EP4CGX22CF19I7N - Cyclone IV GX FPGA 21.6K LE | Intel / Altera
MPN: EP4CGX22CF19I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $63.85 | $6,385.00 |
| 500 | $56.4 | $28,200.00 |
| 1,000 | $49.1 | $49,100.00 |
EP4CGX22CF19I7N Overview
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks. FPGAs sit within the programmable logic hierarchy between CPLDs (smaller, non-volatile, lower density) and ASICs (custom silicon, highest density, highest NRE cost). The Cyclone IV GX family specifically extends the Cyclone series by integrating 3.125 Gbps transceivers, bridging programmable logic with high-speed serial I/O for protocol bridging and video/display interfaces.
Key differentiating features include up to 66 embedded 18x18 multipliers, dedicated hardware for PLL-based clock management, and built-in 3.125 Gbps multi-gigabit transceivers (MGTs) - a feature not present in the transceiver-less Cyclone IV E family. The integrated transceivers eliminate the need for external PHY chips on common protocols such as PCIe Gen1, Gigabit Ethernet, and CPRI, reducing BOM cost and board area.
The 21,280-logic-element fabric is implemented in a 60 nm TSMC process, balancing die size and static power. Embedded memory is organized as M9K blocks totaling 774 Kbits, supporting true dual-port, single-port, FIFO, and shift register modes. The 324-FBGA package exposes 150 user I/Os plus dedicated transceiver, clock, and configuration pins, enabling dense single-board designs.
Typical applications include industrial video bridging, low-cost PCIe Gen1 endpoint cards, USB 3.0 protocol bridges, motor control and industrial automation, and portable medical imaging interfaces. The transceiver-rich architecture is particularly attractive for designers replacing proprietary ASSP chips with FPGA-based glue logic.
When designing with this device, plan power sequencing for the core (1.2V), I/O banks (1.2V-3.3V), and PLL analog supplies separately, and respect the transceiver reference-clock jitter budget. Configuration via JTAG, Active Serial, or Passive Serial modes must be selected at board level via MSEL pins.
This page synthesizes distributor pricing, same-package drop-in alternatives, and design guidance that goes beyond the manufacturer datasheet to accelerate Cyclone IV GX evaluation.
Drop-in alternatives for EP4CGX22CF19I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX22CF19I7N (same form factor and footprint) — differing in Package, Transceivers, Process Technology, Embedded Memory, PLLs.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX22CF19C8N
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View Datasheet →EP4CGX22CF19C7N
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View Datasheet →EP4CGX22CF19C6N
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View Datasheet →EP4CGX22CF19C6
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View Datasheet →EP4CGX30CF19I7N
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View Datasheet →EP4CGX22CF19I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Series | EP4CGX22 |
| Logic Elements | 21,280 |
| Embedded Memory | 774,144 bits (M9K blocks) |
| Number of I/O | 150 |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Supply Voltage | 1.2 V (core); 1.2V to 3.3V (I/O banks) |
| Package Type | 324-LBGA (FBGA-324) |
| Number of Pins | 324 |
| Number of Multipliers (18x18) | 66 |
| Number of PLLs | 2 |
| Transceivers | Yes, 3.125 Gbps multi-gigabit transceivers |
| Process Technology | 60 nm low-power CMOS |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Mode | JTAG / Active Serial / Passive Serial |
EP4CGX22CF19I7N Pin Configuration
| Pin A1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A2 | IO_1_0 — User I/O pin |
| Pin A3 | IO_1_1 — User I/O pin |
| Pin B1 | GND — Ground reference |
| Pin B2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin B3 | IO_1_2 — User I/O pin |
| Pin C1 | GXB_TX0_P — Transceiver channel 0 transmit (positive) |
| Pin C2 | GXB_TX0_N — Transceiver channel 0 transmit (negative) |
| Pin C3 | GXB_RX0_P — Transceiver channel 0 receive (positive) |
| Pin D1 | GXB_RX0_N — Transceiver channel 0 receive (negative) |
| Pin D2 | VCC_GXB — Transceiver analog supply |
| Pin D3 | REFCLK0_P — Transceiver reference clock (positive) |
| Pin E1 | REFCLK0_N — Transceiver reference clock (negative) |
| Pin E2 | VCCINT — Core logic supply (1.2V) |
| Pin E3 | GND — Ground reference |
| Pin F1 | TMS — JTAG test mode select |
| Pin F2 | TCK — JTAG test clock |
| Pin F3 | TDO — JTAG test data out |
| Pin G1 | TDI — JTAG test data in |
| Pin G2 | nCONFIG — Configuration control (active low) |
| Pin G3 | nSTATUS — Configuration status (active low) |
| Pin H1 | MSEL0 — Configuration mode select bit 0 |
| Pin H2 | MSEL1 — Configuration mode select bit 1 |
| Pin H3 | DCLK — Configuration clock |
Typical Applications
EP4CGX22CF19I7N is suitable for 6 applications: Industrial Video Bridging, PCIe Gen1 Endpoint Card, Motor Control and Industrial Automation, Portable Medical Imaging Interface, USB 3.0 Protocol Bridge, Wireless Baseband Pre-Processing.
Industrial Video Bridging
The EP4CGX22CF19I7N's 3.125 Gbps integrated transceivers and 21,280 logic elements make it well-suited for industrial video bridging applications such as converting Camera Link, GMSL, or FPD-Link III streams to GigE Vision or USB3 Vision. Its 150 user I/Os support multi-channel LVDS video capture alongside parallel sensor interfaces, while the 774 Kbits of M9K memory buffers line-scan camera data between acquisition and transmission. The industrial -40C to +100C temperature range ensures operation in factory-floor cabinets without active cooling. Compared with discrete ASSP bridge chips, this FPGA provides field-upgradable protocol support via JTAG reconfiguration, extending product lifecycle without hardware redesign.
Recommended
PCIe Gen1 Endpoint Card
The integrated transceivers of the EP4CGX22CF19I7N implement a single-lane PCIe Gen1 endpoint (2.5 Gbps) without external PHY hardware, making it ideal for low-cost data acquisition cards and industrial I/O expansion boards. Its 21K logic elements handle DMA engines, MSI-X interrupt logic, and custom register interfaces within a single chip. The 324-FBGA package exposes the PCIe reference-clock pins and transceiver channels required for x1 edge-card layouts. The Quartus Prime IP Catalog provides a turnkey PCIe Gen1 controller, cutting development time to weeks instead of months for first-time PCIe implementers.
Recommended
Motor Control and Industrial Automation
The EP4CGX22CF19I7N's 66 hardware 18x18 multipliers and dedicated PLL blocks deliver deterministic DSP performance for field-oriented control (FOC) of three-phase PMSM and induction motors, with room left over for encoder decoding, CANopen or EtherCAT slave logic, and safety state machines. Its industrial temperature grade and 3.3V LVCMOS/LVTTL I/O bank support direct interfacing to industrial 24V optically isolated I/O via external level shifters. The 774 Kbits of M9K memory holds sine look-up tables and PID controller state, while JTAG-based SignalTap II enables real-time waveform capture on encoder feedback lines during commissioning.
Recommended
Portable Medical Imaging Interface
In portable ultrasound or endoscopy carts, the EP4CGX22CF19I7N acts as a high-speed data aggregator, bridging raw transducer or CMOS sensor LVDS streams to a host processor via 3.125 Gbps transceivers configured as CPRI or serial RapidIO. The 21,280 logic elements implement real-time beamforming preprocessing, while 66 multipliers handle finite-impulse-response (FIR) decimation filters. The low-power 60 nm process keeps junction temperature within industrial limits even in sealed plastic enclosures. Quartus Prime's design partitioning lets medical OEMs reuse a single bitstream across multiple probe types, simplifying regulatory submissions.
Recommended
USB 3.0 Protocol Bridge
The EP4CGX22CF19I7N implements a USB 3.0 device/host bridge by combining one of its 3.125 Gbps transceivers (SuperSpeed signalling) with a soft USB 3.0 controller core from the Quartus Prime IP catalog. Its 150 user I/Os expose UTMI/ULPI interfaces to external USB 2.0 PHYs for backward compatibility, while 774 Kbits of M9K memory handle scatter-gather DMA descriptors. Industrial temperature grade and 60 nm low-power process suit ruggedised bridge dongles used in field-service laptops and military manpacks. The Cyclone IV GX architecture's JTAG-based SignalTap II is invaluable for debugging link-training state machines during USB-IF compliance testing.
Recommended
Wireless Baseband Pre-Processing
Small-cell and picocell baseband pre-processing benefits from the EP4CGX22CF19I7N's combination of CPRI or OBSAI fronthaul transceivers (running at 3.072 Gbps or 1.536 Gbps) and 66 DSP multipliers for crest-factor reduction (CFR) and digital pre-distortion (DPD) of small-footprint power amplifiers. The 21,280 logic elements accommodate the FEC encoder/decoder and IQ sample routing needed for LTE and 5G NR sub-6 GHz small cells. The 324-FBGA footprint keeps board area compact enough for pole-mount or wall-mount small-cell enclosures, and the industrial temperature range tolerates outdoor cabinet temperatures without active cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX22CF19I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX22CF19C8N | EP4CGX22CF19I7 | EP4CGX22CF19C7N | EP4CGX30CF19I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LBGA (F19) | 324-LBGA (F19) - same | 324-LBGA (F19) - same | 324-LBGA (F19) - same | 324-LBGA (F19) - same |
| Logic Elements | 21,280 | 21,280 | 21,280 | 21,280 | 29,440 |
| Embedded Memory | 774,144 bits | 774,144 bits | 774,144 bits | 774,144 bits | 1,080,000 bits |
| Multipliers (18x18) | 66 | 66 | 66 | 66 | 80 |
| User I/O | 150 | 150 | 150 | 150 | 150 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (industrial) | C8 (commercial, faster) | I7 (industrial) | C7 (commercial, slower) | I7 (industrial) |
Key Differentiators
- Integrated 3.125 Gbps multi-gigabit transceivers on this F19 footprint (vs EP4CE40F29I7N (Cyclone IV E, transceiver-less))
- Industrial temperature grade in same F19 footprint as commercial variant (vs EP4CGX22CF19C8N (commercial temperature grade))
- 29,440 LE upgrade path in the same F19 footprint (vs EP4CGX30CF19I7N (Cyclone IV GX 30K LE))
Design Notes
The EP4CGX22CF19I7N requires three independent power rails: VCCINT (1.2V core), VCCIO (1.2V-3.3V per I/O bank, with banks allowed to be mixed), and VCC_GXB (transceiver analog supply, typically 2.5V or 3.3V depending on transceiver configuration). Decouple each rail with 0.1uF X7R ceramic capacitors placed within 5mm of the package ball, and add bulk 10uF-47uF tantalum or polymer capacitors on each rail. Power-on sequencing must follow the Cyclone IV device datasheet: VCCINT must reach 1.2V before VCCIO ramps, and transceivers must be held in reset until VCC_GXB is stable. Failing to sequence properly can cause latch-up or long-term reliability degradation.
At full utilization (21K LE + 8 transceiver channels at 3.125 Gbps), the EP4CGX22CF19I7N can dissipate 1.5W-2.5W depending on toggle rate and transceiver duty cycle. The 324-FBGA package's thermal resistance theta_JA is approximately 12 C/W with a JEDEC-standard 4-layer PCB, yielding a junction temperature rise of ~25C above ambient at 2W. Ensure the PCB thermal design includes a continuous ground plane beneath the BGA and at least four thermal vias in a 3x3 array per quadrant to conduct heat to inner copper layers. For sealed industrial enclosures without airflow, derate logic utilization or move up to the EP4CGX30 only if heat-sinking is added.
The 324-FBGA package uses 1.0mm ball pitch and demands a 4-layer (or preferably 6-layer) PCB stack-up with controlled-impedance routing for transceiver channels. Each 3.125 Gbps transceiver pair requires 100-ohm differential routing with length matching to within 150 mils between P and N traces, and the reference clock traces must be length-matched to within 50 mils. Use a continuous ground plane under the transceiver ball array; do not route signals across split planes beneath the MGT region. Decoupling capacitor pads must use micro-via-in-pad (VIP) or short fan-out to the nearest ball to maintain low ESL at multi-gigabit frequencies.
Three common pitfalls when bringing up the EP4CGX22CF19I7N: (1) leaving MSEL pins floating - they must be hard-strapped to VCCIO or GND via 1k-10k resistors to select the configuration mode; (2) forgetting to add a series ferrite bead on VCC_GXB if transceivers are unused - leaving them unpowered while adjacent I/O toggles can inject noise into the PLL; (3) using EPCS flash larger than supported by the specific Quartus version - verify the configuration device size in the Conversion Programming File dialog before programming. SignalTap II captures via JTAG require that the nCONFIG pin remain high during debug sessions.
Compliance Information
RoHS and REACH compliant per Altera/Intel product declaration. Not AEC-Q100 qualified - automotive safety-critical applications should evaluate Cyclone IV GX automotive-grade variants or other AEC-Q100 qualified FPGAs. Halogen-free status not explicitly stated in available data.
