EP4CE55F29I7 - Cyclone IV E FPGA, 55K LEs, 780-BGA | Intel / Altera
MPN: EP4CE55F29I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $214.18 | $214.18 |
| 10 | $195.5 | $1,955.00 |
| 100 | $168.4 | $16,840.00 |
| 250 | $152.1 | $38,025.00 |
| 500 | $139.95 | $69,975.00 |
EP4CE55F29I7 Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor IC whose digital logic function is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM. Unlike an ASIC (Application-Specific Integrated Circuit), an FPGA can be re-programmed many times, allowing rapid prototyping, in-field upgrades, and hardware acceleration. Within the broader taxonomy, the EP4CE55 belongs to the low-power CPLD/FPGA segment of programmable logic, positioned below high-performance Stratix devices but above MAX series CPLDs.
Key features include 55,856 logic elements (LEs), 2,396,160 bits (approximately 2.39 Mbit) of embedded SRAM arranged into M9K blocks, 156 hardware multipliers (18x18), four general-purpose PLLs, and 374 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports configuration via JTAG, active serial (AS), and passive serial (PS) modes. Eight user-controllable clock networks and 20 global clock networks distribute clock signals across the die.
Architecturally, Cyclone IV E devices implement an LUT-based fabric (each LE contains a 4-input LUT, a programmable register, and a carry chain) and dedicated memory blocks. The 60 nm process and 1.0 V/1.2 V core voltage yield low static and dynamic power, making this family attractive for power-constrained designs. Per the Cyclone IV Device Family Overview, the I-series temperature grade is rated for industrial ambient operation.
Typical applications include industrial motor control and factory automation, video processing and broadcast equipment, automotive driver-assistance subsystems, telecommunications line cards, and PCI Express endpoint bridging. The 780-BGA package provides ample signal pins for high-bandwidth interfaces, while industrial-grade silicon supports deployment in harsh environments.
Design consideration: thermal management on a 780-BGA requires attention to PCB stack-up and via-in-pad thermal arrays. Engineers should follow the Altera AN 484 (FPGA Thermal Management) recommendations for footprint and copper-pour design.
This page synthesizes distributor pricing, drop-in Cyclone IV E alternatives in the same F29 780-BGA footprint, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4CE55F29I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F29I7 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Modes, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F29I7N
✅ Drop-In✓ In Stock
$154.8 / Unit
View Datasheet →EP4CE55F29I8L
✅ Drop-In✓ In Stock
$131.42 / Unit
View Datasheet →EP4CE55F29C9LN
✅ Drop-In✓ In Stock
$23.85 / Unit
View Datasheet →EP4CE55F29C8LN
✅ Drop-In✓ In Stock
$78.9 / Unit
View Datasheet →EP4CE115F29I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE40F29I7N
✅ Drop-In✓ In Stock
$124 / Unit
View Datasheet →EP4CE55F29I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | FPGA - Field Programmable Gate Array |
| Logic Elements | 55,856 |
| Embedded Memory Bits | 2,396,160 (M9K blocks) |
| User I/O Count | 374 |
| Number of LABs/CLBs | 3,491 |
| 18x18 Hardware Multipliers | 156 |
| General-Purpose PLLs | 4 |
| Package | 780-BGA (FBGA, F29) |
| Operating Temperature | -40C to +100C (Industrial, I7) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.0 V / 1.2 V (per Cyclone IV handbook) |
| Configuration Modes | AS, PS, JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (per BGA JEDEC J-STD-020) |
EP4CE55F29I7 780-bga (fbga, f29) Pin Configuration Guide
Pin configuration for EP4CE55F29I7 (780-bga (fbga, f29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F29I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F29I7 is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Processing and Broadcast Equipment, Telecommunications Line Cards, Automotive Driver-Assistance Subsystems (ADAS), PCI Express Endpoint Bridging, Test and Measurement Instrumentation.
Industrial Motor Control and Factory Automation
The EP4CE55F29I7's 55,856 logic elements and 156 18x18 hardware multipliers provide the DSP throughput required for multi-axis servo control loops, while the 374 user I/Os accommodate encoder feedback, PWM outputs, and fieldbus interfaces (EtherCAT, Profinet). The industrial temperature grade (-40C to +100C) supports deployment in factory cabinets and outdoor enclosures. The four general-purpose PLLs synthesize the multiple clock domains typical of motor control (PWM carrier, ADC sampling, communication).
Recommended
Video Processing and Broadcast Equipment
The 2,396,160 bits of M9K embedded memory buffer video lines efficiently, while 55,856 LEs implement multi-tap video scalers, deinterlacers, and color-space converters. The 374 user I/Os support multiple LVDS display interfaces and parallel RGB buses common in professional broadcast gear. The 60 nm low-power process minimizes thermal load in enclosed rack-mounted chassis where the EP4CE55F29I7 typically operates continuously.
Recommended
Telecommunications Line Cards
Cyclone IV E FPGAs in the EP4CE55F29I7 tier are widely deployed in telecom line cards for SERDES bridging, TDM switching fabric interfaces, and protocol conversion (T1/E1, OC-3 front-end glue logic). The high I/O count of 374 supports multiple SFP cage interfaces and backplane connections, while embedded M9K blocks implement elastic stores and small packet buffers without external SRAM.
Recommended
Automotive Driver-Assistance Subsystems (ADAS)
The EP4CE55F29I7's industrial temperature grade and abundant logic resources support sensor fusion pre-processing for ADAS prototypes and low-volume production. The 156 hardware multipliers accelerate radar FFT and computer-vision convolution kernels, while 2.39 Mbit of embedded memory holds lookup tables and intermediate pixel rows. Designers should validate AEC-Q100 compliance per project requirements; Cyclone IV E is not formally AEC-Q100 listed.
Recommended
PCI Express Endpoint Bridging
The EP4CE55F29I7 implements the Cyclone IV E hard IP for PCI Express Gen1 x1/x2/x4 endpoints, providing protocol bridging between PCIe and local bus architectures without an external bridge ASIC. Designers commonly use this device for FPGA-based PCIe add-in cards in test & measurement, data acquisition, and prototyping platforms. The 780-BGA F29 package supports the multi-lane PCIe PHY pin assignments required for Gen1 x4 operation.
Recommended
Test and Measurement Instrumentation
The 55,856 LEs and 156 multipliers allow the EP4CE55F29I7 to implement custom DSP algorithms, protocol-aware trigger logic, and high-speed sample buffering in oscilloscopes, logic analyzers, and protocol testers. The four PLLs derive multiple synchronized clock domains from a common reference, while 374 user I/Os accommodate dense probe multiplexing. The industrial temperature range supports bench, rack, and field-portable test equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F29I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F29I7N | EP4CE55F29I8L | EP4CE55F29C9LN | EP4CE115F29I7N | EP4CE40F29I7N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BGA (F29) | 780-BGA (F29) - same | 780-BGA (F29) - same | 780-BGA (F29) - same | 780-BGA (F29) - same | 780-BGA (F29) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 114,480 | 39,600 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 3,981,312 | 1,134,720 |
| User I/Os | 374 | 374 | 374 | 374 | 528 | 532 |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | 266 | 116 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | 7 (I7) | 7 | 8 (slower) | 9 (fastest) | 7 | 7 |
| RoHS Compliance | Varies (SnPb finish) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
Key Differentiators
- Highest density tier with industrial temperature in F29 footprint (vs EP4CE40F29I7N)
- Lower cost than EP4CE115 in same F29 package (vs EP4CE115F29I7N)
- Industrial temperature grade in cost-sensitive mid-density FPGA (vs Xilinx Spartan-6 XC6SLX75)
- Hard PCIe Gen1 IP block embedded (vs Lattice ECP5 LFE5UM-85F)
Design Notes
The 780-BGA F29 package uses 1.0 mm ball pitch on a 29x29 mm body. PCB layout must use via-in-pad (VIPPO) microvias or dog-bone fanout on at least 4-6 routing layers to escape the dense BGA grid. Apply non-solder-mask-defined (NSMD) pads for better joint reliability. Maintain 50-ohm controlled impedance on high-speed LVDS and PCIe traces.
Cyclone IV E FPGAs at the EP4CE55 density tier typically dissipate 0.5 W to 2.5 W depending on logic utilization, toggle rate, and clock frequency. Estimated: at 70% utilization and 200 MHz, expect ~1.5 W. Provide a thermal pad array beneath the BGA center connected to an internal ground plane. Refer to Altera AN 484 for thermal via arrays under plastic BGAs.
Cyclone IV E requires three supply rails: VCCINT (1.0/1.2 V core), VCCA (2.5 V PLL analog), and VCCIO (1.2/1.5/1.8/2.5/3.0/3.3 V per bank). Use a dedicated 2.5 V LDO for VCCA to minimize PLL jitter. Decoupling: place 0.1 uF X7R capacitors on every VCC pin, plus bulk 47 uF tantalum or polymer caps near the package. Estimated: total decoupling budget ~80 caps for 780-BGA EP4CE55.
Do not mix I/O standards across VCCIO banks without verifying bank voltage assignment - each bank shares a single VCCIO rail. Cyclone IV E devices do not support hot-socketing; sequence power rails to avoid latch-up. Configuration pins MSEL[3:0] must be tied to correct levels for AS/PS/JTAG mode selection; floating MSEL pins can leave the device in an undefined state.
For LVDS signaling above 500 Mbps, use 100-ohm differential routing with matched trace lengths within 20 mils. The EP4CE55F29I7 supports LVDS inputs via dedicated serializer/deserializer blocks; reference the Cyclone IV Device Handbook Volume 2 for LVDS data rate limits per I/O bank placement. PCIe Gen1 x4 requires matched 85-ohm impedance; verify stack-up with your board fabricator.
Compliance Information
EP4CE55F29I7 (without 'N' suffix) historically shipped with SnPb ball finish for legacy non-RoHS manufacturing; the EP4CE55F29I7N variant is the lead-free RoHS-compliant equivalent. Cyclone IV E family is not AEC-Q100 qualified - for automotive applications, validate with manufacturer or select an AEC-Q100-qualified FPGA such as Cyclone IV GX automotive variants.
