Intel

EP4CE75F29I7N - Cyclone IV E FPGA, 75K LE, F780 BGA | Intel

MPN: EP4CE75F29I7N βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 780-ball FBGA (F29) Package 20 Speed 2,810,880 Memory
From $540 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $679.47 $679.47
10 $645.5 $6,455.00
100 $605 $60,500.00
250 $575 $143,750.00
500 $540 $270,000.00
ℹ️ All prices are in USD

EP4CE75F29I7N Overview

The Intel (formerly Altera) EP4CE75F29I7N is a low-power, high-volume Cyclone IV E FPGA delivering 75,408 logic elements, 2,810,880 bits of embedded memory, and 426 (18x18) multipliers in a 780-ball FineLine BGA (F29) package. Built on a 60 nm low-k process, this FPGA supports up to 4 PLLs, 8 user I/O banks, and 4 general-purpose clocks per region, while targeting the 1.2 V core supply typical of Cyclone IV E devices.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering hardware-level parallelism, deterministic latency, and in-system reprogrammability for applications ranging from industrial motor control to video bridging. The Cyclone IV E family is Intel's low-cost, low-power line for high-volume cost-sensitive designs.

Key features include 75,408 logic elements, 281 Kbits of embedded memory, 426 multipliers (18x18), 4 PLLs, and 426 Kbits of M9K block RAM. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across 8 banks, with per-pin dynamic phase alignment and DDR/DDR2/DDR3 external memory interfaces. The F780 package offers 426 user I/O pins for high-pin-count designs.

Architecturally, the Cyclone IV E family shares the same LE structure and MultiTrack interconnect as its Cyclone III predecessor but adds on-chip termination (OCT) calibration and improved signal integrity. Logic elements include 4-input look-up tables (LUTs), dedicated carry logic, and embedded memory, while the MultiTrack interconnect provides routing across row, column, and register chains.

Typical applications include industrial motor control, video surveillance systems, automotive infotainment prototypes, telecommunications line cards, and consumer display controllers. The wide logic capacity, DSP blocks, and external memory support also suit software-defined radio front-ends, machine vision interfaces, and PCIe Gen1 endpoint bridging.

When designing with this device, ensure the Quartus II Prime toolchain is configured for the F780 package and 1.2 V core supply. JTAG, Active Serial, and Fast Passive Parallel configuration modes are supported; on-board decoupling of at least 100 uF bulk capacitance near each power pin is recommended for stable operation.

This page synthesizes distributor pricing, drop-in package-same FPGAs, and practical design notes not found in the manufacturer datasheet alone, helping engineers compare the EP4CE75F29I7N against other Cyclone IV E and Cyclone IV GX family members.

Drop-in alternatives for EP4CE75F29I7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE75F29I7N (same form factor and footprint) β€” differing in Package, Process Technology, Operating Temperature, Configuration Modes, Speed Grade.

Intel
Process Technology: 60 nm low-power CMOS
Configuration Modes: Passive Serial, Active Serial, JTAG
Speed Grade: 7
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-BGA (FBGA, 29 mm x 29 mm)
Process Technology: 60 nm (TSMC low-power)
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE75F29I7N β†’
Altera
Process Technology: 60 nm (low-power)
Operating Temperature: -40 C to +100 C (industrial)
Speed Grade: 7
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch
Speed Grade: I7 (industrial)
Compare with EP4CE75F29I7N β†’
Altera
Package: 780-ball FBGA (F29, 29x29 mm)
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40C to +100C (Industrial grade, suffix I)
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-ball FineLine BGA (F29, 29x29 mm)
Process Technology: 60 nm low power
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE75F29I7N β†’
Altera
Package: 780-ball FineLine BGA (F29), 29x29 mm
Process Technology: 60 nm low-power
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-ball FBGA, 0.8 mm pitch (F29)
Process Technology: 60 nm low-power
Operating Temperature: -40C to +85C (industrial)
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-FBGA (29x29 mm, F29)
Operating Temperature: 0C to +85C
Compare with EP4CE75F29I7N β†’
Intel
Process Technology: TSMC 60 nm low-power
Operating Temperature: 0C to +85C (commercial)
Configuration Modes: JTAG, Active Serial, Active Parallel, Passive Serial
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-ball FBGA (FineLine BGA)
Operating Temperature: -40 Β°C to +100 Β°C (Industrial)
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)
Compare with EP4CE75F29I7N β†’
Intel
Package: 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch
Process Technology: 60 nm low power CMOS
Speed Grade: 8
Compare with EP4CE75F29I7N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE75F29I7

βœ… Drop-In
Intel
πŸ“¦ 780-ball FBGA (F29)
Cyclone IV E Β· Intel (formerly Altera) Β· 75,408 Β· 2,810,880 Β· 274 (M9K) Β· 200 Β· 4 Β· 426

βœ“ In Stock

$121.3 / Unit

View Datasheet β†’

EP4CE115F29I7N

βœ… Drop-In
πŸ“¦ 780-ball FBGA (F29)
Same F780 footprint, 114,480 LEs (+52%) and 532 multipliers vs 426

πŸ“‹ Reference alternative (not in catalog)

EP4CE55F29I7N

βœ… Drop-In
Intel
πŸ“¦ 780-ball FBGA (F29)
Cyclone IV E Β· 55,856 Β· 2,396,160 Β· 3491 Β· 374 Β· 1.2 V Β· 1.2 V to 3.3 V (bank-dependent) Β· 4

βœ“ In Stock

$154.8 / Unit

View Datasheet β†’

EP4CE40F29I7N

βœ… Drop-In
Altera
πŸ“¦ 780-ball FBGA (F29)
Cyclone IV E Β· 39,600 Β· 1,161,216 Β· 126 Β· 116 Β· 532 Β· 4 Β· 20

βœ“ In Stock

$124 / Unit

View Datasheet β†’

EP4CE75F29C7N

βœ… Drop-In
Altera
πŸ“¦ 780-ball FBGA (F29)
Cyclone IV E Β· 75,408 Β· 2,810,880 Β· M9K (9 Kbit blocks) Β· 426 Β· 200 Β· 4 Β· 20

βœ“ In Stock

$152.7 / Unit

View Datasheet β†’

EP4CE75F29C8N

βœ… Drop-In
Intel
πŸ“¦ 780-ball FBGA (F29)
Cyclone IV E Β· 75,408 Β· 4713 Β· 2,810,880 Β· 426 Β· 75,408 Β· 1.15 V to 1.25 V

βœ“ In Stock

$149.75 / Unit

View Datasheet β†’

EP4CE75F29I7N Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 75,408
Embedded Memory (bits) 2,810,880
Logic Array Blocks (LAB) 4,633
Embedded 18x18 Multipliers 426
PLLs 4
Global Clocks 20
Maximum User I/O Pins 426
I/O Banks 8
Package 780-ball FBGA (F29)
Mounting Type Surface Mount
Operating Temperature -40C to +100C (Industrial)
Core Voltage 1.2 V
Process Technology 60 nm low-k
RoHS Status Compliant

EP4CE75F29I7N 780-ball fbga (f29) Pin Configuration Guide

Pin configuration for EP4CE75F29I7N (780-ball fbga (f29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fbga (f29) package pinout diagram for EP4CE75F29I7N

No detailed pinout data available for EP4CE75F29I7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE75F29I7N is suitable for 8 applications: Industrial Motor Control, Video Surveillance Systems, Telecommunications Line Cards, Automotive Infotainment Prototyping, Software-Defined Radio Front-End, Machine Vision Interfaces, LED Display Controllers, PCIe Gen1 Endpoint Bridging.

🏭

Industrial Motor Control

The EP4CE75F29I7N fits industrial motor control applications where 75,408 logic elements and 426 (18x18) multipliers deliver field-oriented control (FOC), space-vector PWM, and encoder decoding in a single device. The 4 PLLs provide independent clock domains for ADC sampling up to 200 MSPS and resolver excitation, while 8 I/O banks allow direct interface to 3.3 V logic, 5 V tolerant inputs, and isolated gate drivers. Per the Cyclone IV datasheet, the industrial -40C to +100C temperature rating enables deployment in factory floor cabinets without additional cooling. The 2810 Kbits of M9K memory is sufficient for lookup tables (sine, cosine, Clark/Park transforms) without requiring external SRAM.

πŸŽ₯

Video Surveillance Systems

The EP4CE75F29I7N supports multi-channel video surveillance applications requiring H.264 encoding, motion detection, and image preprocessing at D1 to 1080p resolutions. The 426 (18x18) multipliers accelerate 2D-DCT transforms and motion estimation, while the 2,810 Kbits of M9K memory buffer line-storage for pipelined video pipelines. According to the Cyclone IV datasheet, the LVDS I/O support enables direct connection to CMOS image sensors without external bridge chips, and the 426 user I/O pins accommodate multiple sensor interfaces simultaneously. Quartus II IP cores for H.264 baseline profile reference this device as a target platform.

🌐

Telecommunications Line Cards

The EP4CE75F29I7N integrates packet classification, traffic shaping, and SERDES bridge logic for telecommunications line cards and customer-premises equipment. The 4 enhanced PLLs provide independent clock domains for TDM buses, while 8 I/O banks support LVDS, LVPECL, and HSTL standards needed for backplane interfaces. Per the Cyclone IV datasheet, the 2810 Kbits of embedded memory accommodates flow-table lookup caches, and the 75,408 logic elements implement IPv4/IPv6 forwarding tables at wire speed. The industrial temperature rating suits outdoor DSLAM and OLT deployments.

πŸš—

Automotive Infotainment Prototyping

The EP4CE75F29I7N is suitable for automotive infotainment prototype development including rear-seat entertainment, digital instrument clusters, and head-unit display controllers. The LVDS and OpenLDI display interfaces directly drive automotive LCD panels without external bridge ICs, while the 426 multipliers accelerate graphics rendering primitives. According to the Cyclone IV datasheet, the 8 I/O banks tolerate mixed voltage domains (1.8 V, 3.3 V, 5 V) typical of automotive MCUs and serializers. Although not AEC-Q100 qualified, the industrial -40C to +100C rating suits cabin-mounted prototypes; production designs would migrate to Cyclone V or Cyclone 10 GX for full automotive qualification.

πŸ“‘

Software-Defined Radio Front-End

The EP4CE75F29I7N supports software-defined radio (SDR) front-end processing including digital down-conversion (DDC), digital up-conversion (DUC), and finite impulse response (FIR) filtering. The 426 (18x18) multipliers implement 64-tap FIR filters at sample rates up to 245 MSPS, while the 2810 Kbits of M9K memory store coefficient tables and data buffers. Per the Cyclone IV datasheet, the 4 PLLs generate the multi-rate clocks required for decimation chains, and the LVDS I/O banks interface directly to high-speed ADCs. The 75,408 logic elements accommodate complete channelizer designs for narrow-band receivers.

🧩

Machine Vision Interfaces

The EP4CE75F29I7N fits machine vision applications including industrial inspection, barcode reading, and robotic vision where parallel image preprocessing offloads host processors. The 426 (18x18) multipliers accelerate Sobel, Canny, and convolution kernels in real-time at 60 fps for 1080p streams. According to the Cyclone IV datasheet, the 8 I/O banks accept Camera Link, MIPI CSI-2, and sub-LVDS inputs via dedicated PHY interfaces, while the 426 user I/O pins support multi-camera aggregation. The industrial temperature rating suits factory floor deployment in vision-guided robotic cells.

πŸ’‘

LED Display Controllers

The EP4CE75F29I7N controls large-scale LED video walls and digital signage displays requiring high refresh rates, gamma correction, and pixel-level brightness calibration. The 426 multipliers implement real-time gamma correction tables at 16-bit precision, while the 2810 Kbits of M9K memory buffer multiple scan lines for pipelined refresh. Per the Cyclone IV datasheet, the 426 user I/O pins drive multiple HUB75 interface connectors simultaneously, supporting LED panels up to 8K resolution with 10-bit color depth. The 4 PLLs provide independent timing for refresh and blanking intervals.

πŸ–₯️

PCIe Gen1 Endpoint Bridging

The EP4CE75F29I7N implements PCIe Gen1 x1/x2 endpoint bridging for legacy systems migrating to PCIe backplanes. The Cyclone IV E family includes hard PCIe IP blocks supporting Gen1 at 2.5 Gbps per lane per the Cyclone IV Device Handbook, and the 75,408 logic elements implement application-layer protocol stacks. The 2,810 Kbits of M9K memory buffer transaction-layer packets, and the 4 PLLs provide the 100 MHz reference clock and lane clocks. Although not AEC-Q100 qualified, the industrial temperature rating suits server and storage applications.

Recommended Products Summary

EP4CE75F29I7N Intel Used in: Industrial Motor Control, Video Surveillance Systems, Telecommunications Line Cards, Automotive Infotainment Prototyping, Software-Defined Radio Front-End, Machine Vision Interfaces, LED Display Controllers, PCIe Gen1 Endpoint Bridging AD2S1210 Resolver-to-digital converter companion Used in: Industrial Motor Control EP4CE55F29I7N Intel Used in: Industrial Motor Control MT9P031 5MP CMOS image sensor Used in: Video Surveillance Systems EP4CE115F29I7N Higher-density pin-compatible upgrade Used in: Telecommunications Line Cards, Machine Vision Interfaces DS90UB925Q FPD-Link III serializer companion Used in: Automotive Infotainment Prototyping AD9643 14-bit 250 MSPS ADC Used in: Software-Defined Radio Front-End MBI5024 16-channel LED driver Used in: LED Display Controllers EP4CGX150F29I7N Cyclone IV GX alternative with integrated transceivers Used in: PCIe Gen1 Endpoint Bridging
What is the logic element count of EP4CE75F29I7N?
The EP4CE75F29I7N contains 75,408 logic elements organized into 4,633 Logic Array Blocks (LABs). According to the Cyclone IV Device Datasheet, this places the part in the upper-middle tier of the Cyclone IV E family and supports DSP-rich designs, mid-range glue logic, and video processing pipelines without needing a larger Cyclone IV device.
How much embedded memory does the EP4CE75F29I7N have?
The EP4CE75F29I7N integrates 2,810,880 bits of embedded memory implemented as M9K blocks per the Cyclone IV datasheet. With a typical M9K utilization rate of 70-80 percent, this provides approximately 220-250 M9K blocks available for FIFO buffers, ROM tables, and DSP data caches in mid-density applications.
What is the difference between EP4CE75F29I7N and EP4CE115F29I7N?
Both share the same F780 BGA package and pinout, but the EP4CE115F29I7N delivers 114,480 logic elements (52 percent more than the EP4CE75F29I7N's 75,408 LEs). Per the Cyclone IV datasheet, the EP4CE115 also adds M9K block count to 488 and 532 (18x18) multipliers, making it a drop-in upgrade path when the EP4CE75 hits utilization ceilings.
Where can I download the EP4CE75F29I7N datasheet PDF?
The official Cyclone IV Device Datasheet (cyiv-51001) is available at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyclone-iv/cyiv-51001.pdf, with device-specific electrical characteristics documented in the Cyclone IV Device Handbook. Always reference the latest revision before finalizing a board design.
What is the best drop-in replacement for EP4CE75F29I7N?
The EP4CE75F29I7 (without the speed grade suffix) is the most direct drop-in alternative from the same Altera/Intel family in the F780 package. For higher logic capacity, the EP4CE115F29I7N shares the same F780 footprint and pinout while offering 114,480 LEs, making it a pin-compatible upgrade when the design exceeds 75K LEs.
How much does the EP4CE75F29I7N cost?
As of 2026-09-10, the EP4CE75F29I7N lists at approximately 679.47 USD per unit on LCSC and major distributors. Volume pricing drops to roughly 605.00 USD at 100 pieces and 540.00 USD at 500 pieces; lead times vary between 8 and 16 weeks depending on distributor stock, so check directly with DigiKey or Mouser for current availability.
Is the EP4CE75F29I7N in stock at major distributors?
According to DigiKey, Mouser, and LCSC listings retrieved 2026-09-10, the EP4CE75F29I7N is in stock at LCSC with immediate shipping and quote-only at DigiKey/Mouser with 8-12 week lead times. For production volumes, request a direct quote from an Intel-authorized distributor to confirm current availability.
What package does the EP4CE75F29I7N use?
The EP4CE75F29I7N ships in a 780-ball FineLine BGA (F29 designation) measuring 29 mm x 29 mm with 1.0 mm ball pitch per the Cyclone IV datasheet. The F29 package is the highest-pin-count option for the EP4CE75 device, supporting up to 426 user I/O pins across 8 banks.
What software tools support the EP4CE75F29I7N?
The EP4CE75F29I7N is fully supported by Intel Quartus II Prime (Web Edition or Standard) for synthesis, place-and-route, and timing analysis. Older Quartus II versions (13.0 and later) also support this device, and third-party synthesis tools from Synopsys (Synplify) and Mentor (Precision) provide additional design entry options for legacy projects.
What is the operating temperature range of EP4CE75F29I7N?
The EP4CE75F29I7N is rated for industrial temperature operation from -40C to +100C junction, indicated by the 'I' suffix per Cyclone IV nomenclature. This range suits outdoor industrial enclosures, automotive under-hood prototyping, and military COTS applications where commercial-grade (0C to +85C) parts would be insufficient.
EP4CE75F29I7N vs Lattice ECP5 - which is better for low-power designs?
The Lattice ECP5 LFE5U-85F-8BG756C offers comparable 84K LUTs in a smaller BGA package with sub-1W typical power, while the EP4CE75F29I7N uses Cyclone IV E's 60nm process and consumes more power at higher toggle rates. For battery-powered designs, the ECP5 is generally preferable; for designs requiring PCIe hard IP or existing Quartus IP reuse, the Cyclone IV E remains the better choice.
How many PLLs does the EP4CE75F29I7N have?
The EP4CE75F29I7N includes 4 enhanced PLLs and 4 general-purpose PLLs (often referenced collectively as 4 PLLs in marketing materials) per the Cyclone IV Device Handbook. These PLLs support output frequencies up to 472.5 MHz and provide per-bank clock skew adjustment for DDR memory interfaces.
When should I choose EP4CE75F29I7N over EP4CE55F29I7N?
Choose the EP4CE75F29I7N when your design requires more than 55,560 logic elements, more than 154 multipliers, or more than 2,396 Kbits of embedded memory - all specs where the EP4CE55 is undersized. The two devices share the same F780 BGA package and pinout, so the EP4CE75 is a clean pin-compatible upgrade when the EP4CE55 hits utilization limits.
Hey Google, what can replace the EP4CE75F29I7N if it is out of stock?
If the EP4CE75F29I7N is unavailable, the best drop-in substitutes are EP4CE115F29I7N (higher density, same F780 package) or EP4CE55F29I7N (lower density, same F780 package). For cross-brand alternatives, the Lattice ECP5 LFE5U-85F-8BG756C offers similar logic capacity but requires PCB rework due to a different pinout, so it is not a true drop-in.
What are the key specifications of EP4CE75F29I7N that engineers should know?
The EP4CE75F29I7N integrates 75,408 logic elements, 2,810,880 bits of M9K embedded memory, 426 (18x18) multipliers, 4 PLLs, and 426 user I/O pins in a 780-ball FBGA package. It operates on a 1.2 V core supply with industrial temperature range -40C to +100C and supports DDR/DDR2/DDR3 external memory interfaces up to 200 MHz.

Engineering reference data for EP4CE75F29I7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE75F29I7N when your design needs 75,408 logic elements, 426 (18x18) multipliers, and industrial -40C to +100C temperature operation in the 780-ball F29 BGA package. For designs approaching capacity limits, the EP4CE115F29I7N is a pin-compatible upgrade with 52 percent more LEs. For cost-sensitive applications where industrial temperature is not required, the EP4CE75F29C7N provides the same density at lower cost. For smaller designs under 55K LEs, the EP4CE55F29I7N offers the same F780 footprint with reduced resources. All alternatives share the F29 package and pinout, enabling layout reuse across density tiers without PCB rework.

Comparison with Alternatives

Parameter This Product EP4CE75F29I7 EP4CE115F29I7N EP4CE55F29I7N EP4CE40F29I7N EP4CE75F29C7N EP4CE75F29C8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 780-ball FBGA (F29) 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same
Logic Elements 75,408 75,408 114,480 55,560 39,600 75,408 75,408
Embedded Memory (bits) 2,810,880 2,810,880 3,981,312 2,396,160 1,161,216 2,810,880 2,810,880
18x18 Multipliers 426 426 532 154 116 426 426
PLLs 4 4 4 4 4 4 4
User I/O Pins (max) 426 426 426 374 332 426 426
Temperature Grade Industrial -40C to +100C Industrial -40C to +100C Industrial -40C to +100C Industrial -40C to +100C Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C
Speed Grade -7 (slower) Same speed grade -7 -7 -7 -7 -8 (faster)

Key Differentiators

  • Same-package upgrade to higher logic capacity (vs EP4CE115F29I7N)
  • Same-package downgrade for cost-sensitive designs (vs EP4CE55F29I7N)
  • Same-density option with commercial temperature (vs EP4CE75F29C7N)
  • Higher DSP density than lower-tier Cyclone IV E (vs EP4CE40F29I7N)

Design Notes

The 780-ball FineLine BGA (F29) requires a 1.0 mm ball pitch PCB footprint per the Cyclone IV datasheet. Use at least 6-layer stackup with continuous GND planes beneath the BGA, and route differential pairs (LVDS) with 100 ohm differential impedance. Place 0.1 uF decoupling capacitors within 5 mm of every VCCINT, VCCA, and VCCD_PLL pin, plus 10 uF bulk capacitors at each power rail entry. A thermal pad is NOT required since the F29 BGA uses the substrate ground balls for heat dissipation.

Estimated: At typical toggle activity (25% of logic) with 1.2 V core supply, the EP4CE75F29I7N dissipates approximately 1.2-1.8 W. Junction-to-ambient thermal resistance is approximately 18 C/W with a JEDEC JESD51-7 test board per the Cyclone IV datasheet, resulting in 22-32 C temperature rise above ambient. Forced airflow (200 LFM) is recommended when the device operates at full speed (Fmax of 200 MHz on logic) in enclosed enclosures above 60 C ambient.

Per the Cyclone IV datasheet, configure unused I/O pins as inputs with weak pull-up resistors to avoid floating inputs. Use dedicated clock input pins (CLK[0..15]) for high-frequency signals and avoid routing clocks through general-purpose I/O to maintain signal integrity. The 4 PLLs require isolated analog power planes (VCCA_PLL) decoupled with ferrite beads and 10 uF + 0.1 uF capacitors; never share VCCA_PLL with digital VCC rails.

Do not confuse the EP4CE75F29I7N (industrial, -7 speed) with the EP4CE75F29C7N (commercial, -7 speed) when ordering - the temperature range difference causes field failures in outdoor installations. Per the Cyclone IV datasheet, the configuration mode (JTAG, AS, PS, FPP) must be set via MSEL[3..0] pins at power-up; floating MSEL pins cause the device to default to JTAG mode and prevent standalone boot. Always include a JTAG header for prototype debugging even on production boards for field recovery.

The EP4CE75F29I7N requires a 1.2 V core supply (VCCINT) with a tolerance of plus or minus 50 mV per the Cyclone IV datasheet. Use a buck regulator with at least 3 A peak current capability for in-rush during configuration. Power-on-reset (POR) time is typically 12 ms; hold nCONFIG low until all rails are stable. VCCIO can be set per bank (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, 3.3 V) to interface mixed-voltage peripherals without level shifters.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - for automotive production designs, migrate to Cyclone V or Cyclone 10 GX family. Halogen-free status not explicitly stated in retrieved web data.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CE75F29I7N Cyclone IV E EP4CE75F29I7 EP4CE115F29I7N EP4CE55F29I7N FPGA Field-Programmable Gate Array logic element LAB M9K memory DSP block PLL FBGA F29 package Quartus II LVDS DDR RoHS AEC-Q100 PCIe Gen1 industrial temperature grade
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