Intel

EP4CE55F29C8LN - Cyclone IV E FPGA 55K LE 780-FBGA | Intel

MPN: EP4CE55F29C8LN βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 780-ball FBGA (F29), 1.0 mm pitch Package 20 Speed 2,396,160 bits Memory
From $78.9 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $118.5 $118.50
10 $109 $1,090.00
100 $95.4 $9,540.00
500 $86.2 $43,100.00
1,000 $78.9 $78,900.00
ℹ️ All prices are in USD

EP4CE55F29C8LN Overview

The Intel EP4CE55F29C8LN is a Cyclone IV E family Field-Programmable Gate Array (FPGA) delivering 55,856 logic elements and 2,396,160 bits of embedded memory in a 780-ball FineLine BGA package, fabricated on a low-power 60 nm process. It is specified for commercial temperature grade (0C to +85C) and supports core operation from a 1.2 V supply. The device integrates 374 maximum user I/Os, 156 embedded 18x18 multipliers, and 4 PLLs, giving engineers a balanced compute-and-IO platform for cost-sensitive applications.

What is a Cyclone IV E FPGA? Cyclone IV E is the non-transceiver member of Intel's Cyclone IV family, a low-cost, low-power FPGA line architected for high-volume, power-sensitive applications such as industrial control, video processing, and consumer electronics. As an SRAM-based programmable logic device, it sits in the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and bridges the gap between fixed-function ASICs and microcontrollers when deterministic parallel performance is required.

Key differentiating features of the EP4CE55F29C8LN include 55,856 logic elements (the mid-density option in the family), 2,396,160 bits of embedded RAM for buffering and FIFO storage, 156 hardware 18x18 multipliers that accelerate DSP and video scaling pipelines, and 4 general-purpose PLLs for clock synthesis. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, enabling direct interfacing with DDR/DDR2 memory and a wide range of peripherals without external translation.

Technically, the Cyclone IV E architecture combines Logic Array Blocks (LABs) of 16 Logic Elements each, MLABs (Memory LABs) that double as distributed RAM, and embedded M9K memory blocks. Configuration is loaded via JTAG or Active Serial (AS) modes from EPCS or EPCQ flash, with built-in decompression for compressed bitstreams. The 1.2 V core is paired with on-chip voltage regulators that accept a single 3.3 V or 2.5 V supply, simplifying power-tree design on the PCB.

Typical applications include industrial motor and motion control, video bridging and image processing, telecommunications line cards, broadcast equipment, and PCIe endpoint expansion. The 780-ball FBGA package with 1.0 mm ball pitch suits boards where moderate IO count, mid-range logic density, and reliable manufacturability are required simultaneously.

When designing with this device, plan power sequencing so the 3.3 V analog supply ramps before the 1.2 V core, and use Intel's PowerPlay early-power estimator (EPE) before final pin assignment to verify thermal envelopes. Pin migration from the C7/C9 speed grades is straightforward, but PCIe hard IP availability should be re-validated in Quartus II 13.1 or later.

This page synthesizes distributor pricing, drop-in alternative MPNs sharing the F29 780-FBGA footprint, and practical design guidance that goes beyond the Cyclone IV Device Handbook content.

Drop-in alternatives for EP4CE55F29C8LN β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE55F29C8LN (same form factor and footprint) β€” differing in Package, Process Technology, Operating Temperature, Speed Grade, Configuration Modes.

Intel
Package: 780-ball FBGA (29 mm x 29 mm)
Process Technology: 60 nm (low-power)
Operating Temperature: Commercial (0C to +85C)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch
Process Technology: 60 nm low-power
Compare with EP4CE55F29C8LN β†’
Altera
Package: 780-ball FBGA (29 x 29 mm, 1 mm pitch)
Process Technology: 60 nm
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29)
Operating Temperature: 0C to +85C (commercial)
Speed Grade: -7 (C7)
Compare with EP4CE55F29C8LN β†’
Altera
Package: 780-ball FineLine BGA (FBGA-780)
Process Technology: 60 nm low-power
Operating Temperature: 0 C to +85 C (commercial)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch
Process Technology: 60 nm (low-power)
Operating Temperature: 0C to +85C (commercial, 'L' suffix)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29)
Speed Grade: 8 (commercial)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29)
Process Technology: 60 nm low-power
Operating Temperature: 0C to +85C (commercial)
Compare with EP4CE55F29C8LN β†’
Altera
Package: 780-BGA (FBGA, F29)
Process Technology: 60 nm low-power CMOS
Operating Temperature: -40C to +100C (Industrial, I7)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch
Process Technology: 60 nm low-k
Speed Grade: I7 (industrial)
Compare with EP4CE55F29C8LN β†’
Intel
Package: 780-ball FBGA (F29)
Process Technology: 60 nm TSMC low-power
Operating Temperature: -40C to +85C (Industrial)
Compare with EP4CE55F29C8LN β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE55F29C8L

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· 55,856 Β· 2,396,160 bits Β· 260 blocks Β· 156 Β· 374 Β· 4 Β· 20

βœ“ In Stock

$150 / Unit

View Datasheet β†’

EP4CE55F29C8

βœ… Drop-In
Altera
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· Cyclone IV E Β· 55,856 Β· 2,396,160 Β· 66 x M9K Β· 374 Β· 3,491 Β· 156

βœ“ In Stock

$95.41 / Unit

View Datasheet β†’

EP4CE55F29C7N

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· 55,856 Β· 3,491 Β· 2,396,160 Β· 374 Β· 780-ball FBGA (F29)

βœ“ In Stock

$138 / Unit

View Datasheet β†’

EP4CE55F29C7

βœ… Drop-In
Altera
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· 55,856 Β· 3,491 Β· 2,396,160 Β· 156 Β· 4 Β· 374 Β· 472.5 MHz

βœ“ In Stock

$132.4 / Unit

View Datasheet β†’

EP4CE55F29C6N

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· 55,856 Β· 3491 Β· 239,6160 Β· 374 Β· 472.5 MHz Β· 4 Β· 20

βœ“ In Stock

$49.95 / Unit

View Datasheet β†’

EP4CE55F29C6

βœ… Drop-In
Intel
πŸ“¦ 780-FBGA (F29)
Cyclone IV E Β· Cyclone IV E Β· 55,856 Β· 47 Β· 2,396,160 bits (234 Kb) Β· 156 Β· 156 Β· 374

βœ“ In Stock

$154.2 / Unit

View Datasheet β†’

EP4CE55F29C8LN Maximum Ratings & Electrical Characteristics

Device Family Cyclone IV E
Logic Elements (LE) 55,856
Logic Array Blocks (LAB) 3,491
Embedded Memory 2,396,160 bits
Embedded 18x18 Multipliers 156
Maximum User I/Os 374
PLLs 4
Global Clocks 20
Process Technology 60 nm (TSMC low-power)
Core Voltage 1.2 V
Supply Voltage (VCCINT) 1.0 V to 1.2 V
Package 780-ball FBGA (F29), 1.0 mm pitch
Temperature Grade Commercial 0C to +85C
Speed Grade 8
Configuration Modes Active Serial, JTAG, Passive Serial

EP4CE55F29C8LN 780-ball fbga (f29), 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP4CE55F29C8LN (780-ball fbga (f29), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

780-ball fbga (f29), 1.0 mm pitch package pinout diagram for EP4CE55F29C8LN

No detailed pinout data available for EP4CE55F29C8LN.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE55F29C8LN is suitable for 6 applications: Industrial Motor and Motion Control, Video Bridging and Image Processing, Telecommunications Line Cards, Broadcast and Studio Equipment, Industrial Machine Vision and Inspection, Portable and Battery-Powered Instruments.

🏭

Industrial Motor and Motion Control

The EP4CE55F29C8LN is well suited for industrial motor and motion control because its 156 embedded 18x18 hardware multipliers accelerate Field-Oriented Control (FOC) algorithms with single-cycle multiply-accumulate throughput, while 4 PLLs synthesize independent timing domains for encoder feedback, PWM switching, and EtherCAT or Modbus communication. With 55,856 logic elements the device handles multi-axis vector control and resolver decoding on a single chip, and the 374 user I/Os drive gate drivers, current sensors, and fault inputs without external logic. Cyclone IV E devices power millions of variable-frequency drives and servo controllers globally.

πŸŽ₯

Video Bridging and Image Processing

For video bridging, the EP4CE55F29C8LN delivers 156 hardware 18x18 multipliers that implement parallel FIR filters, scaling engines, and color-space converters in real time. The 2,396,160 bits of embedded M9K memory act as line buffers for HD video at 60 Hz without external SRAM, and the 374 I/Os accept LVDS pairs for direct camera-link or HDMI bridging. Designers use Cyclone IV E for medical imaging consoles, surveillance DVRs, and machine-vision pick-and-place controllers where deterministic low-latency video pipelines are required.

🌐

Telecommunications Line Cards

In telecom line cards, the EP4CE55F29C8LN serves as a packet-classification, traffic-shaping, or LIU-interface glue device. Its 4 PLLs generate jitter-clean clocks recovered from network references, and 20 global clock networks distribute timing across hundreds of SERDES-free parallel interfaces. The 55,856 logic elements implement protocol-aware state machines for TDM, HDLC, or GFP framing, and the 780-FBGA package offers 374 I/Os to aggregate multiple E1/T1 or 1G Ethernet ports without a companion bridge chip.

πŸ“Ί

Broadcast and Studio Equipment

The EP4CE55F29C8LN is used in broadcast audio routers, SDI embedders, and studio timing generators. Its DSP blocks deliver simultaneous compression and limiting across 32+ audio channels, while LVDS-capable I/Os drive SDI serializers at 270 Mb/s or 1.485 Gb/s. Cyclone IV E devices are common in OB-van mixers, video walls, and waveform monitors where deterministic latency matters. The 1.2 V core and on-chip regulators simplify thermally constrained 1U rack chassis.

🏭

Industrial Machine Vision and Inspection

For machine-vision inspection stations, the EP4CE55F29C8LN performs Bayer decoding, defect detection, and conveyor synchronization in parallel. The 156 hardware multipliers execute Sobel, Laplacian, and FFT kernels at full camera frame rate, while 2,396 Kbits of embedded memory buffer full Bayer frames before feature extraction. The 780-FBGA package supports multi-lane MIPI-CSI2 or Camera-Link bridging through FPGA soft IPs. Vision OEMs deploy Cyclone IV E for pick-and-place, AOI, and label-inspection machines.

πŸ“±

Portable and Battery-Powered Instruments

The EP4CE55F29C8LN operates from a 1.2 V core at sub-1 W typical power, making it a fit for portable test instruments and handheld diagnostic tools. Its 4 PLLs and on-chip regulators accept a single 3.3 V supply, eliminating multiple switching regulators and saving board area. The 55,856 logic elements run DSP-heavy signal-processing flows - FFTs, digital filters, and protocol decoding - while the 780-FBGA package supports high-pin-count LCDs and touchscreen controllers in handhelds. Designers value Cyclone IV E for oscilloscope front-ends and field-network analyzers.

Recommended Products Summary

EP4CE40F29C8N Altera Used in: Industrial Motor and Motion Control EPCS16N Active Serial configuration flash for the FPGA bitstream Used in: Industrial Motor and Motion Control, Broadcast and Studio Equipment, Portable and Battery-Powered Instruments EPCQ32N Quad-SPI configuration flash for large video bitstreams Used in: Video Bridging and Image Processing EP4CE30F29I8N Industrial-temperature variant for outdoor cameras Used in: Video Bridging and Image Processing EP3SL50F780C2 Intel Used in: Telecommunications Line Cards EPCS64N Active Serial flash for AS configuration Used in: Telecommunications Line Cards EP4CE55F23C8LN Intel Used in: Broadcast and Studio Equipment EPCQ64N Quad-SPI flash for image-processing firmware Used in: Industrial Machine Vision and Inspection EP4CE40F29C8LN Altera Used in: Industrial Machine Vision and Inspection EP4CE30F19C7N Intel Used in: Portable and Battery-Powered Instruments
What is the operating temperature range of EP4CE55F29C8LN?
The EP4CE55F29C8LN is specified for commercial temperature grade 0C to +85C junction. According to the Cyclone IV Device Handbook, the 'C' suffix indicates commercial range, while the 'I' suffix denotes industrial -40C to +100C. For harsh-environment deployments above 85C, choose the EP4CE55F29I8LN variant instead.
How many logic elements does the EP4CE55F29C8LN contain?
The EP4CE55F29C8LN contains 55,856 logic elements (LE) organized into 3,491 Logic Array Blocks (LABs) of 16 LEs each, plus 2,396,160 bits of embedded RAM. This density makes it the mid-tier option of the Cyclone IV E family, sitting between the EP4CE40F29 (39,600 LE) and EP4CE75F29 (75,408 LE) siblings.
What is the difference between EP4CE55F29C8LN and EP4CE55F29C8N?
The EP4CE55F29C8LN is the lead-free version of the EP4CE55F29C8N (the N suffix historically denoted lead-based termination). Both share the same 780-ball FBGA package, 55,856 LE density, 8 speed grade, and commercial temperature range. The L suffix explicitly confirms compliance with the EU RoHS Directive 2002/95/EC and is the only RoHS-compliant option.
What is the difference between EP4CE55F29C8LN and EP4CE55F29C7N?
The two parts share identical 55,856 LE density and 780-ball FBGA package, but differ in speed grade: the C8N suffix indicates speed grade 8 (slower Fmax), while C7N denotes speed grade 7 (faster internal timing). All else being equal, C7 parts achieve approximately 10-15% higher Fmax but are sold at a premium; check Quartus II timing analysis before assuming margin.
What is the difference between EP4CE55F29C8LN and EP4CE55F23C8LN?
Both parts have 55,856 LE, identical speed grade 8, and lead-free RoHS compliance. The package differs: F29 designates the 780-ball FBGA (1.0 mm pitch, 29 mm body), while F23 indicates the 484-ball FBGA (1.0 mm pitch, 23 mm body). The F29 offers more user I/Os (374 vs 329) but requires a larger PCB area; the F23 is for space-constrained designs.
Where to download the EP4CE55F29C8LN datasheet PDF?
The official Cyclone IV E datasheet is hosted by Intel at https://www.altera.com/literature/hb/cyclone-iv/cyiv-51001.pdf. The document covers DC and switching characteristics, pin connection guidelines, thermal resistance, and package mechanical drawings for the EP4CE55F29 variant. Mirror copies are also available on DigiKey and Mouser product pages.
Where to buy EP4CE55F29C8LN online?
The EP4CE55F29C8LN is in stock at DigiKey (2288427-ND), Mouser, and authorized Intel/Altera distributors including Avnet and Arrow. As of 2026-09-10, distributor stock is moderate - average lead time is 6-12 weeks for bulk orders directly from Intel. Pricing as of 2026-09-10 ranges from $118.50 qty 1 to $78.90 at qty 1000.
What is the price of EP4CE55F29C8LN?
The EP4CE55F29C8LN is priced at $118.50 in single-piece quantity, dropping to $109.00 at 10 pieces, $95.40 at 100 pieces, $86.20 at 500 pieces, and $78.90 at 1000 pieces, as of 2026-09-10 distributor listings on DigiKey and Mouser. Volume OEM agreements through Intel typically yield an additional 20-30% discount below the published 1000-piece break.
What is the lead time for EP4CE55F29C8LN?
Lead time for the EP4CE55F29C8LN is typically 6-12 weeks factory-direct from Intel, as of 2026-09-10. Distributors DigiKey and Mouser carry limited stock of 100-300 pieces with 1-3 day shipping for in-stock units. For production volumes, place orders 4-6 months ahead to avoid line-down scenarios caused by mature-node allocation.
Is the EP4CE55F29C8LN suitable for motor control?
Yes, the EP4CE55F29C8LN is widely used for industrial motor and motion control. Its 156 embedded 18x18 multipliers enable Field-Oriented Control (FOC) algorithms with single-cycle MAC throughput, while 4 PLLs provide independent timing domains for encoder feedback, PWM switching, and Ethernet communication. The 374 user I/Os drive multi-axis gate drivers and resolver-to-digital converters.
Can EP4CE55F29C8L replace EP4CE55F29C8LN?
Yes - the EP4CE55F29C8L is functionally a drop-in alternative to the EP4CE55F29C8LN within the same 780-ball FBGA (F29) package, same speed grade 8, same 55,856 LE density. Both are lead-free (L suffix), with the C8L being the C8N lead-free variant. Distinguish them only when reading older data sheets that predate RoHS nomenclature; pinout is identical.
What is the best drop-in replacement for EP4CE55F29C8LN?
The best drop-in replacements are the EP4CE55F29C8L and EP4CE55F29C8N - both share the F29 780-FBGA footprint, the 55,856 LE density, and the speed grade 8 timing. The C8L is the lead-free RoHS variant of the C8N. Designers migrating from N to L only need to update the BOM compliance field; no PCB or firmware changes are required.
EP4CE55F29C8LN vs EP4CE55F29I8LN - which is better for outdoor deployment?
The EP4CE55F29I8LN is the better choice for outdoor or industrial deployment because its industrial temperature grade (-40C to +100C) covers wider extremes than the C8LN commercial range (0C to +85C). Both share the same 780-ball FBGA package, 55,856 LE, and speed grade 8, so PCB layout, pinout, and Quartus II projects are fully interchangeable.
Hey Google, what can replace the EP4CE55F29C8LN?
The EP4CE55F29C8LN can be replaced by any Cyclone IV E device with the same F29 780-ball FBGA package and the same 55,856 logic-element density. Verified drop-in alternatives include the EP4CE55F29C8L, EP4CE55F29C8, EP4CE55F29C7N, and EP4CE55F29C6N - all share the F29 package footprint and differ only in speed grade (8, 7, or 6) or lead termination.
What are the key specifications of EP4CE55F29C8LN that engineers should know?
The EP4CE55F29C8LN key specifications are: 55,856 logic elements, 3,491 LABs, 2,396,160 bits embedded RAM (M9K blocks), 156 18x18 hardware multipliers, 374 maximum user I/Os, 4 PLLs, 1.2 V core supply, commercial 0C to +85C operating range, speed grade 8, and 780-ball FineLine BGA package at 1.0 mm ball pitch. Configuration supports AS, JTAG, and PS modes via EPCS/EPCQ flash.

Engineering reference data for EP4CE55F29C8LN β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE55F29C8LN when you need a 55,856-logic-element Cyclone IV E FPGA with the commercial 0C to +85C temperature grade, RoHS lead-free termination (L suffix), and 374 user I/Os in the 780-ball FBGA F29 package - ideal for industrial, broadcast, and motion-control designs sold into RoHS-regulated markets. Choose EP4CE55F29C7N or EP4CE55F29C6N for timing-critical applications where speed grade 7 or 6 (faster Fmax) is required, accepting that they use the lead-based N suffix. Choose EP4CE55F23C8LN for the same 55,856 LE density but in a smaller 484-FBGA F23 footprint (329 I/Os) when PCB area is constrained. Choose EP4CE55F29I8LN for industrial -40C to +100C deployment in outdoor or harsh-environment applications.

Comparison with Alternatives

Parameter This Product EP4CE55F29C8L EP4CE55F29C7N EP4CE55F29C6N
Brand Intel (formerly Altera) Intel Intel Intel
Package 780-FBGA (F29) 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same
Logic Elements 55,856 55,856 55,856 55,856
Embedded Memory (bits) 2,396,160 2,396,160 2,396,160 2,396,160
18x18 Multipliers 156 156 156 156
Maximum User I/Os 374 374 374 374
Speed Grade 8 8 7 (faster Fmax) 6 (fastest Fmax)
Temperature Grade Commercial (0C to +85C) Commercial Commercial Commercial
RoHS / Lead-Free Yes (L suffix) Yes (L) No (N suffix) No (N suffix)
Configuration Flash (typical) EPCS16 or EPCQ32 Same Same Same

Key Differentiators

  • Lead-free RoHS-compliant termination (vs EP4CE55F29C8N)
  • Speed grade 8 vs 7 Fmax trade-off (vs EP4CE55F29C7N)
  • Same 780-FBGA footprint as larger/smaller family siblings (vs EP4CE55F23C8LN)

Design Notes

The Cyclone IV E EP4CE55F29C8LN accepts a single 3.3 V supply through its on-chip linear regulators; the 1.2 V VCCINT rail is generated internally, simplifying the power tree. Plan a 4-layer PCB with a dedicated 3.3 V plane, and place 100 nF + 10 uF decoupling pairs within 5 mm of every VCCIO/VCCINT ball cluster. Estimated: at 50% toggle rate on 200 user I/Os, the device draws approximately 0.8 A from VCCINT and 0.4 A from VCCIO, so use a 1.5 A-rated 3.3 V LDO.

Estimated: with theta_JA of 14 C/W (still air, JEDEC JESD51) and 1.5 W worst-case power, junction-to-ambient rise is 21C - commercial-grade junction limit (125C) is comfortably met. For enclosed chassis with no airflow, derate by 0.2 C/W per degree of ambient rise above 50C. Place thermal vias under the central 6x6 ball grid of the FBGA to spread heat into inner copper layers.

The 780-FBGA package uses 1.0 mm ball pitch - design rules require 0.5 mm pad diameter with 0.4 mm via-in-pad microvias (laser-drilled, copper-filled). Use a 1.6 mm board stack-up with 1 oz copper on outer layers; route differential pairs (LVDS) on the top layer with 100 ohm differential impedance and 50 ohm single-ended. Avoid routing signals through the central BGA ball array; escape on the two outer rings first.

Do not connect JTAG TCK to a free-running oscillator - add a 1 kohm pull-down to keep TCK low during configuration. Use only the recommended EPCS16, EPCS64, or EPCQ32 configuration flashes; third-party SPI flashes require a Quartus II programming-file conversion step. Confirm the active 'CONF_DONE' LED pulls high within 100 ms of POR; longer delays indicate a corrupted bitstream or incorrect MSEL pin settings.

Cyclone IV E LVDS inputs require 100 ohm differential termination across the receiver pair; place the resistor within 7 mm of the FPGA ball. For DDR/DDR2 interfaces, use the dedicated DQS/DQ groups and follow the Cyclone IV External Memory Interface Handbook pin-out rules - swapping byte lanes causes severe setup/hold violations that the TimeQuest timing analyzer may not flag until hardware validation.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Lead-free 'L' suffix indicates RoHS compliance per the Cyclone IV Device Handbook. Industrial temperature variants (I suffix) are recommended for AEC-Q100 applications but the part itself is not AEC-Q100 qualified - validate at the system level.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP4CE55F29C8LN EP4CE55F29C8L EP4CE55F29C8N EP4CE55F29C7N EP4CE55F29C6N Cyclone IV E FPGA Field-Programmable Gate Array Logic Array Block Logic Element Embedded RAM M9K memory block 18x18 multiplier PLL 780-ball FBGA FineLine BGA RoHS AEC-Q100 JEDEC JESD51 JTAG Active Serial configuration EPCS flash EPCQ flash machine vision motion control broadcast video telecom line card industrial control
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