29C6 EP4CE40F29C6N EP4CE40F29I7N EP4CE55F29C7 EP4CE30F29C7 FPGA field-programmable gate array Cyclone IV E logic element logic array block M9K memory block DSP block 18x18 multiplier embedded memory PLL phase-locked loop DDR2 memory controller LVDS LVPECL SSTL HSTL JTAG Active Serial configuration EPCS configuration flash FBGA package 780-ball F29 BGA 1.0 mm ball pitch Quartus II design software RoHS compliant industrial temperature commercial temperature 60 nm process 1.2 V core voltage PCIe soft core
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