EP4CGX30CF23C8N - Cyclone IV GX FPGA 29.4K LE | Altera | 484-BGA
MPN: EP4CGX30CF23C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.1 | $821.00 |
| 100 | $74.85 | $7,485.00 |
| 500 | $67.2 | $33,600.00 |
| 1,000 | $60.55 | $60,550.00 |
EP4CGX30CF23C8N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing the hardware function to be defined post-fabrication through software-defined configuration bitstreams. Cyclone IV GX sits within the broader taxonomy of programmable logic devices (PLD), alongside CPLDs and ASICs; its main advantage over ASICs is non-recurring engineering (NRE) cost amortisation, while its advantage over competing smaller FPGAs is the integration of multi-gigabit transceivers alongside the general-purpose fabric.
Key features of the EP4CGX30CF23C8N include four integrated 3.125 Gbps transceivers (GX channel count for this density is 4), up to 364 user I/Os, dedicated hardware DSP blocks supporting 18x18 multipliers, and Quartus II / Quartus Prime design-software support. The 484-ball FBGA package exposes the high pin count demanded by the 30K LE fabric plus transceiver channels, while the -C8N speed grade balances timing margin and frequency headroom.
Architecturally, Cyclone IV GX uses a 60 nm process with a low-power transceiver core, providing low static and dynamic power compared to earlier Cyclone generations. The GX variant specifically integrates PCS/PMA serializer-deserializer blocks, allowing direct connection to SFP, GbE, PCIe Gen1, and other high-speed serial links without external PHY devices.
Typical applications include industrial video bridging, low-cost PCIe endpoint cards, motor control front-ends, machine-vision frame grabbers, and protocol bridge ASIC replacements. The combination of integrated transceivers and 30K LE fabric targets designs that previously required a small FPGA plus a separate PHY.
A core design consideration is power-budgeting: although the 60 nm process is low power, operating all four transceivers simultaneously requires careful thermal planning on the FBGA substrate, and PCB stack-up must follow Intel's high-speed layout recommendations to meet transceiver jitter budgets.
This page synthesizes distributor pricing, same-family drop-in OPNs, and practical design notes that go beyond the device datasheet, enabling faster BOM decisions for Cyclone IV GX designs.
Drop-in alternatives for EP4CGX30CF23C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30CF23C8N (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, Transceivers, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CGX30CF23C8
β Drop-Inβ In Stock
$62.4 / Unit
View Datasheet βEP4CGX30CF23C7N
β Drop-Inβ In Stock
$71.59 / Unit
View Datasheet βEP4CGX30CF23C7
β Drop-Inβ In Stock
$137.62 / Unit
View Datasheet βEP4CGX30CF23C6N
β Drop-Inβ In Stock
$85.78 / Unit
View Datasheet βEP4CGX30CF23C8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV GX |
| Family | Cyclone IV |
| Logic Elements | 29,440 |
| Embedded Memory (bits) | 1,105,920 |
| Embedded Multiplier Blocks (18x18) | 290 |
| Number of Logic Elements / Cells | 29440 |
| Total RAM Bits | 1105920 |
| Package | 484-FBGA (F23) |
| Supplier Device Package | 484-BGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial, N suffix) |
| Speed Grade | C8 |
| Transceivers | Integrated GX transceivers (3.125 Gbps class) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Memory | SRAM-based (requires external configuration device) |
| Design Software | Quartus II / Quartus Prime |
| RoHS Status | Compliant |
EP4CGX30CF23C8N 484-bga Pin Configuration Guide
Pin configuration for EP4CGX30CF23C8N (484-bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX30CF23C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX30CF23C8N is suitable for 6 applications: Industrial Video Bridge / Protocol Converter, Low-Cost PCIe Endpoint Card, Machine Vision Frame Grabber, Motor Control and Industrial Drive Front-End, Networking Protocol Bridge / ASIC Replacement, Test and Measurement Instrumentation.
Industrial Video Bridge / Protocol Converter
The EP4CGX30CF23C8N's 29,440 logic elements and 1,105,920 bits of embedded RAM let designers implement multi-channel video format converters (DVI/HDMI/SDI/LVDS bridging) without external frame buffers. The four 3.125 Gbps transceivers support SDI coaxial cable lengths up to 100 m at HD rates, and the industrial -40C to +100C operating range survives factory cabinet temperature rise. The 484-FBGA package also provides the user I/O count needed to drive parallel RGB or Camera Link interfaces simultaneously.
Recommended
Low-Cost PCIe Endpoint Card
The Cyclone IV GX family integrates a hardened PCIe Gen1 IP core that, combined with the device's transceivers, allows a single FPGA to implement a PCIe x1 endpoint card. The 29K LE fabric supports custom DMA engines, register interfaces, and protocol glue. The EP4CGX30CF23C8N's -C8 speed grade meets PCIe Gen1 250 MHz clock timing with margin, while the FBGA-484 package exposes the PCIe hard IP pins and side-band signals.
Recommended
Machine Vision Frame Grabber
With 290 dedicated 18x18 multipliers and 30K LEs, the EP4CGX30CF23C8N is sized for image preprocessing pipelines including Bayer demosaicing, gamma correction, and Sobel/edge filters running at Camera Link full-mode rates (up to 85 MHz). The 290 multipliers handle real-time DSP without forcing the fabric to emulate multiplies. The industrial temperature grade allows deployment in factory-floor machine vision enclosures.
Recommended
Motor Control and Industrial Drive Front-End
The 290 hardware multipliers combined with multi-axis PWM generation logic make the EP4CGX30CF23C8N suitable for industrial motor drives controlling multiple axes (3 to 6 axes typical). The integrated transceivers support industrial fieldbus such as EtherCAT or Sercos via FPGAs-based MACs. The -40C to +100C industrial temperature range handles the harsh environment inside an inverter cabinet. The FBGA-484 package provides sufficient I/O for encoder inputs, Hall sensors, and gate-driver outputs.
Recommended
Networking Protocol Bridge / ASIC Replacement
The EP4CGX30CF23C8N is frequently used as a low-cost ASIC for protocol bridging such as GbE to SPI, UART to I2C, or custom serial protocols. The integrated transceivers handle GbE PHY connectivity, while the 30K LE fabric implements the bridge glue logic, custom packet processors, or legacy industrial protocols. The SRAM-based configuration supports field-upgradable bitstreams via JTAG or remote upgrade over Ethernet.
Recommended
Test and Measurement Instrumentation
Test equipment manufacturers use the EP4CGX30CF23C8N as a flexible measurement engine, with the 30K LEs implementing custom DSP, the transceivers handling multi-Gbps data capture from A/D converters, and the embedded RAM buffering sample streams. The industrial temperature grade supports benchtop and chassis-mount instrument environments. Quartus Prime support also enables IP integration for standard protocols such as I2C, SPI, and UART used to configure instrument peripherals.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30CF23C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30CF23C8 | EP4CGX30CF23C7N | EP4CGX30CF23C7 | EP4CGX30CF23C6N |
|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 29,440 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 |
| Embedded Multipliers (18x18) | 290 | 290 | 290 | 290 | 290 |
| Speed Grade | C8 | C8 | C7 | C7 | C6 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Transceivers (GX) | Integrated 3.125 Gbps | Integrated 3.125 Gbps | Integrated 3.125 Gbps | Integrated 3.125 Gbps | Integrated 3.125 Gbps |
Key Differentiators
- Integrated 3.125 Gbps transceivers in a low-density FPGA (vs EP4CGX30BF14C8N)
- High logic density in the F23 large BGA package (vs EP4CGX22CF19C8N)
- Industrial temperature grade with -C8 high speed grade (vs EP4CGX30CF23C8)
Design Notes
Estimated: at typical operation (all four transceivers active, 50% logic toggle, 100 MHz internal clock), the EP4CGX30CF23C8N draws approximately 1.5 W to 2.5 W from the core rail plus transceiver power. A multi-rail LDO + switching regulator topology is recommended: use a 1.0 V to 1.2 V buck for VCCINT, an LDO for VCCPD (3.0 V), and separate filtered supplies for VCCA and VCCP for the transceiver PLL. Decoupling follows Intel's Cyclone IV GX reference design with 0.1 uF and 10 uF caps at every supply pin pair.
The 484-FBGA package has a theta_JA typically in the 15 to 20 C/W range when the BGA is soldered to a 4-layer PCB with the inner ground/power planes used for thermal spreading. Operation at industrial -40C to +100C junction is feasible for typical loads. Ensure the central ground balls are thermally tied to the inner ground plane with stitched thermal vias to keep the FPGA within its thermal envelope.
Cyclone IV GX transceivers require impedance-controlled differential pairs (100 ohm differential, 85 ohm common-mode impedance) routed over a continuous reference plane. Use Intel's pin-out file and IBIS models to plan stack-up, layer transitions must be minimised and reference-plane discontinuities avoided. The high-speed transceiver lanes should not cross other high-speed signals or split-plane regions.
Do not skip the configuration device design - the EP4CGX30CF23C8N is SRAM-based and loses its bitstream on power-down. Choose an EPCQ or EPCS configuration device that matches the bitstream size. JTAG chain must include both the FPGA and the configuration device for in-system programming. The CONF_DONE pin should be pulled high with a 10 kohm resistor and monitored by the system controller for boot failure.
Compliance Information
RoHS and REACH compliance confirmed by Altera/Intel product page; AEC-Q100 not applicable for FPGAs. Halogen-free status was not stated in the provided data and is marked unknown. Conflict-minerals compliance is standard for Intel/Altera product lines.
