EP4CGX75CF23I7N - Cyclone IV GX 75K LE FPGA | Intel | 484-BGA
MPN: EP4CGX75CF23I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $244.22 | $244.22 |
| 10 | $220.5 | $2,205.00 |
| 100 | $198.75 | $19,875.00 |
| 500 | $180.1 | $90,050.00 |
| 1,000 | $165.3 | $165,300.00 |
EP4CGX75CF23I7N Overview
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory blocks (M9K/M144K), multiplier blocks (18x18), and programmable I/O elements interconnected by a routing fabric. The Cyclone IV GX belongs to the low-power, high-volume FPGA category, sitting between CPLDs and high-end FPGAs such as Stratix. Cyclone IV is the successor to Cyclone III and was Altera's mainstream 60 nm low-power family before the Cyclone V/10 series.
Key features of the EP4CGX75CF23I7N include 4620 CLBs, 4,257,792 bits of RAM (316 memory blocks), 150 embedded 18x18 multipliers, eight high-speed transceivers supporting data rates up to 3.125 Gbps, and a maximum internal operating frequency of approximately 472.5 MHz. The device supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL, plus dedicated PCIe hard IP. Industrial-grade temperature range (-40C to +100C for I7 grade) enables deployment in harsh environments.
Architecturally, Cyclone IV GX combines a 60 nm low-k metal process with Altera's adaptive logic module (ALM) architecture, eight PLLs for clock management, and hardened PCIe Gen1 and 8B/10B PCS blocks. The GX variant adds the 3.125 Gbps transceivers that distinguish it from the non-transceiver Cyclone IV E family. The 484-FBGA package provides a thermal pad for thermal management and supports JTAG (IEEE 1149.1), Active Serial, and Passive Parallel configuration modes.
Typical applications include industrial video bridging, motor control and industrial Ethernet, low-cost PCIe endpoint cards, broadcast equipment, low-end wireless backhaul baseband, and embedded vision systems. The integrated transceivers allow direct connection to SFP cages, GbE PHYs, and CPRI links without external SerDes ICs.
Design considerations: power estimation with the Altera PowerPlay Early Power Estimator (EPE) is required before PCB layout because the device can consume 3-5W depending on logic utilization and transceiver activity. Configuration memory must be loaded at every power-up from a serial flash or JTAG, and the JTAG chain should include proper TCK termination.
This page synthesizes Intel product-page specifications, distributor pricing from Heisener and DigiKey, and curated same-family alternatives not present on a single distributor product page.
Drop-in alternatives for EP4CGX75CF23I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX75CF23I7N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Speed Grade, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX150CF23I7N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP4CGX110CF23I7N
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$1650.08 / Unit
View Datasheet →EP4CGX50CF23I7N
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$121.4 / Unit
View Datasheet →EP4CGX30CF23I7N
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$41.2 / Unit
View Datasheet →EP4CGX75CF23C8N
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View Datasheet →EP4CGX75CF23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Series | EP4CGX75 (F23) |
| Logic Elements (LE) | 73,920 |
| Configurable Logic Blocks (CLBs) | 4,620 |
| Embedded Memory | 4,257,792 bits (316 M9K blocks) |
| Embedded Multipliers (18x18) | 150 |
| User I/O Pins | 290 |
| Transceivers | 8 channels up to 3.125 Gbps |
| PLLs | 8 |
| Package | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (industrial I7 grade) |
| Mounting Type | Surface Mount (FBGA) |
| Process Node | 60 nm low-power |
| Configuration Modes | Active Serial, Passive Serial, JTAG, Fast Passive Parallel |
| RoHS Status | Lead-free (compliant per datasheet.com excerpt) |
| MSL Level | 3 (per typical Altera FBGA) |
EP4CGX75CF23I7N 484-fbga (f23), 23 x 23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CGX75CF23I7N (484-fbga (f23), 23 x 23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX75CF23I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX75CF23I7N is suitable for 6 applications: Industrial Video Bridge and Converter, Motor Control and Industrial Drives, Low-Cost PCIe Endpoint Cards, Broadcast Audio/Video Router, Wireless Baseband and Small-Cell Modem, Embedded Vision and Machine Learning Inference.
Industrial Video Bridge and Converter
The EP4CGX75CF23I7N is well suited to industrial video bridging between SDI, HDMI, DisplayPort, and parallel TTL/CML interfaces because it provides 290 user I/Os and eight 3.125 Gbps transceivers - sufficient bandwidth for uncompressed HD/3G-SDI links and HDMI 1.4 TMDS. The 73,920 logic elements and 150 18x18 multipliers enable real-time color-space conversion, scaling, and on-screen display overlay. Industrial temperature rating (-40C to +100C) ensures operation in production studios, broadcast trucks, and outdoor signage cabinets.
Recommended
Motor Control and Industrial Drives
The EP4CGX75CF23I7N fits high-performance motor control and industrial drive applications thanks to its combination of 73,920 logic elements (for FOC/PWM state machines), 150 hardware multipliers (for fast Park/Clarke transforms), and industrial -40C to +100C temperature range. The 290 user I/Os accept quadrature encoder, Hall-sensor, and resolver feedback, while the 3.125 Gbps transceivers connect to EtherCAT, Profinet, or SERCOS III industrial Ethernet networks. Tightly coupled multi-axis control loops benefit from the deterministic fabric architecture.
Recommended
Low-Cost PCIe Endpoint Cards
The EP4CGX75CF23I7N integrates hardened PCIe Gen1 IP that supports x1, x2, and x4 endpoints without consuming user logic, which makes it ideal for low-cost PCIe add-in cards such as data acquisition, GPIO expansion, and protocol analyzers. The eight transceivers can simultaneously drive PCIe x4 and an external SFP/SFP+ link for hybrid PCIe-plus-fiber cards. With 4,257,792 bits of embedded memory, designers can buffer substantial DMA payloads before software hand-off, and the 484-FBGA footprint fits standard half-height PCIe card layouts.
Recommended
Broadcast Audio/Video Router
Broadcast routers use the EP4CGX75CF23I7N to switch SDI, AES/EBU, and MADI streams because the eight 3.125 Gbps transceivers handle 3G-SDI data rates without external retimers. The 73,920 logic elements and 4,257,792 bits of embedded RAM allow deep crosspoint matrices (e.g., 64x64) with embedded audio embedding/de-embedding. Industrial-grade reliability and the long-life Cyclone IV family make it a preferred choice in broadcast infrastructure where 10+ year lifecycles are required.
Recommended
Wireless Baseband and Small-Cell Modem
The EP4CGX75CF23I7N is deployed in small-cell base stations and low-end wireless backhaul modems thanks to its 150 18x18 multipliers (sufficient for FFT/iFFT processing of 20 MHz LTE carriers), 3.125 Gbps transceivers (CPRI/OBSAI fronthaul), and embedded memory for HARQ buffers. The industrial temperature grade ensures reliability in outdoor small-cell enclosures. Designers can integrate baseband, CPRI, and a soft ARM Cortex-A9 MPCore (via Nios II plus hard IP) on a single Cyclone IV GX device.
Recommended
Embedded Vision and Machine Learning Inference
The EP4CGX75CF23I7N accelerates low-power embedded vision inference at the edge, where its 150 18x18 multipliers perform convolution and pooling for compact CNN models (e.g., MobileNetV1 at ~224x224 input). The 4,257,792 bits of embedded memory cache intermediate feature maps without external SDRAM access for small frames, and the 290 user I/Os interface directly to MIPI-CSI, parallel CMOS image sensors, and HDMI/DPI displays. Transceivers drive GigE Vision over copper or fiber for industrial camera links.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX75CF23I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150CF23I7N | EP4CGX110CF23I7N | EP4CGX50CF23I7N | EP4CGX30CF23I7N | EP4CGX75CF23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F23), 23 x 23 mm | 484-FBGA (F23), 23 x 23 mm - same | 484-FBGA (F23), 23 x 23 mm - same | 484-FBGA (F23), 23 x 23 mm - same | 484-FBGA (F23), 23 x 23 mm - same | 484-FBGA (F23), 23 x 23 mm - same |
| Logic Elements | 73,920 | 149,760 (+103%) | 109,424 (+48%) | 49,888 (-32%) | 29,440 (-60%) | 73,920 (identical) |
| Embedded Memory (bits) | 4,257,792 | 6,635,520 | 5,490,432 | 2,520,576 | 1,161,216 | 4,257,792 (identical) |
| 18x18 Multipliers | 150 | 360 | 244 | 86 | 66 | 150 (identical) |
| Transceivers (3.125 Gbps) | 8 | 8 | 8 | 8 | 8 | 8 (identical) |
| User I/O | 290 | 310 | 310 | 290 | 290 | 290 (identical) |
| Operating Temperature | -40C to +100C (industrial I7) | -40C to +100C (industrial I7) | -40C to +100C (industrial I7) | -40C to +100C (industrial I7) | -40C to +100C (industrial I7) | 0C to +85C (commercial C8) |
Key Differentiators
- Larger logic capacity vs smaller F23 sibling without leaving the F23 package (vs EP4CGX50CF23I7N)
- Industrial temperature grade available vs commercial-only variant (vs EP4CGX75CF23C8N)
- Integrated 3.125 Gbps transceivers differentiate from non-GX Cyclone IV E (vs EP4CE75F23I7N)
Design Notes
Estimated: power consumption for the EP4CGX75CF23I7N ranges from 1.5 W idle to 3-5 W at full utilization of logic and transceivers. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet (downloaded from Intel) to model power for your specific logic utilization, toggle rate, and transceiver activity before PCB layout. Provide at least two separate supply rails - VCCINT (core, typically 1.2 V) and VCCA (PLL/analog, typically 2.5 V) - with proper decoupling per the Cyclone IV pin connection guidelines. Decoupling must include 0.1 uF X7R ceramics at every power pin plus bulk 47-100 uF polymer tantalum capacitors.
The 484-FBGA package is best paired with a 6-layer PCB that includes a thermal via array directly under the central 0.4 mm-pitch BGA thermal pad. Tie the thermal pad to a continuous ground plane on the top layer with 0.3 mm-diameter vias on a 1.0 mm grid. The exposed pad must be soldered for both thermal and electrical performance. Without the thermal via array, junction temperature can exceed 100C and trigger thermal-sensor-driven self-protection under load.
Differential transceiver pairs (e.g., GXB[0]-GXB[0]_n) must be routed as 100 ohm differential impedance with intra-pair length matching of better than 150 mil. Keep transceiver routes on the top layer over a continuous ground plane, and avoid crossing splits. JTAG chain signals (TCK, TMS, TDI, TDO) should be length-matched and pulled up per the IEEE 1149.1 spec. Place the EPCQ configuration flash within 100 mm of the FPGA with stubs shorter than 10 mm on the AS configuration bus.
Do not assume pinout compatibility between Cyclone IV GX F23 and other Cyclone IV GX packages (F27, F31) - the ball map differs even when the LE count matches. Always re-run Quartus pin assignments when changing package. Also note that the "I7" suffix denotes the industrial temperature grade (-40C to +100C) while "C8" denotes commercial (0C to +85C) - substituting one for the other will fail qualification in outdoor or industrial environments.
Compliance Information
Lead-free per the datasheet.com excerpt and Altera product page. RoHS/REACH status per typical Altera Cyclone IV family declarations. AEC-Q100 not applicable to FPGAs. Halogen-free and conflict-mineral declarations not located in provided data.
