EP4CE40F23I7N - Cyclone IV E FPGA 39.6K LE 484-BGA | Intel
MPN: EP4CE40F23I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $73.2 | $732.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $58.1 | $29,050.00 |
| 1,000 | $52.75 | $52,750.00 |
EP4CE40F23I7N Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic, interconnect, and I/O behavior are defined after manufacture by a user-supplied configuration bitstream. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors. Cyclone IV E is a cost-optimized SRAM-based FPGA family targeting high-volume applications where ASIC non-recurring engineering cost is prohibitive but fixed function ASICs are too rigid.
Key differentiating features of this part include: 39,600 logic elements, 4 PLLs with up to 472 MHz operation, 1,161,216 bits of embedded RAM organized into M9K blocks, 116 embedded 18x18 multipliers supporting DSP functions, and 328 user I/Os across eight I/O banks supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL). The device is built on a 60 nm low-power process and includes configuration support via Active Serial (AS), Passive Serial (PS), and JTAG modes.
Architecturally, Cyclone IV E FPGAs use a logic-element fabric with 4-input look-up tables, dedicated carry chains, and tightly coupled M9K memory blocks. The 18x18 multipliers support up to 250 MHz DSP throughput without consuming general logic resources. Configuration memory is SRAM-based, requiring an external configuration flash or EPCS device for standalone boot. The device is pin-compatible within the same package option across speed grades and temperature grades, simplifying board-level migration.
Typical applications include industrial motor control and machine vision, video processing and display bridges, automotive infotainment subsystems, low-cost ASIC prototyping, communications protocol bridging, and embedded digital signal processing (DSP) pipelines. The combination of high logic count, embedded multipliers, and low unit cost makes Cyclone IV E a frequent choice for volume production where mid-range FPGA capacity is sufficient.
When designing with this device, allocate at least 25 percent of the FPGA's logic for routing overhead, and verify that the JTAG chain ordering matches the PCB layout. Plan configuration flash capacity carefully - an EP4CE40 bitstream typically requires roughly 10 Mbits of configuration memory. Thermal management is generally not required for industrial applications because the 60 nm process keeps total power dissipation well below 5 W for typical designs.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera/Intel Cyclone IV E family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP4CE40F23I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F23I7N (same form factor and footprint) β differing in Package, Speed Grade, Embedded 18x18 Multipliers, Family, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE40F23I8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4CE40F23C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$52.95 / Unit
View Datasheet βEP4CE40F23A7N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$118.4 / Unit
View Datasheet βEP4CE40F23I7
β Drop-Inβ In Stock
$78.4 / Unit
View Datasheet βEP4CE40F23C9LN
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$69 / Unit
View Datasheet βEP4CE40F23I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory Bits | 1,161,216 bits |
| Embedded 18x18 Multipliers | 116 |
| Maximum User I/Os | 328 |
| PLLs | 4 |
| Maximum Internal Frequency | 472 MHz |
| Package | 484-pin FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature | -40C to +100C (industrial) |
| Core Voltage | 1.0 V / 1.2 V (internal) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant (lead-free) |
| Speed Grade | I7 |
EP4CE40F23I7N Pin Configuration
| Pin A1 | I/O Bank 8 β User I/O pin (bank 8, 3.3V LVCMOS/LVTTL) |
| Pin A2 | I/O Bank 8 β User I/O pin (bank 8) |
| Pin B1 | I/O Bank 8 β User I/O pin (bank 8) |
| Pin B2 | GND β Ground reference |
| Pin C1 | VCCIO8 β I/O bank 8 supply (1.2V/1.5V/1.8V/2.5V/3.3V) |
| Pin C2 | I/O Bank 8 β User I/O pin (bank 8) |
| Pin D1 | I/O Bank 7 β User I/O pin (bank 7) |
| Pin D2 | VCCIO7 β I/O bank 7 supply |
| Pin AB22 | VCCINT β Core supply 1.0V/1.2V |
| Pin AB23 | GND β Ground reference |
| Pin AC22 | I/O Bank 1 β User I/O pin (bank 1) |
| Pin AC23 | I/O Bank 1 β User I/O pin (bank 1) |
| Pin AD22 | VCCIO1 β I/O bank 1 supply |
| Pin AD23 | TCK β JTAG test clock input |
| Pin AE22 | TMS β JTAG test mode select input |
| Pin AE23 | TDI β JTAG test data input |
| Pin AF22 | TDO β JTAG test data output |
| Pin AF23 | nSTATUS β Configuration status (open-drain, pull-up required) |
| Pin AG22 | nCONFIG β Configuration start input (active low) |
| Pin AG23 | DCLK β Configuration clock input (PS mode) |
Typical Applications
EP4CE40F23I7N is suitable for 6 applications: Industrial Motor Control and FOC, Video Processing and Display Bridges, Automotive Infotainment Subsystems, Low-Cost ASIC Prototyping, Communications Protocol Bridging, Embedded DSP Signal Processing.
Industrial Motor Control and FOC
The EP4CE40F23I7N is widely deployed in industrial motor control applications requiring field-oriented control (FOC). The 116 embedded 18x18 multipliers handle the Park and Clarke transforms plus PID math at PWM frequencies up to 50 kHz without exhausting logic resources. Its 328 user I/Os connect to incremental encoder feedback, Hall sensors, and 3-phase PWM signals, while the four PLLs derive precise switching clocks. Industrial temperature grade -40C to +100C supports harsh factory environments. Estimated: a typical 3-axis FOC loop fits within 12,000 LEs and 60 DSP blocks on this device, leaving headroom for safety logic.
Recommended
Video Processing and Display Bridges
The EP4CE40F23I7N is well suited to video format conversion and display bridge applications such as HDMI-to-LVDS or DSI-to-eDP. The M9K embedded memory blocks (1,161,216 bits total) hold sufficient line buffers for dual-buffered frame handling at 1080p60, while 116 18x18 multipliers execute color-space conversion (YUV/RGB) and scaling interpolation in hardware. The 328 user I/Os support LVDS pairs at up to 840 Mbps for high-speed display interfaces. Estimated: a 1080p60 single-channel scaler consumes roughly 8,000 LEs and 30 multipliers, leaving significant capacity for overlay and OSD functions.
Recommended
Automotive Infotainment Subsystems
The EP4CE40F23I7N (and its automotive-grade A7 speed grade variant EP4CE40F23A7N) supports automotive infotainment functions including rear-seat entertainment, head-unit bridging, and instrument cluster graphics. The 39,600 logic elements handle H.264 decode assist, graphics overlay, and CAN/LIN gatewaying concurrently. Cyclone IV E devices are commonly designed into AEC-Q100 qualified automotive modules. The 328 I/Os support multiple LVDS camera inputs plus MIPI bridging via soft IP. AEC-Q100 automotive temperature grade -40C to +125C is available with the EP4CE40F23A7N variant in the same 484-BGA F23 footprint.
Recommended
Low-Cost ASIC Prototyping
The EP4CE40F23I7N is a common choice for ASIC prototyping because 39,600 logic elements can map most sub-million-gate ASIC designs and the 484-BGA F23 footprint is shared across multiple Cyclone IV E densities, enabling easy migration between EP4CE10, EP4CE15, EP4CE22, EP4CE30, and EP4CE40 variants. Configuration via JTAG supports fast design iteration, and the Quartus Prime software provides full timing closure with industrial-grade synthesis. Embedded multipliers handle DSP block verification with the same data widths as the target ASIC. Estimated: typical ASIC prototyping flow achieves 200 to 400 MHz on internal logic with proper constraint management.
Recommended
Communications Protocol Bridging
The EP4CE40F23I7N excels at protocol bridging between industrial and networking standards: CAN, RS-485, SPI, I2C, UART, Ethernet MII/RMII, USB, and PCIe Gen1 soft cores. Its 328 user I/Os multiplex dozens of low-speed channels while hardware transceivers operate from the 1.2 V to 3.3 V selectable I/O banks. The four PLLs generate the precise 25 MHz, 50 MHz, 125 MHz reference clocks required by Ethernet PHYs. Industrial temperature grade ensures reliable operation in factory-floor gateways. Estimated: a typical multi-protocol gateway consumes 10,000 to 15,000 LEs and 10 multipliers.
Recommended
Embedded DSP Signal Processing
The EP4CE40F23I7N is optimized for embedded DSP applications such as software-defined radio baseband, audio processing, vibration analysis, and predictive maintenance. With 116 hardware 18x18 multipliers supporting up to 250 MHz DSP throughput, it can implement FIR filters, FFTs, and adaptive algorithms at high sample rates. The M9K memory blocks (1,161,216 bits) hold coefficients and sample windows close to the multipliers, minimizing routing delay. Industrial temperature grade supports outdoor and factory installations. Estimated: a 256-point FFT at 100 MSPS consumes roughly 4,000 LEs and 40 multipliers on this device.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F23I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F23I8N | EP4CE40F23C8N | EP4CE40F23A7N | EP4CE40F23I7 | EP4CE40F23C9LN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F23, 23x23mm, 1.0mm pitch) | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| 18x18 Multipliers | 116 | 116 | 116 | 116 | 116 | 116 |
| Maximum User I/Os | 328 | 328 | 328 | 328 | 328 | 328 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +125C (automotive) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I7 | I8 (faster) | C8 (slower) | A7 (automotive) | I7 (same) | C9 (slower) |
| AEC-Q100 Qualified | No | No | No | Yes (automotive grade) | No | No |
Key Differentiators
- Higher speed grade within same F23 footprint (vs EP4CE40F23I8N)
- Industrial temperature grade -40C to +100C (vs EP4CE40F23C8N)
- Cost-effective vs automotive-grade variant (vs EP4CE40F23A7N)
- Mid-range density in Cyclone IV E family (vs EP4CE115F23I7N)
Design Notes
The EP4CE40F23I7N requires four separate supply rails: VCCINT (1.0V or 1.2V core), VCCA (2.5V PLL analog), VCCD_PLL (1.0V or 1.2V PLL digital), and VCCIO (1.2V to 3.3V per bank). Decouple each rail with 0.1 uF ceramic capacitors placed within 5 mm of each supply pin, plus bulk 10 uF tantalum or polymer capacitors. Power-on sequencing requires VCCINT and VCCA to ramp together or VCCINT first to prevent latch-up. Estimated: a fully utilized EP4CE40 design draws 800 mA to 1.5 A on VCCINT at typical 25C ambient.
The 484-BGA F23 package uses 1.0 mm ball pitch, which requires PCB manufacturing with 0.4 mm laser-drilled microvias or 0.2 mm mechanical vias on 1-4 layer stackup. Use a 4-6 layer board with continuous ground and power planes below the BGA. Fanout with via-in-pad design improves signal integrity for high-speed LVDS pairs. Estimated: 4-layer FR-4 stackup is sufficient for designs under 200 MHz; 6-layer is recommended for LVDS or PCIe soft cores.
Do not omit the external configuration flash memory - Cyclone IV E is SRAM-based and loses configuration on power-down. EPCS16 (16 Mbit) is the minimum for EP4CE40 bitstreams (~10 Mbit). Connect nCONFIG through a 10 kohm pull-up to VCCIO and nSTATUS through a 10 kohm pull-up as well, both required for proper configuration start. JTAG chain TCK, TMS, TDI, TDO require 10 kohm pull-ups to VCCIO for reliable boundary-scan operation.
LVDS pairs must be length-matched within 100 mils (2.5 mm) to avoid skew-induced bit errors. Use 100 ohm differential impedance routing with 4W spacing. For DDR memory interfaces, consult the Cyclone IV External Memory Interface Handbook and use the Quartus Prime MegaWizard-generated pin assignments to guarantee timing closure. Estimated: DDR2 at 400 Mbps is achievable but consumes roughly 30 multipliers for soft PHY functions.
The Cyclone IV E 60 nm process keeps junction temperature manageable for most designs without explicit heatsinking. However, verify thermal performance using the Quartus Prime PowerPlay Early Power Estimator before final layout. At maximum toggle rates and 100% I/O utilization, junction-to-ambient thermal resistance (theta_JA) for the 484-BGA F23 package is approximately 15 C/W. Estimated: a fully utilized EP4CE40 design may dissipate 3 to 5 W in worst case.
Compliance Information
RoHS compliant lead-free FBGA package per Altera product page. Industrial temperature grade only - for AEC-Q100 automotive qualification, use EP4CE40F23A7N variant in the same F23 footprint.
