EP4CGX110DF31I7N - Cyclone IV GX 109K LE FPGA | Intel | 896-BGA
MPN: EP4CGX110DF31I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $248.5 | $248.50 |
| 10 | $233.69 | $2,336.90 |
| 100 | $219.45 | $21,945.00 |
| 500 | $205.1 | $102,550.00 |
| 1,000 | $192.4 | $192,400.00 |
EP4CGX110DF31I7N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory blocks, and I/O protocols by loading a hardware description language (HDL) bitstream after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: faster and more deterministic than CPUs for parallel DSP and signal-routing tasks, yet far cheaper and faster to iterate than full-custom ASICs. The Cyclone IV family sits at the low-cost, low-power end of the FPGA hierarchy and adds the GX sub-family suffix when integrated 3.125 Gbps transceivers are required.
Key features of the EP4CGX110DF31I7N include up to 8 integrated 3.125 Gbps transceiver channels that simplify board layout by eliminating external PHY ICs, 270 embedded 18x18 multipliers for DSP blocks, and a hard PCIe Gen1 IP core that accelerates embedded connectivity designs. The device supports common memory interfaces such as DDR2, LPDDR2, and QDRII+ for high-bandwidth buffering, and ships in an industrial temperature grade (-40C to +100C) suitable for non-automotive harsh environments. Configuration can be performed via JTAG, AS, PS, or fast passive parallel modes for flexible production programming.
Architecturally, the device uses ALM-based logic blocks, M9K memory blocks, and 9x9 multiplier elements feeding into a multi-tier routing fabric. The 60 nm process reduces static leakage relative to earlier 90 nm Cyclone generations while preserving the deterministic timing model that Quartus II software relies on for synthesis closure.
Typical applications include industrial machine vision cameras, broadcast video processing, low-cost wireline backplane aggregation, and PCI Express endpoint cards where the integrated transceivers and hard PCIe IP reduce BOM cost.
When laying out a Cyclone IV GX board, allocate at least four PCB layers for the FBGA-896 break-out fan-out, provide multiple decoupling capacitors around the 1.2 V core, and follow the transceiver reference-clock jitter guidelines in the Cyclone IV GX handbook to meet link-margin specifications.
This page consolidates distributor stock, drop-in same-package alternates, and practical PCB layout guidance that goes beyond the bare datasheet, helping engineers evaluate the EP4CGX110DF31I7N in the broader Cyclone IV GX family.
Drop-in alternatives for EP4CGX110DF31I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX110DF31I7N (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, PLLs, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX110DF31I7
✅ Drop-In✓ In Stock
$276.34 / Unit
View Datasheet →EP4CGX110DF31I6N
✅ Drop-In✓ In Stock
$108.4 / Unit
View Datasheet →EP4CGX110DF31C7N
✅ Drop-In✓ In Stock
$112.4 / Unit
View Datasheet →EP4CGX110DF31C8N
✅ Drop-In✓ In Stock
$325 / Unit
View Datasheet →EP4CGX110DF31C8
✅ Drop-In✓ In Stock
$235.8 / Unit
View Datasheet →EP4CGX110DF31C6N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP4CGX110DF31I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements (LE) | 109,424 |
| Logic Blocks / ALMs | 47 (ALM-adaptive logic modules) |
| Embedded Memory | 5,621,760 bits (5.49 Mbit) |
| Embedded Multipliers | 270 (18x18) |
| User I/Os | 475 |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| PCIe Hard IP | Yes, Gen1 (x1/x2/x4) |
| Process Technology | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V |
| Package | FBGA-896 (31x31 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Packaging | Tray |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS Status | Compliant |
EP4CGX110DF31I7N fbga-896 (31x31 mm) Pin Configuration Guide
Pin configuration for EP4CGX110DF31I7N (fbga-896 (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX110DF31I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX110DF31I7N is suitable for 6 applications: Industrial Machine Vision Cameras, Broadcast Video Processing, PCI Express Endpoint Cards, Low-Cost Wireline Backplane Aggregation, Portable Test & Measurement Instrumentation, Aerospace Avionics Subsystems.
Industrial Machine Vision Cameras
The EP4CGX110DF31I7N's 109,424 logic elements and 270 18x18 multipliers let designers run real-time image-processing pipelines (sobel edge detection, color-space conversion, Bayer demosaicing) on a single chip. Its 8 integrated 3.125 Gbps transceivers drive CoaXPress or GigE Vision links directly to the host PC, eliminating external PHY ICs. The industrial -40C to +100C temperature grade survives factory-floor heat, while 5.49 Mbit of embedded memory buffers full-HD frames at line rate without external SRAM.
Recommended
Broadcast Video Processing
With 475 user I/Os and 270 dedicated multipliers, the EP4CGX110DF31I7N handles multi-channel SDI bridging, HDR tone-mapping, and 4K up/down scaling within a single device. The hard PCIe Gen1 IP core accelerates capture-card DMA, while the 5.49 Mbit embedded memory provides sufficient line-buffer storage for HD-SDI deinterlacing. Designers can also use its transceivers for 12G-SDI links when paired with an external reclocker, keeping the FPGA at the heart of broadcast video pipelines.
Recommended
PCI Express Endpoint Cards
The EP4CGX110DF31I7N's hard PCIe Gen1 IP core (x1/x2/x4 lane support) eliminates the soft-PHY overhead that bogs down smaller FPGAs, achieving deterministic latency on data-acquisition cards. With 8 transceivers and 109K LEs, designers can add DSP pre-processing, scatter-gather DMA engines, and protocol bridges (PCIe-to-UART, PCIe-to-GPIO) on the same die. The industrial temperature grade also suits in-chassis server environments where ambient temperatures exceed commercial-grade limits.
Recommended
Low-Cost Wireline Backplane Aggregation
In telecom aggregation line cards, the EP4CGX110DF31I7N multiplexes multiple lower-rate links (CPRI, OBSAI, Ethernet) into a higher-speed uplink using its integrated 3.125 Gbps transceivers. The 109K logic elements map protocol stacks (HDLC, GFP, MPLS) in hardware without external TCAMs. Embedded 5.49 Mbit of memory stores packet descriptors and lookup tables, while the 475 user I/Os connect to backplane SERDES, fabric ASICs, and timing-clock distribution networks.
Recommended
Portable Test & Measurement Instrumentation
The EP4CGX110DF31I7N's 270 18x18 multipliers perform FFTs, FIR filters, and digital down-conversion for handheld oscilloscopes and logic analyzers. Its 8 transceivers drive high-speed ADC/DAC digital interfaces (JESD204B-style or LVDS), while 109K logic elements implement triggering logic and display pipelines. The 1.2 V core supply minimizes battery drain, and the FBGA-896 package provides enough I/O for parallel LVDS acquisition buses exceeding 1 Gsps sample rates.
Recommended
Aerospace Avionics Subsystems
Despite being industrial-grade rather than full MIL-spec, the EP4CGX110DF31I7N operates reliably at -40C to +100C and supports radiation-tolerant design practices through Triple Modular Redundancy (TMR) libraries in Quartus II. Its transceivers link to ARINC 429, MIL-STD-1553 bridges, and high-speed sensor buses. The 109K logic elements map multiple flight-control or sensor-fusion algorithms on one device, reducing board space and weight in unmanned aerial vehicle (UAV) and avionics retrofit applications.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX110DF31I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX110DF31I7 | EP4CGX110DF31I6N | EP4CGX110DF31C7N | EP4CGX110DF31C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-896 | FBGA-896 - same | FBGA-896 - same | FBGA-896 - same | FBGA-896 - same |
| Logic Elements | 109,424 | 109,424 | 109,424 | 109,424 | 109,424 |
| Embedded Memory | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit |
| User I/Os | 475 | 475 | 475 | 475 | 475 |
| Transceivers | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps | 8 ch, 3.125 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 (fastest industrial) | 7 | 6 (slower) | 7 (commercial) | 8 (faster commercial) |
Key Differentiators
- Highest speed grade in industrial temperature (vs EP4CGX110DF31I6N)
- Industrial temperature range for harsh environments (vs EP4CGX110DF31C7N)
- Maximum density variant in the EP4CGX110 family (vs EP4CGX110DF27I7N)
Design Notes
The FBGA-896 package on the EP4CGX110DF31I7N requires at least four PCB layers (eight recommended for full transceiver performance) to break out the 1.0 mm pitch balls. Use 0.8 mm via-in-pad microvias or staggered fan-out vias per Cyclone IV GX hardware design guidelines. Allocate continuous reference planes under the transceiver channels to maintain 100-ohm differential impedance.
Estimated: at 50% resource utilization with 4 active transceivers, total power is approximately 4-6 W. The 1.2 V core supply should be sourced from a buck regulator capable of delivering at least 3 A with low ripple (<20 mVpp); the transceiver analog supply requires an LDO or ferrite-filtered rail to meet jitter specs. Decouple every VCC pin with 0.1 uF and 10 uF capacitors within 100 mil of the package.
Cyclone IV GX transceivers require a clean reference clock with jitter below the value listed in the device handbook (typically < 100 fs RMS for 3.125 Gbps). Place the reference-clock oscillator within 1 inch of the CLK pins and isolate its power rail from noisy digital supplies. Maintain 100-ohm differential routing with matched lengths for all transceiver lanes; skew mismatches degrade link margin.
Estimated: at full logic utilization the FBGA-896 junction-to-ambient thermal resistance is approximately 15 C/W with a standard 4-layer JEDEC test board, giving a 90 C temperature rise at 6 W dissipation. Provide a thermal pad or heatsink for designs exceeding 4 W; use thermal vias under the central BGA balls to conduct heat into inner copper planes.
Do not assume that configuration mode selection is automatic: the MSEL pins must be tied to specific logic levels for AS, PS, JTAG, or FPP modes before power-up. Forgetting pull-ups on nCONFIG or nSTATUS causes intermittent configuration failures. Cyclone IV GX devices require a specific power-on sequence (VCCINT before VCCA, then VCCIO) to avoid latch-up; review the POR section before designing the sequencing circuit.
Compliance Information
RoHS and REACH compliant per Altera/Intel product declaration. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly disclosed in available data.
