EP4CGX22CF19I8N - Cyclone IV GX FPGA, 21,280 LEs, 8 Transceivers | Intel
MPN: EP4CGX22CF19I8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.1 | $23,100.00 |
EP4CGX22CF19I8N Overview
A field-programmable gate array (FPGA) is a semiconductor IC whose digital logic is defined after manufacturing by loading a user-supplied configuration bitstream. FPGAs sit between fixed-function ASICs and microcontrollers: unlike ASICs they require no fabrication mask revision to change function, and unlike microcontrollers they execute logic on parallel hardware fabric rather than sequential firmware. The Cyclone IV GX family specifically targets cost- and power-sensitive applications that still require multi-gigabit serial transceivers, distinguishing it from transceiver-less Cyclone IV E devices and from higher-cost Cyclone V GX/GT families.
Key features of the EP4CGX22CF19I8N include support for PCI Express Gen1 (x1, x2) hard IP blocks, eight full-duplex 3.125 Gbps transceivers with 8B/10B encoding, dedicated PLL and DLL clock management hardware, and up to 150 user I/O pins. The 60 nm process technology keeps typical core power below 1 W for most designs, and the JTAG-based configuration interface supports standard Fast Passive Parallel, Active Serial, and JTAG modes using industry-standard EPCS configuration memories.
The 169-ball FineLine BGA package exposes the full 8-channel transceiver capability with industry-standard 1.0 mm pitch, simplifying PCB layout compared to the larger 256- and 484-ball options in the same family. Designers typically pair the EP4CGX22 with DDR2/DDR3 SDRAM, external flash for configuration storage, and LVDS or LVCMOS signaling for board-level interconnects. The device is supported by Quartus II / Quartus Prime design software from version 9.1 onward.
Typical applications include industrial video broadcast and capture cards, low-cost protocol bridging for serial RapidIO and Gigabit Ethernet, machine-vision frame grabbers, low-volume custom peripheral controllers, and PCI Express endpoint add-in cards. The industrial temperature grade makes the part suitable for factory automation and outdoor wireless backhaul equipment.
When designing with this FPGA, allocate at least one configuration mode pin and a dedicated JTAG header for in-system programming, and verify that the chosen transceiver reference clock meets the +/-100 ppm accuracy required by most multi-gigabit serial protocols. Decoupling follows the standard 100 nF per power-pin rule with bulk capacitance distributed across the supply rails.
Drop-in alternatives for EP4CGX22CF19I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX22CF19I8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Transceivers, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX22CF19I7N
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View Datasheet →EP4CGX22CF19I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 21,280 |
| Logic Array Blocks (LABs) | 1330 |
| Embedded Memory | 594 Kbits |
| Embedded 18x18 Multipliers | 66 |
| Maximum User I/O Pins | 150 |
| Transceiver Channels | 8 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PCI Express Hard IP Blocks | 2 (Gen1, x1/x2) |
| Process Technology | 60 nm (low-power) |
| Core Supply Voltage | 1.2 V |
| Package | 169-ball FBGA (F19), 1.0 mm pitch |
| Operating Temperature (Junction) | -40C to +100C (Industrial) |
| Configuration Interface | JTAG, AS, PS, FPP |
| PLL Count | 4 |
| RoHS Status | Compliant |
EP4CGX22CF19I8N 169-ball fbga (f19), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX22CF19I8N (169-ball fbga (f19), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX22CF19I8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX22CF19I8N is suitable for 6 applications: Industrial Video Capture and Broadcast Cards, PCI Express Endpoint Add-in Cards, Gigabit Ethernet and Serial Protocol Bridging, Machine Vision Frame Grabbers, Low-Volume Custom Peripheral Controllers, Wireless Baseband and Protocol Processing.
Industrial Video Capture and Broadcast Cards
The EP4CGX22CF19I8N fits industrial video capture and broadcast card designs because it combines 21,280 logic elements for video processing pipelines with eight 3.125 Gbps transceivers capable of carrying uncompressed SDI, HD-SDI, or 3G-SDI video streams. The industrial -40C to +100C junction temperature rating allows deployment in non-climate-controlled broadcast racks and outdoor monitoring stations. Designers typically implement color space conversion, scaling, and overlay processing in fabric, while the transceivers feed downstream HDMI or SDI encoders. Compared to using a discrete transceiver plus CPLD, the integrated solution reduces BOM cost by approximately 30% and simplifies PCB routing. The 169-ball FBGA package provides full access to all eight transceivers, which would be partially pinned out on smaller packages.
Recommended
PCI Express Endpoint Add-in Cards
The EP4CGX22CF19I8N is well suited to low-cost PCI Express Gen1 x1 or x2 endpoint add-in cards because its two hard PCIe IP blocks implement the physical layer and data link layer in dedicated silicon without consuming FPGA fabric. This leaves the full 21,280 logic elements and 66 18x18 multipliers available for application logic such as protocol bridging, custom DMA engines, or signal preprocessing. The industrial temperature grade supports cards deployed in ruggedized industrial PCs and servers. At approximately 38.50 USD per unit in qty 1, the part offers a compelling price point for low-volume production runs where an ASIC NRE would be uneconomic. Designers must implement a 100 MHz reference clock source within +/-100 ppm accuracy for PCIe compliance.
Recommended
Gigabit Ethernet and Serial Protocol Bridging
With eight 3.125 Gbps transceivers, the EP4CGX22CF19I8N can simultaneously bridge multiple gigabit serial protocols such as Gigabit Ethernet, Serial RapidIO, and Aurora, using 8B/10B encoding implemented in the dedicated PCS blocks. The 594 Kbits of embedded RAM provides sufficient buffering for line-rate packet processing, and the 66 hardware multipliers accelerate hash computations and CRC calculations commonly required in network bridges. Industrial temperature rating enables deployment in factory floor switches and outdoor wireless backhaul equipment. The 169-ball FBGA exposes full transceiver capability, allowing designs to use all eight channels without pin multiplexing. Compared to using a dedicated ASSP bridge plus glue logic, this single-chip solution reduces board area and improves design flexibility.
Recommended
Machine Vision Frame Grabbers
The EP4CGX22CF19I8N supports machine vision frame grabber applications through its combination of high-speed transceivers for Camera Link, CoaXPress, or GigE Vision interfaces, plus embedded multipliers for image preprocessing tasks such as Bayer demosaicing, white balance, and edge detection. The 21,280 logic elements handle sensor timing, frame buffering in 594 Kbits of BRAM, and host interface logic. Industrial temperature grade is critical for cameras and frame grabbers deployed on factory floors where ambient temperatures may exceed 70C. The integrated hard PCIe block enables direct frame transfer to the host PC without an external bridge chip, reducing overall system cost and latency. The 60 nm low-power process keeps typical core power under 1.5 W even at full transceiver utilization.
Recommended
Low-Volume Custom Peripheral Controllers
The EP4CGX22CF19I8N is ideal for low-volume custom peripheral controller designs where ASIC NRE cost is prohibitive but standard microcontrollers lack the required I/O bandwidth or custom logic. The 150 maximum user I/Os support direct interfacing with parallel ADC/DAC converters, custom memory buses, and legacy peripherals without external multiplexing. The industrial temperature rating suits harsh-environment controllers in transportation and energy systems. Designers can implement custom register sets and command protocols in the FPGA fabric, then use Altera Nios II soft-core processor for control plane functions, eliminating the need for a separate MCU. Configuration via JTAG allows field firmware updates without removing the controller from service.
Recommended
Wireless Baseband and Protocol Processing
The EP4CGX22CF19I8N serves in wireless baseband and protocol processing applications where its 8 transceiver channels support multi-antenna MIMO configurations for small-cell and femtocell base stations. The 66 hardware 18x18 multipliers enable efficient FFT, channel estimation, and FEC decoding, while the 594 Kbits of embedded RAM holds temporary symbol buffers. Industrial temperature grade supports outdoor pico-cell deployments. Compared to DSP-processor based solutions, the FPGA fabric delivers deterministic latency required for MAC-layer processing in TD-LTE and WiMAX systems. The 60 nm low-power process keeps total device power under 2 W even with four transceivers active simultaneously, which is critical for fanless outdoor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX22CF19I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX22CF19I7N | EP4CGX22CF19C8N | EP4CGX22CF19C7N | EP4CGX22BF14I8N |
|---|---|---|---|---|---|
| Package | 169-ball FBGA (F19) | 169-ball FBGA (F19) - same | 169-ball FBGA (F19) - same | 169-ball FBGA (F19) - same | 169-ball FBGA (F19) - same ball count but different ball map |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 21,280 |
| Speed Grade | I8 (industrial, fastest) | I7 (industrial) | C8 (commercial, fast) | C7 (commercial) | I8 (industrial) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial (-40C to +100C junction) | Commercial (0C to +85C junction) | Commercial (0C to +85C junction) | Industrial (-40C to +100C junction) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded RAM | 594 Kbits | 594 Kbits | 594 Kbits | 594 Kbits | 594 Kbits |
Key Differentiators
- Industrial temperature grade operation (vs EP4CGX22CF19C8N)
- Highest speed grade in F19 package family (vs EP4CGX22CF19I7N)
- Full 8-transceiver exposure in 169-ball BGA (vs Larger F256/F484 packages in same family)
Design Notes
The EP4CGX22CF19I8N requires three primary supply rails: 1.2 V VCCINT for the core logic, 2.5 V or 3.0 V VCCAUX and VCCPD for configuration banks, and separate analog supplies for the transceiver blocks. Estimated: a typical design utilizing four of eight transceivers at 2.5 Gbps and 40% logic utilization draws approximately 1.5 W from VCCINT and 0.4 W per active transceiver channel. Designers should follow Altera's PowerPlay Early Power Estimator (EPE) spreadsheet to validate thermal budgets before PCB layout, and must implement power sequencing such that VCCINT powers up before VCCAUX to prevent latch-up damage.
The 169-ball FBGA package uses 1.0 mm ball pitch, requiring 0.5 mm via land and microvia technology for breakout. The PCB stackup must be carefully selected: a 6-layer stackup with dedicated ground and power planes adjacent to the BGA breakout layer is recommended. Impedance-controlled routing is mandatory for the eight transceiver channels; differential pair impedance should be 100 ohm with 85 ohm common-mode termination following the Cyclone IV GX PCB design guidelines. Decoupling requires at least one 0.1 uF X7R ceramic capacitor per power pin placed within 100 mils of the ball, plus bulk capacitors at the board edge.
Three common pitfalls when designing with the EP4CGX22CF19I8N are: (1) forgetting to provide a configuration mode pin and JTAG header, which prevents in-system programming and recovery from a bad bitstream; (2) using the wrong JTAG chain order when multiple Altera devices share the bus, leading to programming failures; (3) failing to meet the transceiver reference clock accuracy requirement of +/-100 ppm for protocols like PCIe and GigE, which causes link training to fail. Additionally, designers must ensure CONFIG_DONE and nSTATUS pins are properly pulled up and observed in firmware before releasing system reset.
Compliance Information
RoHS compliant per ordering code 'N' suffix and Intel/Altera product page. AEC-Q100 not applicable for FPGAs in automotive safety-critical use; refer to Intel automotive-grade Cyclone IV variants separately.
