EP4CGX50CF23I7 - Cyclone IV GX FPGA, 49K LE, 484-FBGA | Intel
MPN: EP4CGX50CF23I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152 | $1,520.00 |
| 100 | $138 | $13,800.00 |
| 500 | $124 | $62,000.00 |
| 1,000 | $112 | $112,000.00 |
EP4CGX50CF23I7 Overview
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, programmable I/O cells, and a hierarchy of routed interconnects that can be reconfigured by the end user after manufacture. In a system hierarchy, an FPGA sits above general-purpose microcontrollers and below custom ASICs: it offers ASIC-class performance and parallelism for the data path while retaining the programmability of software-driven processors. The Cyclone IV GX family specifically targets cost-sensitive applications that need integrated multi-gigabit transceivers and moderate logic capacity without paying for a high-end Stratix-class device.
Key features of the EP4CGX50CF23I7 include 50K equivalent logic elements, 220 multiplier blocks (18x18), six phase-locked loops (PLLs), and dual-configuration flash support through the Cyclone IV GX configuration subsystem. The integrated transceivers support common protocols such as PCIe Gen1, Gigabit Ethernet, CPRI/OBS, and serial RapidIO, with on-chip termination and 8B/10B encoding hardware.
The architecture uses SRAM-based configuration cells loaded from external flash, JTAG, or Active Serial configuration, with built-in decompression and encryption options (AES-128). This makes the EP4CGX50CF23I7 well suited for applications that require both moderate DSP throughput and serial-link connectivity but do not need the largest Cyclone IV E variants.
Typical applications include industrial video-broadcast equipment, low-end wireless baseband processing, machine-vision interfaces, PCIe endpoint cards, and protocol-bridging designs that translate between Gigabit Ethernet, CPRI, or OBSAI and a parallel backplane. Designers frequently pair the device with external DDR2/DDR3 SDRAM and serial flash for configuration.
When designing with this device, pay close attention to the transceiver reference-clock routing and the decoupling network: each GXB lane requires its own AC-coupling capacitor and a clean 100 MHz or 156.25 MHz reference. The 484-FBGA package uses 1.0 mm pitch balls; PCB fabrication in at least 6 layers with micro-vias is recommended to fan out the transceiver signals without stub reflections.
This page synthesizes distributor pricing, same-brand drop-in alternatives from the Cyclone IV GX family, and practical design notes not collected in a single section of the original datasheet.
Drop-in alternatives for EP4CGX50CF23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX50CF23I7 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX50CF23I7N
✅ Drop-In✓ In Stock
$121.4 / Unit
View Datasheet →EP4CGX50CF23C8N
✅ Drop-In✓ In Stock
$56.5 / Unit
View Datasheet →EP4CGX50CF23C7N
✅ Drop-In✓ In Stock
$110.5 / Unit
View Datasheet →EP4CGX50CF23C6N
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →EP4CGX30CF23I7N
✅ Drop-In✓ In Stock
$41.2 / Unit
View Datasheet →XC6SLX45T-3FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CGX50CF23I7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Device Logic Elements | 49,888 |
| Logic Array Blocks (LABs) | 3,118 |
| Embedded Memory (bits) | 2,562,048 |
| Embedded Memory (M9K blocks) | 290 |
| 18x18 Multipliers | 220 |
| PLLs | 6 |
| Maximum User I/Os | 290 |
| Transceivers (GXB) | Up to 8 (3.125 Gbps) |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power |
| Package | 484-FBGA, F23, 23x23 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Scheme | Active Serial, Passive Serial, JTAG |
| RoHS Status | Compliant (lead-free) |
EP4CGX50CF23I7 484-fbga, f23, 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX50CF23I7 (484-fbga, f23, 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX50CF23I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX50CF23I7 is suitable for 7 applications: Industrial Video Broadcast Equipment, PCIe Gen1 Endpoint Card, Wireless Baseband Processing, Industrial Machine Vision, Protocol Bridging / Industrial Networking, Test and Measurement Instrumentation, Aerospace and Defense Avionics.
Industrial Video Broadcast Equipment
The EP4CGX50CF23I7 is well-suited to industrial video broadcast equipment because of its integrated 3.125 Gbps GXB transceivers and 220 18x18 multipliers, which together handle SDI, HD-SDI, and 3G-SDI serial-link encoding without external serializers. The 290 user I/Os support parallel video data paths to a companion FPGA or ASIC, while the 2,562 Kbits of embedded memory buffer line-store processing between the transceivers and the backplane. In a typical SDI router card, the part sits between BNC inputs and an Ethernet backplane, performing clock-domain crossing and serial-to-parallel conversion. The I7 industrial speed grade is required to meet the tight serialiser setup/hold windows at 2.97 Gbps. The 60 nm low-power process keeps typical power under 4 W at full transceiver utilization.
Recommended
PCIe Gen1 Endpoint Card
The EP4CGX50CF23I7 is a strong fit for PCIe Gen1 endpoint cards because the Cyclone IV GX family includes a hard PCIe Gen1 IP block that supports x1 and x4 lane configurations at 2.5 Gbps without consuming FPGA logic resources. Designers place the PCIe hard IP on up to 4 GXB transceiver channels, freeing the remaining transceivers for auxiliary links (e.g., SATA, SGMII, or front-panel I/O). The 49,888 logic elements are sufficient for typical endpoint functions such as DMA engines, MSI-X interrupt controllers, and BAR-mapping logic, while the 220 multipliers accelerate on-card DSP like FIR filters or FFT pre-processing. Compared to the Xilinx Spartan-6 LXT equivalent, the Cyclone IV GX PCIe IP block is typically faster to close timing in Quartus II.
Recommended
Wireless Baseband Processing
The EP4CGX50CF23I7 is widely used in low-end wireless baseband processing, including small-cell base stations and protocol-bridging designs that translate between CPRI/OBSAI fronthaul and a serial backplane. The 8 GXB transceivers support CPRI line rates up to option 3 (2457.6 Mbps) and OBSAI RP3 links without external PHYs. The 220 18x18 multipliers deliver the DSP throughput required for crest-factor reduction (CFR), digital predistortion (DPD), and channel filtering at sub-6 GHz frequencies. Industrial temperature grade and the I7 speed grade are typically required for outdoor small-cell enclosures. The Cyclone IV GX family is preferred over older Cyclone III parts because of its lower power and integrated 8B/10B PCS hardware.
Recommended
Industrial Machine Vision
The EP4CGX50CF23I7 suits industrial machine-vision applications such as Camera Link, CoaXPress, and GigE Vision frame grabbers. The integrated transceivers receive serialized pixel data from CoaXPress cameras at up to 3.125 Gbps per lane, while the FPGA fabric performs Bayer demosaicing, color-space conversion, and edge detection. The 2,562 Kbits of embedded memory are sufficient to buffer at least one full HD frame (1920x1080x10b) for line-store processing. The 290 user I/Os connect to DDR2/DDR3 memory for frame storage and to LVDS/PoCL channels for legacy interfaces. The industrial temperature range and lead-free F23 package support factory-floor deployment.
Recommended
Protocol Bridging / Industrial Networking
The EP4CGX50CF23I7 is a cost-effective choice for industrial protocol-bridging gateways that translate between Ethernet, PROFINET, EtherCAT, and serial fieldbuses. The 8 GXB channels support multiple SGMII links simultaneously, allowing the FPGA to act as a managed Ethernet switch with PROFINET IRT capability. The 49,888 logic elements and 220 multipliers deliver enough throughput for line-rate PROFINET IRT forwarding with cut-through latency below 1 microsecond. The 60 nm low-power process keeps total board power under 5 W, important for DIN-rail-mounted industrial controllers without active cooling. The F23 484-FBGA package supports 290 I/Os, which is sufficient to expose multiple Ethernet PHYs and RS-485 transceivers simultaneously.
Recommended
Test and Measurement Instrumentation
The EP4CGX50CF23I7 is commonly deployed in mid-range test-and-measurement instruments such as logic analyzers, protocol analyzers, and bit-error-rate testers. The 8 GXB transceivers provide 3.125 Gbps sampling on multiple channels simultaneously, while the FPGA fabric performs pattern generation, real-time error counting, and statistical analysis. The 220 18x18 multipliers accelerate PRBS generation/checking and SERDES equalization algorithms. The 290 user I/Os support GPIO expansion for instrument front-panel controls and LCD/LED displays. Compared to ASIC-based BERT designs, the Cyclone IV GX approach offers faster time-to-market and field-upgradeable firmware, which is essential for emerging protocols in the test and measurement industry.
Recommended
Aerospace and Defense Avionics
The EP4CGX50CF23I7 with industrial temperature range is suitable for aerospace and defense avionics subsystems such as flight-data recorders, MIL-STD-1553 bridges, and ARINC 429 protocol converters. The integrated transceivers support ARINC 818 (Avionics Digital Video Bus) links at rates up to 3.125 Gbps, while the FPGA fabric implements the MIL-STD-1553 BC/RT/MT modes alongside ARINC 429 channel management. The 49,888 logic elements are sufficient for moderate-complexity avionics controllers with multiple serial channels. The industrial temperature grade (-40C to +100C) supports both pressurized cabin and unpressurized avionics bays. Lead-free finish is mandatory for most modern aerospace OEMs. Designers should still add component-level derating per DO-254 for flight-critical designs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX50CF23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX50CF23I7N | EP4CGX50CF23C8N | EP4CGX50CF23C7N | EP4CGX30CF23I7N | XC6SLX45T-3FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F23) | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (F23) - same | 484-FBGA (FGG484) - same ball count, different pin map |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Xilinx |
| Family | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Cyclone IV GX | Spartan-6 LXT |
| Logic Elements | 49,888 | 49,888 (identical) | 49,888 (identical) | 49,888 (identical) | 29,440 (-41%) | 43,661 (-12%) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial) | I7 | C8 (fastest commercial) | C7 | I7 | -3 (Xilinx speed grade) |
| 18x18 Multipliers | 220 | 220 (identical) | 220 (identical) | 220 (identical) | 66 (-70%) | 58 DSP48A1 slices (-74%) |
| Embedded Memory | 2,562 Kbits | 2,562 Kbits (identical) | 2,562 Kbits (identical) | 2,562 Kbits (identical) | 1,080 Kbits (-58%) | 2,088 Kbits (-19%) |
| Transceivers | 8 x 3.125 Gbps GXB | 8 x 3.125 Gbps GXB (identical) | 8 x 3.125 Gbps GXB (identical) | 8 x 3.125 Gbps GXB (identical) | 8 x 3.125 Gbps GXB (identical) | 4 x 3.2 Gbps GTP (-50%) |
Key Differentiators
- 8 integrated 3.125 Gbps GXB transceivers in mid-density Cyclone IV GX (vs XC6SLX45T-3FGG484I)
- Industrial temperature range with fastest I7 speed grade (vs EP4CGX50CF23C8N)
- Higher 18x18 multiplier count and embedded memory (vs EP4CGX30CF23I7N)
Design Notes
The F23 (484-FBGA) package uses 1.0 mm ball pitch on a 23x23 mm body; PCB fabrication in at least 6 layers with laser-drilled micro-vias (0.1 mm) is recommended for transceiver signal fan-out. Each GXB transceiver channel requires its own AC-coupling capacitor placed within 250 mils of the FPGA ball, plus a differential 100 ohm-impedance trace routed as a length-matched pair with skew under 5 ps. Power-plane stitching vias must surround the transceiver ball grid to provide a low-inductance return current path and minimize EMI.
The EP4CGX50CF23I7 requires at least four separate supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog), VCCD_PLL (1.2 V PLL digital), and VCCIO_x (bank-specific, 1.2 V to 3.3 V). Each transceiver channel adds additional VCCRT (1.2 V) draw; with all 8 GXB channels active at 3.125 Gbps, total ICCRT can reach 1.5 A. Use a bulk 220 uF polymer capacitor plus 22 uF and 0.1 uF ceramic caps within 50 mils of each power pin. Estimated total board power at full utilization: 4-5 W typical, 7 W worst case.
Do not configure the EP4CGX50CF23I7 from 3.3 V LVCMOS unless the MSEL pins are set correctly for the chosen configuration scheme - incorrect MSEL settings are the most common cause of first-time configuration failures. The reference-clock inputs to the GXB transceivers (REFCLK pins) require a clean 100 MHz, 125 MHz, or 156.25 MHz LVDS/LVPECL source with jitter under 1 ps RMS; noisy reference clocks cause high BER even with otherwise valid PCIe or Gigabit Ethernet links. Finally, do not enable the on-chip termination feature without first configuring the OCT calibration block via the Quartus II programmer.
Compliance Information
RoHS-compliant per Altera (now Intel) Cyclone IV GX product page. Lead-free terminal finish ('N' suffix on equivalent parts confirms RoHS. Not AEC-Q100 qualified - this is an FPGA, not an automotive analog standard product. Industrial temperature grade (-40C to +100C) is suitable for many industrial and aerospace applications but is not equivalent to AEC-Q100 qualification.
