EP4CE55F23C9LN - Cyclone IV E FPGA 55K LE | Altera
MPN: EP4CE55F23C9LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $130.84 | $130.84 |
| 10 | $126.5 | $1,265.00 |
| 100 | $121.3 | $12,130.00 |
| 500 | $115.7 | $57,850.00 |
| 1,000 | $110.45 | $110,450.00 |
EP4CE55F23C9LN Overview
A field-programmable gate array (FPGA) is a semiconductor device containing reprogrammable logic fabric and programmable routing. Designers configure the logic elements with HDL to implement parallel custom hardware rather than a fixed instruction-set processor. In the broader taxonomy, an FPGA belongs to programmable logic -> FPGA/CPLD -> integrated circuit, and Cyclone IV is a low-cost, low-power FPGA family optimized for high-volume applications.
Key features include 55,856 logic elements, organized as 3,491 LAB/CLB blocks; 2,396,160 embedded RAM bits; and 324 general-purpose user I/O. The 60 nm low-power process and 1.2 V core reduce static and dynamic power versus earlier Cyclone families. The speed-grade designator and commercial temperature rating make this part a middle-cost configuration suitable for controlled-environment equipment.
The EP4CE55F23 is part of the Cyclone IV E device table that shares the same 484-ball FBGA footprint across EP4CE55 package variants. The fabric uses logic array blocks, each containing sixteen logic elements, and third-party specification data lists 3,491 CLBs. It includes block RAM for data buffering, external memory interfaces, LVDS I/O support, and clock networks. The absence of hard transceivers means high-speed serial links need external PHY/transceiver devices or a different FPGA family with hardened SerDes.
Typical applications include industrial motor control, software-defined radio digital front-ends, video and image processing, medical imaging front-ends, test and measurement instrumentation, and IoT edge gateways. With 324 I/O, this FPGA can connect to many ADCs, DACs, memory devices, and system buses while keeping parallel processing in hardware.
When designing the 1.2 V power delivery, provide separate low-impedance rails for core and I/O and place decoupling capacitors close to the BGA balls. Because FBGA-484 uses 1 mm pitch, a four-layer PCB with via fanout under the package is recommended; use simulation or a reference design for pin assignments. Ensure configuration device and clock termination are planned before layout.
This page synthesizes verified distributor inventory, pricing as of 2026-09-10, package-compatible Cyclone IV alternatives, and design guidance not found in typical distributor listings.
Drop-in alternatives for EP4CE55F23C9LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23C9LN (same form factor and footprint) — differing in Package, Speed Grade, Temperature Grade, Configuration Modes, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE55F23C8LN
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP4CE55F23I9LN
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE55F23I8LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165.2 / Unit
View Datasheet →EP4CE55F23C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$56.4 / Unit
View Datasheet →EP4CE55F23C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$54.92 / Unit
View Datasheet →EP4CE55F23C9LN Maximum Ratings & Electrical Characteristics
| Product Family | Cyclone IV E |
| Logic Elements/Cells | 55856 |
| Logic Array Blocks / CLBs | 3491 |
| Total RAM Bits | 2,396,160 bits |
| User I/O | 324 |
| Package Type | 484-FBGA (F23) |
| Number of Balls | 484 |
| Package Dimensions | 23 mm x 23 mm |
| Ball Pitch | 1 mm |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm |
| Maximum Clock Frequency (aggregator-listed) | 265 MHz |
| Temperature Grade | Commercial (C) |
| Speed Grade Designator | 9 |
| Terminal Finish / Lead-Free | Lead-free (N suffix) |
| RoHS Status | Compliant (per distributor listing) |
| Mounting Type | Surface Mount |
| Device Type | FPGA (Field Programmable Gate Array) |
EP4CE55F23C9LN 23 mm x 23 mm Pin Configuration Guide
Pin configuration for EP4CE55F23C9LN (23 mm x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23C9LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23C9LN is suitable for 6 applications: Industrial Motor Control, Software-Defined Radio, Video and Image Processing, Medical Imaging Front-End, Test and Measurement Instrumentation, IoT Edge Gateway.
Industrial Motor Control
The EP4CE55F23C9LN can act as a parallel processing engine for multi-axis motor control. With 55,856 logic elements, 324 user I/O and 2,396,160 RAM bits, it can instantiate several SVPWM modulators, quadrature encoder interfaces, and current-loop PI controllers simultaneously. The 1.2 V core and 60 nm process keep dynamic power manageable in industrial enclosures, while the 484-FBGA package supports the number of gate-driver PWM outputs and ADC sample buses needed. For safety-related machinery, the FPGA can implement redundant logic and lock-step compare functions on-chip. Because it is a commercial-temperature part, use it in controlled-temperature industrial cabinets; choose I-grade variants such as EP4CE55F23I8LN when ambient temperatures exceed the commercial range.
Recommended
Software-Defined Radio
Software-defined radio systems use the EP4CE55F23C9LN as a digital down/up-conversion engine between RF data converters and a host processor. With 55,856 logic elements and 324 I/O, you can implement multiple DDC/DUC chains, wideband FIR decimators, digital AGC and protocol-specific symbol processing in parallel. The 2,396,160 RAM bits provide block RAM for coefficient and sample FIFOs; 324 I/O supports parallel LVDS interfaces to ADCs/DACs and control buses. The aggregator-listed 265 MHz clock class is adequate for intermediate-frequency processing. Use I/O banks matched to converter logic voltage levels. A 1.2 V core reduces board power versus larger FPGAs. Pair with smaller Cyclone IV family devices for telemetry or control-plane subfunctions.
Recommended
Video and Image Processing
Video-processing pipelines require parallel line buffers and pixel arithmetic. The EP4CE55F23C9LN provides 2,396,160 RAM bits for line/frame storage and 55,856 logic elements for filters, color-space converters, resizers, and timing generators. Its 324 user I/O allow connection of multiple camera parallel buses, display interfaces, and external memory controllers. The FPGA can implement 3x3 convolution kernels, gamma correction, and scaling concurrently without tying up a CPU. The low-power 1.2 V core helps compact camera and display systems avoid active cooling. Choose this part for indoor video walls, machine-vision cameras, and embedded display control. For machine-vision environments above 85°C, use an industrial-grade Cyclone IV E variant such as EP4CE55F23I9LN.
Recommended
Medical Imaging Front-End
Medical imaging and patient-monitoring front-ends benefit from the EP4CE55F23C9LN's deterministic timing and parallel signal processing. It can interface with ultrasound AFEs, CMOS image sensors, and multichannel ADC devices using 324 user I/O. The FPGA performs beamforming, digital filtering, noise gating, and data formatting before passing images to embedded processors. 2,396,160 RAM bits buffer ultrasound scan lines or imaging data before host transfer. Its commercial temperature range is typical for hospital-room equipment with controlled ambient cooling. The Cyclone IV E family is not AEC-Q100 qualified, but deterministic hardware helps meet medical safety requirements when logic redundancy and monitoring are designed in. Use industrial-temperature Cyclone IV variants for portable or mobile medical carts with wider ambient ranges.
Recommended
Test and Measurement Instrumentation
Test instruments need flexible I/O and high-speed digital control. The EP4CE55F23C9LN's 324 user I/O can connect to multiple ADCs, DACs, comparators, and digital buses while its 55,856 logic elements handle trigger logic, deep FIFOs, pattern generators, and custom counters. The 2,396,160 RAM bits support acquisition buffers and lookup-table corrections. The 484-FBGA package fits on mixed-signal instrument PCBs where processor and analog front-end sections are separated. Use the FPGA to implement time-to-digital converters, arbitrary waveform sequencing, or protocol analyzer state machines. A 1.2 V core reduces thermal stress in benchtop enclosures. Because of the high ball count, use a four-layer or thicker PCB with careful via fanout under the FPGA.
Recommended
IoT Edge Gateway
As an edge gateway aggregator, the EP4CE55F23C9LN can bridge Ethernet MACs, GPIO sensor arrays, and low-cost MCUs with deterministic hardware. 324 I/O provide enough lines for multiple UART/SPI/I2C, custom sensor decoding, and memory interfaces; 55,856 logic elements can handle packet classification, CRC offload, and a small soft processor. 2,396,160 RAM bits store descriptor tables and small packet buffers. At 1.2 V core, it consumes lower power than earlier 90 nm FPGAs, making it suitable for wall-powered IoT hubs. Its commercial temperature grade is intended for indoor gateways. Although it lacks hard Ethernet transceivers, external PHY chips provide Ethernet ports. For industrial gateways in uncontrolled factory environments, choose an I-grade Cyclone IV variant.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23C9LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C8LN | EP4CE55F23I9LN | EP4CE55F23C7N |
|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) |
| Logic Elements/Cells | 55856 | 55856 | 55856 | 55856 |
| Total RAM Bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits |
| User I/O | 324 | 324 | 324 | 324 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) |
| Speed Grade Designator | 9 | 8 | 9 | 7 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free / N Suffix | Yes | Yes | Yes | Yes |
Key Differentiators
- Lead-free low-power commercial Cyclone IV E part at 55K density (vs EP4CE55F23C8LN)
- Commercial temperature grade optimized for controlled environments (vs EP4CE55F23I9LN)
- No hard transceivers means simpler 1.2 V core power architecture (vs High-end FPGA families with hardened SerDes)
Design Notes
The EP4CE55F23C9LN core is powered from a 1.2 V rail that may need multiple amperes at high utilization. Estimated core current depends on logic utilization, clock frequency, and I/O activity; use the Quartus Power Analyzer after fitting to estimate actual current. Place ceramic decoupling capacitors in a 100 nF/1 uF/10 uF mixture close to the BGA power balls, and keep the 1.2 V plane low impedance across 10 MHz to 100 MHz.
The 484-ball FBGA package uses a 23 x 23 mm body with 1 mm pitch. Fanout every ball using microvias or through vias in a four-layer or thicker stackup. Refer to the Cyclone IV pin connection guidelines for dedicated power, ground, configuration, and clock balls. Avoid routing high-speed LVDS pairs under the FPGA unless you follow the recommended reference-plane rules.
Do not assume that all pins in the EP4CE55F23 package are general-purpose I/O; some pins are dedicated configuration, clock, or power pins. The FPGA has no internal non-volatile configuration memory, so an external EPC/EPCS configuration device or a host processor must load the SOF/POF file after power-up. Verify configuration pin pull-ups and mode select strapping before PCB release.
The commercial EP4CE55F23C9LN is typically specified for 0°C to 85°C junction/ambient operation, but exact thermal specifications depend on airflow, PCB copper, and package thermal resistance. Estimated junction temperature can be calculated from power dissipation and board thermal characteristics; if the design approaches 85°C, add forced airflow or select an I-grade industrial FPGA variant.
Compliance Information
Distributor and datasheet-aggregator listings show lead-free finish and RoHS-compliant status. Exact REACH/halogen-free/conflict-minerals paperwork should be requested from the supplier for the relevant date code.
