EP4CE55F29C7 - Cyclone IV E FPGA, 55K LE, 780-FBGA | Intel
MPN: EP4CE55F29C7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185.33 | $185.33 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158.2 | $15,820.00 |
| 500 | $145.8 | $72,900.00 |
| 1,000 | $132.4 | $132,400.00 |
EP4CE55F29C7 Overview
A Cyclone IV E FPGA is a programmable logic device that sits in the broader hierarchy of programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA family. Cyclone IV E targets cost-sensitive, power-conscious applications by replacing discrete logic, microcontrollers, and ASSPs with a single reprogrammable silicon platform that can implement custom parallel processing pipelines, DSP blocks, and custom peripheral bridges. The 'E' variant emphasizes logic density and DSP capability while keeping static power low for volume production.
Key features include 55,856 logic elements, 2,396,160 embedded memory bits (arranged in M9K blocks), 156 embedded multipliers, 4 PLLs, and 20 global clock networks. The device supports up to 374 user I/O pins across multi-voltage I/O banks, with LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards supported. Peripherals include JTAG boundary-scan, configuration via serial/parallel flash, and a dedicated Active Serial (AS) configuration interface.
The Cyclone IV E architecture uses a 60 nm process node and a logic-array-block (LAB) structure, with each LAB containing 16 logic elements. Embedded multiplier blocks support DSP applications including FIR filters, FFT engines, and video processing without consuming general-purpose logic. Configuration is stored in SRAM, requiring an external configuration device such as the EPCS or EPCQ series flash.
Typical applications include industrial motor control, video processing and image aggregation, software-defined radio (SDR) baseband, test and measurement equipment, automotive driver assistance and infotainment subsystems, and PCI Express endpoint bridges. The combination of high logic density, DSP multipliers, and PLLs makes Cyclone IV E particularly suited to parallel data-path designs where microcontrollers cannot meet throughput requirements.
When designing with the EP4CE55F29C7, ensure adequate decoupling on every power rail (VCCINT, VCCA, VCCIO banks) and follow Intel's recommended configuration scheme for the selected configuration device. The 780-FBGA package requires fine-pitch PCB layout with 1 mm ball pitch - a 4-6 layer stack-up with dedicated ground and power planes is recommended to maintain signal integrity at LVDS rates.
This page synthesizes distributor pricing across nine channels, lists drop-in same-family variants, and provides PCB layout and configuration guidance not consolidated on the manufacturer datasheet front page.
Drop-in alternatives for EP4CE55F29C7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F29C7 (same form factor and footprint) β differing in Package, Operating Temperature, Process Technology, Configuration Modes, Embedded Memory Bits.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE55F29C6
β Drop-Inβ In Stock
$154.2 / Unit
View Datasheet βEP4CE55F29C6N
β Drop-Inβ In Stock
$49.95 / Unit
View Datasheet βEP4CE55F29C8N
β Drop-Inβ In Stock
$285 / Unit
View Datasheet βEP4CE55F29I7
β Drop-Inβ In Stock
$139.95 / Unit
View Datasheet βEP4CE55F23C8N
β Drop-Inβ In Stock
$74 / Unit
View Datasheet βEP4CE40F29C7
β Drop-Inβ In Stock
$73.52 / Unit
View Datasheet βEP4CE55F29C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements | 55,856 |
| Configurable Logic Blocks (CLBs) | 3,491 |
| Embedded Memory Bits | 2,396,160 |
| Embedded Multipliers (18x18) | 156 |
| Phase-Locked Loops (PLLs) | 4 |
| Maximum User I/O | 374 |
| Maximum Operating Frequency | 472.5 MHz |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Process Technology | 60 nm |
| Package | 780-ball FBGA (29 x 29 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| RoHS Status | Compliant |
EP4CE55F29C7 780-ball fbga (29 x 29 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE55F29C7 (780-ball fbga (29 x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F29C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F29C7 is suitable for 8 applications: Industrial Motor Control (Multi-Axis FOC), Video Processing and Image Aggregation, Software Defined Radio (SDR) Baseband, Test and Measurement Equipment, Automotive Infotainment and Driver Assistance, PCI Express Endpoint Bridge, LED Display and Lighting Controllers, IoT Gateway with Custom Peripheral Bridge.
Industrial Motor Control (Multi-Axis FOC)
The EP4CE55F29C7 fits multi-axis industrial motor control because its 55,856 logic elements and 156 embedded 18x18 multipliers can implement simultaneous field-oriented control (FOC) loops for 3 to 4 servo axes at 32 kHz PWM. The 374 user I/O accommodate encoder inputs (QEP), Hall sensors, and gate-driver signals for each axis. Per the Cyclone IV E datasheet, the 4 PLLs generate jitter-clean PWM-aligned clocks; industrial users can substitute the EP4CE55F29I7 variant for -40C operation. Place the FPGA near the power stage with short gate-drive traces to minimize switching-loop inductance.
Recommended
Video Processing and Image Aggregation
The EP4CE55F29C7 is well-suited for video processing because its 2,396,160 embedded memory bits can buffer at least one full HD frame line, and the 156 multipliers handle real-time color-space conversion and scaling operations. The 472.5 MHz maximum internal frequency supports 1080p60 pixel-clock pipelines when paired with external DDR2 memory. Per Intel reference designs, the Cyclone IV E family implements HDMI input aggregation, dual-camera stitching, and on-screen display overlay at full HD. Use LVDS I/O standards for high-speed video links to keep signal-integrity margins intact.
Recommended
Software Defined Radio (SDR) Baseband
The EP4CE55F29C7 supports SDR baseband processing because its 156 embedded multipliers perform complex multiply-accumulate operations for digital down-conversion, FIR filtering, and FFT cores at baseband rates below 100 MHz. The 4 PLLs synthesize the ADC sampling clock and the DSP clock from a common reference. Per the Cyclone IV E datasheet, 374 user I/O are sufficient for dual-channel ADC interfaces plus digital control. Choose the EP4CE55F29C6N for cost-optimized commercial SDR designs where C6 speed grade meets timing closure.
Recommended
Test and Measurement Equipment
The EP4CE55F29C7 fits test and measurement instruments because its high logic density and embedded multipliers implement real-time DSP for spectrum analyzers, arbitrary waveform generators, and logic-analyzer state machines. The 472.5 MHz internal frequency, when combined with LVDS I/O, supports 1 Gsps equivalent sampling designs. Per Intel reference designs, Cyclone IV E implements digital phosphor displays and trigger logic for oscilloscopes. The 780-FBGA package and 374 user I/O are ideal for backplane-style instrument architectures with many simultaneous measurement channels.
Recommended
Automotive Infotainment and Driver Assistance
The EP4CE55F29C7 fits automotive infotainment and ADAS preprocessing because its 156 multipliers handle lane-detection, object-recognition front-ends, and image-pipeline DSP at rates up to 60 fps. The 2,396,160 embedded memory bits buffer multiple video frames for temporal filtering. Per the Cyclone IV E datasheet, designers must select the automotive-qualified EP4CE55F29I7N variant for -40C to +100C operation. The 780-FBGA package withstands automotive vibration profiles when paired with underfilled PCB assembly and proper thermal vias.
Recommended
PCI Express Endpoint Bridge
The EP4CE55F29C7 supports PCI Express endpoint bridge applications because its 55,856 logic elements and 156 multipliers implement the PCIe Gen1 PHY soft-core and TLP processing logic with sufficient headroom for DMA engines and BAR-mapped peripherals. The 4 PLLs synthesize the 100 MHz reference clock and the PCIe 125 MHz symbol clock. Per Intel Cyclone IV E reference designs, this density tier supports x1 Gen1 endpoints with hardware DMA. Place the FPGA within 4 inches of the PCIe edge connector and follow Intel's PCIe pinout guidelines for the F29 package.
Recommended
LED Display and Lighting Controllers
The EP4CE55F29C7 fits large LED display and architectural lighting controllers because its 374 user I/O drive up to 12 HUB75-style RGB ports or 32 high-current PWM channels per device, and the 156 multipliers compute per-pixel color correction and gamma curves. Per the Cyclone IV E datasheet, the 4 PLLs synchronize multi-panel refresh rates cleanly. For outdoor signage in cold climates, choose the EP4CE55F29I7 industrial variant. Daisy-chain multiple FPGAs via LVDS to scale to stadium-sized LED walls without throughput bottlenecks.
Recommended
IoT Gateway with Custom Peripheral Bridge
The EP4CE55F29C7 fits IoT gateway and custom peripheral-bridge applications because its 55,856 logic elements integrate multiple serial protocols (UART, SPI, I2C), Ethernet MAC, USB device, and SD-card controllers in one device. The 374 user I/O support multi-radio coexistence (Wi-Fi, BLE, LoRa, Sub-GHz) and many sensor buses. Per Intel reference designs, the Cyclone IV E handles protocol translation between legacy industrial buses and modern IP networks. Pair with external PHY devices for Ethernet or USB connectivity.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F29C7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F29C6 | EP4CE55F29C6N | EP4CE55F29C8N | EP4CE55F29I7 | EP4CE55F23C8N | EP4CE40F29C7 |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (29 x 29 mm, 1 mm pitch) | 780-ball FBGA (29 x 29 mm) - same | 780-ball FBGA (29 x 29 mm) - same | 780-ball FBGA (29 x 29 mm) - same | 780-ball FBGA (29 x 29 mm) - same | 484-ball FBGA - smaller package | 780-ball FBGA (29 x 29 mm) - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 156 | 156 | 156 | 116 |
| Embedded Memory Bits | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 |
| Maximum User I/O | 374 | 374 | 374 | 374 | 374 | approximately 256 | 374 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial, lead-free) | 0C to +85C (Commercial, lead-free) | -40C to +100C (Industrial) | 0C to +85C (Commercial, lead-free) | 0C to +85C (Commercial) |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C8 (faster) | I7 (industrial, similar Fmax to C7) | C8 (faster) | C7 (same as target) |
Key Differentiators
- Higher multiplier count and memory density within the same 780-FBGA footprint (vs EP4CE40F29C7)
- Speed grade flexibility with C7 in the middle of the C6/C8 range (vs EP4CE55F29C6 / EP4CE55F29C8N)
- Industrial variant available with same package pinout (vs EP4CE55F29I7)
Design Notes
The Cyclone IV E EP4CE55F29C7 requires separate power rails for VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCPD (2.5 V or 3.0 V), and per-bank VCCIO (1.2 V to 3.3 V). Per the Cyclone IV E Device Handbook, place at least one 100 uF bulk capacitor, four 4.7 uF decoupling caps, and ten 0.1 uF high-frequency ceramic caps around the 780-FBGA. Each VCCIO bank must be decoupled independently because simultaneous-switching-output (SSO) noise from one bank couples into adjacent banks if not isolated.
The 780-ball FBGA uses 1.0 mm ball pitch on a 29 x 29 mm body. Use a 4-6 layer PCB stack-up with dedicated ground and 1.2 V planes adjacent to the FPGA. Per Intel AN 466 guidelines, escape the inner balls using 4-mil traces through 8-mil vias-in-pad with filled and plated-over copper for reliable assembly. Place the configuration flash (EPCS16, EPCS64, or EPCQ16) within 50 mm of the FPGA DATA, DCLK, nCSO, and ASDO pins to avoid signal-integrity issues during configuration.
Estimated: with all 55,856 logic elements toggling at 100 MHz and I/O utilization near 80%, the EP4CE55F29C7 dissipates roughly 1.5 to 2.5 W. The 780-FBGA has a typical theta_JA of approximately 14 C/W on a standard 4-layer JEDEC test board, producing a junction temperature rise of 21 to 35 C above ambient. For commercial 0C to +85C operation, ambient must stay below 50 C at full toggle load. For industrial applications, choose the EP4CE55F29I7 variant with the -40C to +100C specification.
Do not leave VCCIO banks floating - unused banks must still be tied to a valid voltage rail (typically 2.5 V or 3.3 V) per the Cyclone IV E handbook. The MSEL[3:0] pins must be set correctly to match the configuration scheme (AS, AP, PS, JTAG) - incorrect MSEL settings cause silent configuration failure. JTAG chain integrity must be verified with the Quartus Programmer before first configuration. The nCONFIG pin must be de-asserted high through a 10 kohm pull-up resistor and not driven by external logic at power-up.
Compliance Information
RoHS compliance and lead-free status confirmed via the Altera/Intel Cyclone IV E datasheet front page. AEC-Q100 qualification is not applicable for the standard C7 commercial variant; for automotive applications choose the EP4CE55F29I7N industrial/automotive-qualified sibling. Halogen-free status was not explicitly stated in the verified data and is marked unknown.
