EP4CE6F17C9LN - Cyclone IV E FPGA, 6K LE, 256-FBGA | Intel
MPN: EP4CE6F17C9LN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
EP4CE6F17C9LN Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected through programmable interconnect. FPGAs occupy the middle ground between fixed-function ASICs and microcontrollers: they deliver hardware-timed parallelism and custom logic depth far beyond what any MCU can do, while avoiding the NRE and mask costs of an ASIC. Within the broader taxonomy, the EP4CE6F17C9LN sits at the silicon level: programmable logic device > FPGA > low-power FPGA > Cyclone IV E family. This lineage explains why the part is widely specified for cost-sensitive, volume production designs where unit price and total power matter as much as raw logic density.
Key features include up to 6,272 logic elements, 270 Kbits of embedded RAM, 15 embedded 18x18 multipliers for DSP operations, and 6 general-purpose PLLs. The device supports configuration through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, giving hardware engineers flexibility during prototyping and production. Compared to the earlier Cyclone III generation, Cyclone IV E uses a smaller 60 nm process node and consumes up to 25% less dynamic power while expanding the logic and memory budget.
Typical applications include industrial motor control, video surveillance with image processing pipelines, low-cost digital signal processing front-ends, consumer electronics requiring custom glue logic, and cost-optimized communication bridges. The 256-ball FBGA package and 0.4 mm ball pitch enable compact PCB designs while still providing the I/O count needed for parallel video, memory, and bus expansion interfaces. The 1.2 V core plus independent banked I/O supplies also simplify integration with legacy 3.3 V and 2.5 V peripherals.
When designing with this part, pay attention to power sequencing across the VCCINT, VCCIO, and VCCA rails; missing one rail will damage the device. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and bitstream generation. The -N speed grade suffix (C9 in this part number) corresponds to the 265 MHz internal performance tier.
Drop-in alternatives for EP4CE6F17C9LN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6F17C9LN (same form factor and footprint) β differing in Package, Process Technology, Operating Temperature, Speed Grade, PLLs.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE6F17C9L
β Drop-Inβ In Stock
$15.6 / Unit
View Datasheet βEP4CE6F17C8N
β Drop-Inβ In Stock
$13.75 / Unit
View Datasheet βEP4CE6F17C8LN
β Drop-Inβ In Stock
$17.25 / Unit
View Datasheet βEP4CE6F17C8L
β Drop-Inβ In Stock
$11.1 / Unit
View Datasheet βEP4CE6F17C7N
β Drop-Inβ In Stock
$3.6 / Unit
View Datasheet βEP4CE6F17A7N
β Drop-Inβ In Stock
$24.5 / Unit
View Datasheet βEP4CE6F17C9LN Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Family | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Logic Array Blocks | 392 |
| Embedded Memory | 270 Kbit |
| Embedded Multipliers (18x18) | 15 |
| PLLs | 6 |
| Maximum User I/O | 179 |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Count | 8 |
| Process Technology | 60 nm low-k CMOS |
| Internal Performance | 265 MHz (typical) |
| Package | 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch) |
| Configuration Modes | JTAG, AS, AP, PS |
| Operating Temperature | 0C to +85C (commercial, -N speed grade) |
| RoHS Status | Compliant |
| Speed Grade | C9 (-N speed grade) |
EP4CE6F17C9LN 256-ball fbga (fineline bga, 17x17 mm, 0.4 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE6F17C9LN (256-ball fbga (fineline bga, 17x17 mm, 0.4 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE6F17C9LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE6F17C9LN is suitable for 6 applications: Industrial Motor Control, Video Surveillance with Image Pre-Processing, Low-Cost Digital Signal Processing Front-Ends, Consumer Electronics Glue Logic, Communication Bridges and Protocol Converters, Education and FPGA Prototyping Platforms.
Industrial Motor Control
The EP4CE6F17C9LN's 6,272 logic elements, 15 embedded 18x18 multipliers, and 6 PLLs provide exactly the DSP headroom required for sensorless FOC and trapezoidal commutation algorithms in low-voltage BLDC and stepper drives. The 179 user I/O pins comfortably accommodate 3-phase PWM outputs, encoder feedback (QEP), Hall sensors, and an external 32-bit MCU bus. Six general-purpose PLLs let the design generate multiple precise PWM frequencies from a single 50 MHz crystal, while the 60 nm process keeps dynamic power low enough for fan-less enclosures. The Cyclone IV E family is widely specified in industrial servo and inverter designs because it balances $ per LE against DSP and I/O bandwidth.
Recommended
Video Surveillance with Image Pre-Processing
The EP4CE6F17C9LN fits cost-optimized video capture and pre-processing pipelines where a single FPGA handles 720p60 ingress, Bayer demosaic, and motion-detection pre-filters before forwarding to a host processor. With 270 Kbits of embedded RAM it can buffer three lines of 1280-pixel video, and the 15 multipliers accelerate 5x5 convolution kernels used for edge detection. The 8 I/O banks support LVDS for direct camera serial interface (MIPI-style CSI-2 or sub-LVDS) and LVCMOS for the host parallel bus. The 1.2 V VCCINT and configurable VCCIO banks simplify interface to 1.8 V image sensors and 3.3 V SoCs.
Recommended
Low-Cost Digital Signal Processing Front-Ends
The 15 embedded 18x18 multipliers on the EP4CE6F17C9LN deliver up to 225 GMACs of integer throughput, suitable for FIR filtering, FFT pre-processing, and custom radio front-ends in sub-6 GHz ISM bands. The 270 Kbit embedded RAM serves as coefficient and windowing-function storage, avoiding external memory for shorter kernels. The device pairs well with external ADCs and DACs over LVDS, and the 6 PLLs can generate all system clocks from a single reference. The 1.2 V core voltage and the 60 nm low-power process make the EP4CE6F17C9LN especially attractive for portable or battery-operated DSP modules.
Recommended
Consumer Electronics Glue Logic
Many cost-sensitive consumer products need custom glue logic, format conversion, or protocol bridging that is too specific for any off-the-shelf ASSP but not large enough to justify an ASIC. The EP4CE6F17C9LN's 6,272 LEs accommodate custom I2S-to-SPDIF bridges, HDMI CEC controllers, and display timing generators, while the 179 user I/O pins give enough headroom for parallel RGB or LVDS output. The 256-ball FBGA's 17x17 mm outline is small enough for set-top box and digital photo frame mainboards, and the 1.2 V core helps meet Energy Star standby budgets.
Recommended
Communication Bridges and Protocol Converters
The EP4CE6F17C9LN is widely used to bridge between industrial and consumer protocols such as I2C-to-SPI, UART-to-Ethernet, or CAN-to-LIN converters used in automotive infotainment and factory gateways. The 8 I/O banks can each run at independent voltages, allowing the FPGA to interface 1.8 V image sensors, 2.5 V memory, and 3.3 V MCUs without external level shifters. With 6 PLLs, the device can derive multiple reference clocks from a single TCXO, simplifying the BOM. The Cyclone IV E family is qualified for industrial and commercial operating ranges, making the EP4CE6F17C9LN attractive for industrial gateway designs.
Recommended
Education and FPGA Prototyping Platforms
Because the Cyclone IV E family is fully supported by the free Quartus Prime Web Edition toolchain, the EP4CE6F17C9LN is a popular target for university courses and open-source hardware projects. The 6,272 LEs and 179 user I/Os provide enough room to teach state machines, soft-core CPUs (such as RISC-V or Nios II), and SDRAM controllers without the cost of a larger device. The 256-ball FBGA package, combined with the predefined reference design in the Cyclone IV E starter kit, accelerates bring-up. The same silicon also makes the EP4CE6F17C9LN a popular choice for hobbyist projects that scale from breadboard prototypes to production boards.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6F17C9LN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6F17C9L | EP4CE6F17C8N | EP4CE6F17C8LN | EP4CE6F17C7N | EP4CE6F17A7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 256-ball FBGA (17x17 mm, 0.4 mm pitch) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 |
| Speed Grade | C9 (commercial) | C9 (commercial) | C8 (commercial) | C8 (commercial) | C7 (commercial) | A7 (commercial) |
| Maximum User I/O | 179 | 179 | 179 | 179 | 179 | 179 |
| Embedded Memory | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit | 270 Kbit |
| Embedded 18x18 Multipliers | 15 | 15 | 15 | 15 | 15 | 15 |
| Process Node | 60 nm low-k CMOS | 60 nm low-k CMOS | 60 nm low-k CMOS | 60 nm low-k CMOS | 60 nm low-k CMOS | 60 nm low-k CMOS |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| RoHS Terminal Finish | Lead-free (LN suffix) | Non-LN (Pb-free optional) | Non-LN (Pb-free optional) | Lead-free (LN suffix) | Non-LN (Pb-free optional) | Non-LN (Pb-free optional) |
Key Differentiators
- Fastest speed grade in the EP4CE6F17 footprint (vs EP4CE6F17C8N)
- Lead-free (-LN) terminal finish available (vs EP4CE6F17C9L)
- Lowest-cost high-speed grade in the package (vs EP4CE6F17C7N)
Design Notes
Estimated: the EP4CE6F17C9LN requires three power rails: 1.2 V VCCINT (core), 2.5 V VCCA (PLL analog), and per-bank VCCIO supplies. Power sequencing requires that VCCINT come up before or simultaneously with VCCA; applying VCCA without VCCINT can permanently damage the PLLs. Decouple each supply pin with a 0.1 uF and a 10 uF capacitor placed within 5 mm of the balls. A bulk 100 uF tantalum on each rail suppresses transient dip during configuration.
Estimated: route all clock traces on the top layer with a continuous ground reference and 50 ohm controlled impedance. Place the configuration flash (typically EPCQ16 or EPCQ32) within 25 mm of the FPGA's DCLK and ASDO pins to minimize signal-integrity issues. Use via-in-pad or micro-vias under the BGA to break out the inner rows; standard 0.4 mm pitch BGAs require 0.2 mm laser-drilled micro-vias and a 0.45 mm pad.
Do not apply power with the nCONFIG pin held low; the FPGA will not configure until the pin is released. Always tie nSTATUS to a 10 kohm pull-up to VCCIO and CONF_DONE to a 10 kohm pull-up to VCCIO, otherwise configuration may fail intermittently. The C9 speed grade is the fastest commercially graded Cyclone IV E option; if timing closure fails, choose the C8 or C7 drop-in alternative (also in this product family) rather than redesigning the PCB.
Compliance Information
RoHS compliance confirmed by -LN terminal finish suffix and Intel product documentation. AEC-Q100 does not apply (commercial-grade FPGA). Halogen-free status not explicitly stated in available data.
