EP4CE55F23I7N - 55K LE Cyclone IV E FPGA 484-BGA | Intel
MPN: EP4CE55F23I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $178.5 | $178.50 |
| 10 | $165.2 | $1,652.00 |
| 100 | $148.75 | $14,875.00 |
| 500 | $132.4 | $66,200.00 |
| 1,000 | $119.6 | $119,600.00 |
EP4CE55F23I7N Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic, memory, and I/O blocks can be programmed by the end user to implement arbitrary digital functions. FPGAs sit in the programmable logic layer of the digital design hierarchy - above fixed-function ASICs and microcontrollers in flexibility, below them in per-unit cost at very high volumes. Cyclone IV E is positioned for high-volume, cost-sensitive applications such as industrial control, video processing, and communications infrastructure.
Key features of the EP4CE55F23I7N include 3,491 configurable logic blocks (CLBs) arranged as logic array blocks (LABs), 56 embedded 18x18 multipliers for moderate DSP throughput, 4 phase-locked loops (PLLs) for flexible clock management, and an industrial temperature rating of -40C to +100C indicated by the "I7" speed/temperature grade suffix. The device supports a variety of I/O standards including LVDS, LVCMOS, SSTL, and HSTL, and offers dedicated DDR/DDR2/QDRII memory interfaces.
Architecturally, the Cyclone IV E family uses a TSMC 60 nm low-power process with 1.2 V core operation, separate programmable I/O banks that each support a mix of single-ended and differential standards, and an on-chip configuration controller that supports JTAG, AS, PS, and FPP configuration modes. Hard IP blocks such as memory controllers and PLLs reduce soft-logic overhead and improve timing closure.
Typical applications include industrial machine vision, video surveillance and broadcast infrastructure, motor and motion control, automotive infotainment prototypes, wireline/wireless bridge and aggregation equipment, and medical imaging front-ends. The combination of high logic density and a generous user-I/O count makes the EP4CE55F23I7N particularly suitable for mid-range digital signal aggregation designs.
When designing with this part, plan thermal dissipation carefully - the 1.0 mm pitch FBGA requires a multi-layer PCB with via-in-pad and a solid ground/power plane stack-up. Quartus II (or the Quartus Prime Lite edition) is required for synthesis, place-and-route, and timing analysis. Configuration memory size must be sized appropriately for the chosen bitstream compression setting.
Drop-in alternatives for EP4CE55F23I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE55F23I7N (same form factor and footprint) β differing in Package, Speed Grade, Configuration Modes, Embedded 18x18 Multipliers, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE55F23C8N
β Drop-Inβ In Stock
$74 / Unit
View Datasheet βEP4CE55F23C7N
β Drop-Inβ In Stock
$56.4 / Unit
View Datasheet βEP4CE55F23A7N
β Drop-Inβ In Stock
$134.4 / Unit
View Datasheet βEP4CE55F23I7
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP4CE55F23C9LN
β Drop-Inβ In Stock
$110.45 / Unit
View Datasheet βEP4CE55F23C9L
β Drop-Inβ In Stock
$76.73 / Unit
View Datasheet βEP4CE55F23I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone IV E |
| Logic Elements (LE) | 55,856 |
| Configurable Logic Blocks (CLBs) | 3,491 |
| Embedded Memory Bits | 2,396,160 |
| Maximum User I/O | 324 |
| Embedded 18x18 Multipliers | 56 |
| Phase-Locked Loops (PLLs) | 4 |
| Package | 484-FBGA (F23) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| Lead Free | Yes |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V (typical) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 7 |
| Configuration Modes | JTAG, AS, PS, FPP |
| Mounting Type | Surface Mount (BGA) |
EP4CE55F23I7N 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE55F23I7N (23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE55F23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE55F23I7N is suitable for 6 applications: Industrial Machine Vision and Inspection, Video Surveillance and Broadcast Infrastructure, Motor and Motion Control, Wireline/Wireless Bridge and Aggregation Equipment, Automotive Infotainment Prototypes, Medical Imaging Front-End Processing.
Industrial Machine Vision and Inspection
The EP4CE55F23I7N fits industrial machine vision systems because it combines 55,856 logic elements with 56 embedded 18x18 multipliers and 324 user I/Os. Multipliers accelerate Sobel, Gaussian, and FFT preprocessing on Camera-Link or GigE Vision streams. The 2.4 Mbit embedded SRAM serves as cost-effective line buffers between the sensor pipe and the host, while the industrial -40C to +100C temperature grade survives unconditioned factory-floor enclosures without thermal derating. Pair with external DDR2 SDRAM for full-frame buffering; the hard memory interface pins on the F23 footprint minimize soft-logic overhead.
Recommended
Video Surveillance and Broadcast Infrastructure
Surveillance and broadcast encoder designs benefit from the EP4CE55F23I7N's 55,856 logic elements, which comfortably hold H.264 or MPEG-2 encoder cores plus de-interlacing and scaling pipelines. The 324 user I/Os aggregate multiple SDI/HDMI inputs plus network interfaces, and the four on-chip PLLs derive the diverse video pixel clocks from a single reference. Embedded memory (2.4 Mbit) supports line-store buffers for de-interlacing without external SRAM. The F23 484-FBGA's 1.0 mm pitch and 23x23 mm footprint are compatible with mid-size video capture cards.
Recommended
Motor and Motion Control
The EP4CE55F23I7N is well matched to multi-axis servo and stepper motion controllers, where its 56 DSP multipliers can compute Park/Clarke transforms and PI control loops for up to several axes simultaneously. The 324 user I/Os accept quadrature encoder inputs and PWM outputs for driver stages, while the four PLLs synthesize the high-resolution PWM carrier clocks. Industrial temperature rating (-40C to +100C) supports cabinet-free installation near motors, where ambient temperature rises. The F23 484-FBGA footprint has been the de-facto standard for industrial motion control cards since Cyclone IV E launched.
Recommended
Wireline/Wireless Bridge and Aggregation Equipment
In telecom edge equipment such as GPON ONTs, LTE small cells, and protocol bridges, the EP4CE55F23I7N's 55,856 LE hold PHY-layer state machines, traffic shaping FIFOs, and QoS schedulers. The 324 user I/Os accommodate multiple SGMII/RGMII Ethernet MACs plus serial RapidIO or PCIe Gen1 soft cores, and the hard memory controllers interface directly to DDR2/QDRII external memory for packet buffering. The 60 nm low-power process reduces idle current, important for thermally constrained customer-premises equipment.
Recommended
Automotive Infotainment Prototypes
The EP4CE55F23I7N's 55,856 logic elements allow prototypes of automotive infotainment head units, instrument clusters, and ADAS preprocessing pipelines. For production automotive deployments the EP4CE55F23A7N variant (-40C to +125C, AEC-Q100 screening) should be selected. The 324 I/Os support multiple LVDS display outputs, MOST or CAN-FD vehicle bus interfaces, and camera input aggregation. The 60 nm low-power process keeps thermal dissipation manageable in dash-mounted enclosures.
Recommended
Medical Imaging Front-End Processing
Ultrasound beamforming and endoscopy image processing require moderate logic density with deterministic DSP performance - exactly where the EP4CE55F23I7N's 56 18x18 multipliers and 55,856 LE fit. The 2.4 Mbit embedded memory holds scan-line buffers and beamformer delay tables, and the F23 484-FBGA is small enough to integrate alongside analog front-end ASICs on medical imaging boards. Industrial temperature rating supports clinical and bedside use cases. Designers should validate IEC 60601 EMI/EMC margins around the FPGA switching supply rails.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE55F23I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE55F23C8N | EP4CE55F23C7N | EP4CE55F23A7N | EP4CE55F23I7 | EP4CE55F23C9LN | EP4CE55F23C9L |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 8 (slower) | 7 | 7 | 7 | 9 (faster) | 9 (faster) |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| User I/O (max) | 324 | 324 | 324 | 324 | 324 | 324 | 324 |
| DSP Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 | 56 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Estimated Unit Price (USD, qty 1) | 178.50 | 156.00 | 162.00 | 210.00 | 175.00 | 184.00 | 183.00 |
Key Differentiators
- Industrial temperature grade -40C to +100C in the F23 footprint (vs EP4CE55F23C8N)
- Speed grade 7 versus speed grade 8 gives tighter timing margins (vs EP4CE55F23C8N)
- F23 484-FBGA compatibility enables density and grade migrations on the same PCB (vs EP4CE40F23I7N)
Design Notes
The F23 484-FBGA uses 1.0 mm ball pitch on a 23x23 mm substrate. Design the PCB with at least 6 layers and via-in-pad technology to break out the dense BGA grid; standard dog-bone fanout requires excessive board area. Use 0.5 oz copper on outer layers for BGA pads and 1 oz on inner planes. Maintain a continuous ground plane directly beneath the device to provide the low-impedance return path required for hundreds of simultaneously-switching I/Os.
Cyclone IV E requires three supply rails: VCCINT (1.2 V core), VCCIO (1.2-3.3 V per bank), and VCCA/VCCD_PLL (2.5 V analog). Estimate: dynamic current at 50 MHz and 50% toggle on 200 I/Os adds roughly 0.5 A on VCCINT; quiescent plus leakage at +100C junction adds another 0.2 A. Decouple every VCCINT and VCCIO pin with a 0.1 uF X7R capacitor placed within 2 mm of the ball, plus bulk 100 uF polymer tantalum per rail.
Estimated: with the 484-FBGA at 50% utilization and 200 MHz internal clock, the EP4CE55F23I7N dissipates approximately 1.5-2.0 W. The package junction-to-ambient thermal resistance (theta_JA) for a 484-FBGA on a 6-layer PCB with proper thermal via array is about 12-15 C/W, yielding a 25-30 C junction temperature rise. For industrial deployments at +70C ambient, plan for either a heat spreader or top-side airflow to keep junction below +100C.
Do not mix 1.5 V and 1.8 V VCCIO on adjacent banks without verifying the bank-VCCIO pin assignment in the device handbook - mixing within a bank causes input threshold ambiguity. Always include the JTAG TCK pull-down and TMS pull-up resistors; missing pull-ups are the most common configuration failure on first prototypes. Reserve a dedicated MSEL[3:0] pull-up/pull-down resistor network to set the configuration mode (AS, PS, JTAG, FPP).
Compliance Information
RoHS compliant per distributor listings. Lead-free per F23 package marking. Not AEC-Q100 qualified; choose EP4CE55F23A7N suffix for automotive-grade screening.
