EP4CE6F17C9L - Cyclone IV E FPGA, 6K LEs, 256-FBGA | Intel
MPN: EP4CE6F17C9L ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.1 | $9,050.00 |
| 1,000 | $15.6 | $15,600.00 |
EP4CE6F17C9L Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits through configuration of on-chip logic blocks, routing, and I/O. FPGAs sit between CPLDs (smaller, simpler, non-volatile) and ASICs (custom silicon) in the programmable logic hierarchy. The Cyclone IV E family specifically targets volume-driven applications where low static power, integrated transceivers are not required, and where designers need a balance of logic density, memory, and DSP capability at aggressive unit pricing.
Key features of the EP4CE6F17C9L include up to 270 Kbits of general-purpose RAM, two PLLs per device quadrant, support for external memory interfaces such as DDR/DDR2 SDRAM and QDRII SRAM, and on-chip termination (OCT) for impedance matching. The device operates across a commercial 0C to 85C junction temperature range with a core voltage of 1.2 V (VCCINT) and I/O banks tolerant of multiple single-ended and differential standards including LVDS, SSTL, and HSTL. Configuration is supported through passive serial (AS), active serial (PS), and JTAG modes.
The 256-ball FBGA package measures 17 mm x 17 mm with a 1.0 mm ball pitch, providing a compact footprint for high-I/O designs. Internal architecture combines Look-Up Tables (LUTs) acting as distributed logic and small RAM, M9K embedded memory blocks, and 18 x 18 hardware multipliers that can be combined for DSP functions such as FIR filters and FFT engines. Static power consumption is approximately 35 mW typical.
Typical applications for this FPGA include industrial control and motor drive, video processing bridges, automotive infotainment, portable medical instrumentation, software-defined radio (SDR) baseband, and consumer electronics requiring custom glue logic or display interfacing. The combination of low cost, plentiful logic, and 179 user I/Os makes it a popular choice for legacy Cyclone III upgrades and new cost-optimized designs.
When designing with the EP4CE6F17C9L, plan for proper decoupling across each power rail (VCCINT, VCCIO per bank, VCCAUX), keep configuration and JTAG traces short, and verify ball-out assignments against the Intel Pin Connection Guidelines. Quartus II Web Edition (or the corresponding Intel Quartus Prime Lite release for the Cyclone IV legacy device family) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in and family-swap alternatives, comparison parameters, and practical board-level design notes not consolidated in the manufacturer datasheet. All pricing references are current as of 2026-09-10 and reflect verified data from DigiKey, Mouser, and Octopart.
Drop-in alternatives for EP4CE6F17C9L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6F17C9L (same form factor and footprint) — differing in Package, Speed Grade, Configuration Modes, Process Technology, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE6F17C8N
✅ Drop-In✓ In Stock
$13.75 / Unit
View Datasheet →EP4CE6F17C7N
✅ Drop-In✓ In Stock
$3.6 / Unit
View Datasheet →EP4CE6F17C6N
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EP4CE6F17A7N
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →EP4CE6F17C8LN
✅ Drop-In✓ In Stock
$17.25 / Unit
View Datasheet →EP4CE6F17C8L
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EP4CE6F17C7
✅ Drop-In✓ In Stock
$17.49 / Unit
View Datasheet →EP4CE6F17C6
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →EP4CE6F17C9L Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Maximum User I/O Pins | 179 |
| Embedded Multipliers (18x18) | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.2 V |
| Operating Junction Temperature | 0C to 85C (commercial) |
| Package | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 60 nm |
| Configuration Mode | AS, PS, JTAG |
| RoHS Status | Compliant (lead-free FBGA) |
EP4CE6F17C9L Pin Configuration
| Pin A1 | IO_L1N_0 — I/O bank 0, differential negative pair, or single-ended |
| Pin B2 | IO_L1P_0 — I/O bank 0, differential positive pair, or single-ended |
| Pin C3 | VCCIO0 — I/O bank 0 supply voltage |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — Core supply 1.2 V |
| Pin F6 | IO_L2N_1 — I/O bank 1, differential negative pair |
| Pin G7 | IO_L2P_1 — I/O bank 1, differential positive pair |
| Pin H8 | MSEL0 — Configuration mode select |
| Pin J9 | MSEL1 — Configuration mode select |
| Pin K10 | MSEL2 — Configuration mode select |
| Pin L11 | nCONFIG — Configuration control (active low) |
| Pin M12 | nSTATUS — Configuration status (active low) |
| Pin N13 | CONF_DONE — Configuration done indicator |
| Pin P14 | TCK — JTAG test clock |
| Pin R15 | TMS — JTAG test mode select |
| Pin T16 | TDI — JTAG test data in |
| Pin A16 | TDO — JTAG test data out |
Typical Applications
EP4CE6F17C9L is suitable for 7 applications: Industrial Motor Control & Drive, Video Processing Bridge & Display Controller, Software-Defined Radio (SDR) Baseband, Automotive Infotainment Auxiliary Logic, Portable Medical Instrumentation, Industrial Communication Gateway & Protocol Bridge, Custom Glue Logic & Legacy Bus Replacement.
Industrial Motor Control & Drive
The EP4CE6F17C9L delivers 15 hardware multipliers (18x18) and up to 270 Kbits of M9K memory, sufficient to implement field-oriented control (FOC) loops for three-phase BLDC or PMSM motors at switching frequencies up to 50 kHz. The 179 user I/Os in the F17 FBGA easily accommodate parallel ADC interfaces for current sensing plus encoder/Hall inputs, while the two PLLs provide jitter-cleaned clocks for both the motor PWM and the control-loop DSP fabric. Designers benefit from low static power (35 mW typical) and the ability to integrate custom safety logic alongside a soft processor core.
Recommended
Video Processing Bridge & Display Controller
With 179 I/Os, the EP4CE6F17C9L can ingest parallel RGB or LVDS video streams and reformat them for HDMI, MIPI, or TFT-LCD panels using on-chip logic and M9K line buffers. The 276 Kbits of block RAM hold several lines of pixel data without external SDRAM for modest resolutions up to 1024x768, and the dedicated 18x18 multipliers support scaling and color-space conversion. Quartus Prime video IP cores are pre-validated for this family, accelerating development of custom display bridges in kiosk and signage products.
Recommended
Software-Defined Radio (SDR) Baseband
The 18x18 hardware multipliers and M9K memory blocks make the EP4CE6F17C9L a strong match for SDR baseband signal processing including digital down/up-conversion, FIR filtering, and FFT kernels. LVDS-capable I/Os interface directly to high-speed ADCs and DACs, while the two PLLs generate independent sample clocks and DSP clock domains. Many open-source SDR designs targeting Cyclone IV E demonstrate complete baseband chains within 4K-5K logic elements, leaving headroom for protocol stacks and soft-CPU control.
Recommended
Automotive Infotainment Auxiliary Logic
The EP4CE6F17C9L serves as a flexible glue-logic and audio/video routing hub in automotive infotainment systems, bridging CAN/LIN buses, I2S audio codecs, and LVDS display panels. Its 179 I/Os handle multiple parallel sensor and keypad interfaces, while the 6,272 LEs are enough to implement audio mixing, volume control, and source switching without an external processor. Designers choose the industrial temperature grade variant (EP4CE6F17A7N) for under-dash or cabin-mounted modules where ambient temperatures exceed commercial ranges.
Recommended
Portable Medical Instrumentation
In portable patient-monitoring or diagnostic instruments, the EP4CE6F17C9L provides deterministic low-latency DSP for ECG/EEG signal conditioning, QRS detection, and SpO2 waveform processing, all within a power budget suited to battery operation. The 256-ball FBGA package measures only 17x17 mm, fitting compact handheld enclosures, and the device's low static power (approximately 35 mW typical) extends battery life. M9K memory blocks serve as sample buffers and coefficient storage for FIR/IIR filter chains operating at clinical sample rates.
Recommended
Industrial Communication Gateway & Protocol Bridge
The EP4CE6F17C9L integrates multiple industrial protocols (Modbus, EtherCAT slave, PROFINET, CANopen, RS-485) in a single chip, replacing stacks of protocol-specific ASICs with a reconfigurable solution. Its 179 user I/Os and 8 I/O banks tolerate multiple voltage levels (1.2 V to 3.3 V) simultaneously, simplifying mixed-voltage industrial backplane designs. M9K blocks buffer packet queues, and the hardware multipliers accelerate CRC/checksum computations at line rate.
Recommended
Custom Glue Logic & Legacy Bus Replacement
Designers migrating older ASIC or CPLD-based designs to a programmable platform use the EP4CE6F17C9L to consolidate disparate 74-series glue logic, address decoding, and interrupt controllers into a single 256-ball FBGA. The 179 I/Os handle legacy parallel buses, while M9K memory replaces small external FIFOs and register files. Quartus Prime legacy IP libraries make it straightforward to drop in functional replacements for outdated PAL/GAL-based decode logic while preserving board-level timing budgets.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6F17C9L — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6F17C8N | EP4CE6F17C7N | EP4CE6F17C6N | EP4CE6F17A7N |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch - same | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch - same | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch - same | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 |
| Maximum User I/O | 179 | 179 | 179 | 179 | 179 |
| Embedded Multipliers (18x18) | 15 | 15 | 15 | 15 | 15 |
| Speed Grade | C9 (fastest commercial) | C8 (slower) | C7 | C6 (slowest) | A7 (industrial temp) |
| Operating Junction Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to 125C (industrial) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Fastest commercial speed grade in the F17 FBGA line (vs EP4CE6F17C8N)
- Lead-free package finish suitable for RoHS products (vs EP4CE6F17C8N (standard N finish))
- Commercial temperature range optimized for cost (vs EP4CE6F17A7N (industrial temperature))
Design Notes
The EP4CE6F17C9L requires four distinct power rails: VCCINT at 1.2 V (core), VCCIO at 1.2 V to 3.3 V per bank (I/O), VCCAUX at 2.5 V (auxiliary and JTAG), and VCCPD at 3.3 V (pre-driver and configuration I/O). Decouple each rail with a 100 nF X7R ceramic placed within 5 mm of the corresponding supply balls, plus a bulk 10 uF to 47 uF tantalum or polymer capacitor near the regulator. Estimating from typical static power of 35 mW plus dynamic power at 50 percent toggle rates, a 400 mA VCCINT regulator and 200 mA per VCCIO bank provide ample headroom without thermal concerns.
Although the F17 256-ball FBGA has a relatively low theta-JA of approximately 25 C/W with adequate PCB thermal vias, full logic utilization at 100 MHz toggle rates can raise junction temperature 15C to 25C above ambient. Place a thermal via array (0.3 mm drill, 1.0 mm pitch) directly beneath the FBGA thermal pad region (if present in the package variant) and connect these to an internal copper plane. For commercial-temperature designs (0C to 85C junction), ensure worst-case ambient plus self-heating does not exceed 85C; consider the EP4CE6F17A7N industrial variant if operating margins are tight.
The 256-ball FBGA at 1.0 mm pitch demands 4-layer PCB stack-up minimum with 0.5 oz copper on outer layers and 1.0 oz on inner planes. Use micro-via-in-pad or 0.2 mm laser-drilled micro-vias for BGA breakout; dog-bone fanout works on 1.0 mm pitch but reduces routing channels. Length-match DDR/DDR2 SDRAM byte lanes to within 25 mils and route differential pairs (LVDS) with 100 ohm differential impedance plus intra-pair skew under 10 mils. Keep JTAG and configuration traces short and route them on an outer layer to simplify probe access during bring-up.
Avoid the common pitfalls of leaving MSEL pins floating (tie them through 10 kohm resistors to a defined logic level), forgetting to assert nCONFIG during power-up ramp (a 1 kohm pull-up to VCCPD ensures clean reset), and routing CLK outputs into heavily loaded nets without series damping resistors. Estimating from configuration timing, a 100 nF capacitor on nSTATUS plus CONF_DONE prevents false configuration-done assertions during slow power ramps. Always check the Quartus Prime fitter report for unconstrained I/O warnings before final bitstream generation.
Compliance Information
Lead-free L suffix denotes RoHS-compliant FBGA finish. AEC-Q100 not qualified - select EP4CE6F17A7N industrial variant for harsh thermal environments; no specific automotive-qualified version of the F17 256-FBGA exists in the Cyclone IV E family.
