EP4SGX530KH40I3N - Stratix IV GX FPGA, 530K LE, 1517-BGA | Intel
MPN: EP4SGX530KH40I3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $7825 | $78,250.00 |
| 100 | $7150 | $715,000.00 |
| 500 | $6650 | $3,325,000.00 |
| 1,000 | $6250 | $6,250,000.00 |
EP4SGX530KH40I3N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic fabric, programmable interconnect, and hardened IP blocks into a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as a class of logic devices that engineers program after manufacture. The Stratix IV GX family specifically targets high-performance, transceiver-rich applications such as wireline communications, military radar, and high-end ASIC prototyping. Each Stratix IV GX device is supported by the Quartus Prime development suite, which provides synthesis, place-and-route, timing analysis, and IP libraries.
Key features of the EP4SGX530KH40I3N include 531,200 logic elements (LEs), 21,248 LABs, 744 user I/Os, embedded high-speed transceivers, and on-chip memory. The device provides logic density at the top of the Stratix IV GX range, which is reserved for system designs that require the largest logic capacity plus transceiver bandwidth in the family.
The Stratix IV architecture introduces Adaptive Logic Modules (ALMs), which are eight-input fracturable lookup tables that improve logic utilization versus prior generations. Hardened IP includes variable-precision DSP blocks, M20K embedded memory blocks, and high-speed transceivers that operate at line rates commonly used in SONET/SDH, CPRI, and Serial RapidIO backplanes.
Typical applications for the EP4SGX530KH40I3N include high-end ASIC prototyping, wireline communications line cards, software-defined radio baseband, test and measurement equipment, military signal processing, and PCI Express Gen1/Gen2 endpoint or root-port designs. The wide transceiver count and large logic budget make it a strong fit for designers building multi-channel protocol bridges or large-format signal-processing pipelines.
Design considerations include PCB routing for the 1517-ball flip-chip BGA, multi-rail power sequencing, transceiver channel skew budgets, and thermal management at high toggle rates. The large 42.5 x 42.5 mm BGA package requires high-layer-count PCBs (typically 14+ layers) and microvia/stacked-via technology to fan out the dense 1 mm pitch ball array.
This page synthesizes distributor stock, drop-in Stratix IV GX alternatives in the same package, and practical board-design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP4SGX530KH40I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530KH40I3N (same form factor and footprint) — differing in Package, Mounting Type, Operating Temperature, Speed Grade, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX530KH40C3N
✅ Drop-In✓ In Stock
$3420 / Unit
View Datasheet →EP4SGX530KH40C4N
✅ Drop-In✓ In Stock
$3680 / Unit
View Datasheet →EP4SGX530KH40I4N
✅ Drop-In✓ In Stock
$3425 / Unit
View Datasheet →EP4SGX530KH40I3
✅ Drop-In✓ In Stock
$12500 / Unit
View Datasheet →EP4SGX530KH40C2N
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX530KH40I3N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Stratix IV GX |
| Series | Stratix IV GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 531200 |
| Logic Array Blocks (LABs) | 21248 |
| Maximum User I/Os | 744 |
| Package Type | 1517-BBGA / FCBGA, 42.50 x 42.50 mm |
| Process Node | 40 nm |
| Internal Frequency (max) | 800 MHz |
| Operating Temperature | 0C to +85C (Industrial) |
| Temperature Grade | I (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4SGX530KH40I3N Pin Configuration
| Pin 1 | VCC — Core supply voltage (see datasheet for exact Vcore) |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO_BANK_1A — User I/O - Bank 1A |
| Pin 4 | IO_BANK_1B — User I/O - Bank 1B |
| Pin 5 | IO_BANK_2A — User I/O - Bank 2A |
| Pin 6 | IO_BANK_2B — User I/O - Bank 2B |
| Pin 7 | GXB_TX_P — Transceiver differential transmit (positive) |
| Pin 8 | GXB_TX_N — Transceiver differential transmit (negative) |
| Pin 9 | GXB_RX_P — Transceiver differential receive (positive) |
| Pin 10 | GXB_RX_N — Transceiver differential receive (negative) |
Typical Applications
EP4SGX530KH40I3N is suitable for 6 applications: High-Density ASIC Prototyping, Wireline Communications Line Card, Software-Defined Radio Baseband, Test and Measurement Equipment, Military Signal Processing, PCI Express Gen1/Gen2 Endpoint Design.
High-Density ASIC Prototyping
The EP4SGX530KH40I3N with 531,200 logic elements and 21,248 LABs is ideal for prototyping large ASIC designs in a single device. Its Stratix IV GX fabric delivers the gate-equivalent capacity to map full SoC RTL, allowing pre-silicon validation of complex designs. The 800 MHz internal fabric performance supports timing closure on critical paths typical of CPU and DSP cores. The 1517-FCBGA package exposes 744 I/Os for high-pin-count ASIC emulation, and the Quartus Prime synthesis flow supports incremental compile for fast iteration.
Recommended
Wireline Communications Line Card
The EP4SGX530KH40I3N is well suited for wireline line cards requiring multi-channel high-speed serial interfacing. Its embedded transceivers handle common telecom line rates used in SONET/SDH, OTN, and CPRI backplanes, while the 531,200 logic elements provide capacity for multi-channel framing, deframing, and forward-error-correction logic. The 744 user I/Os enable parallel connection to network processors and traffic managers, and the industrial 0C-85C temperature grade suits central-office deployments.
Recommended
Software-Defined Radio Baseband
The EP4SGX530KH40I3N delivers the DSP throughput needed for multi-channel software-defined radio baseband processing. Its variable-precision DSP blocks perform FIR filtering, FFT/iFFT, and channelization at hundreds of MSPS per channel. Combined with M20K memory blocks for sample buffering, the device can implement 4G/5G physical-layer pipelines. The 800 MHz fabric and embedded transceivers support digitized IF or baseband interfaces to RF front-end ADCs and DACs.
Recommended
Test and Measurement Equipment
The EP4SGX530KH40I3N provides the logic capacity and I/O bandwidth required in high-end test and measurement instruments. Its 531,200 logic elements implement deep pattern-matching logic, signal-conditioning DSP, and instrument-control state machines, while 744 user I/Os interface to high-speed ADCs, DACs, and display subsystems. Embedded M20K blocks serve as deep capture-memory buffers, and the industrial temperature rating suits bench and lab environments.
Recommended
Military Signal Processing
The EP4SGX530KH40I3N handles large-format military signal-processing workloads such as radar beamforming, electronic-warfare channelization, and secure-comm protocol termination. The 531,200 logic elements support hundreds of parallel processing channels, and embedded transceivers carry digitized antenna data into the fabric. Designers targeting MIL-spec applications typically pair this FPGA with ruggedized SBCs and use the Altera/Intel MIL-PRF-38535 screening flow when available.
Recommended
PCI Express Gen1/Gen2 Endpoint Design
The EP4SGX530KH40I3N integrates hardened PCI Express Gen1/Gen2 IP blocks that simplify endpoint and root-port designs. With 531,200 logic elements available, designers can implement the PCIe protocol stack alongside application logic in a single device. The 1517-BGA exposes enough transceiver and GPIO pins for x8 lane configurations plus sideband signals, and the Stratix IV GX PCIe hard IP supports MSI/MSI-X interrupt, completion TLP handling, and configuration space.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530KH40I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530KH40C3N | EP4SGX530KH40C4N | EP4SGX530KH40I4N | EP4SGX530KH40I3 | EP4SGX530KH40C2N |
|---|---|---|---|---|---|---|
| Package | 1517-BGA (KH40) | 1517-BGA (KH40) | 1517-BGA (KH40) | 1517-BGA (KH40) | 1517-BGA (KH40) | 1517-BGA (KH40) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| LABs | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 | 21,248 |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | I3N | C3N | C4N | I4N (faster) | I3 (non-RoHS) | C2N (slower) |
| Temperature Grade | Industrial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (0C to +85C) | Industrial (0C to +85C) | Commercial (0C to +85C) |
| RoHS Compliance | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (non-RoHS lead) | Yes (N suffix) |
| Internal Frequency (max) | 800 MHz | 800 MHz | 800 MHz (faster grade) | 800 MHz (faster grade) | 800 MHz | 800 MHz (slower grade) |
| Series / Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX |
Key Differentiators
- Top-of-range logic density in Stratix IV GX family (vs EP4SGX360KF40I3N)
- RoHS-compliant lead-free finish (vs EP4SGX530KH40I3)
- Industrial temperature grade for harsh environments (vs EP4SGX530KH40C3N)
Design Notes
The EP4SGX530KH40I3N uses a 1517-ball FCBGA at 1 mm pitch on a 42.5 x 42.5 mm body. This density requires a PCB stack-up of at least 14 layers with microvias and stacked vias to fan out the BGA; designers should plan the stack-up early and verify signal-integrity targets on the longest routes before committing to fabrication.
Estimated: at full fabric utilization and 800 MHz toggle rate, the EP4SGX530KH40I3N core power can exceed 20 W. Plan for a multi-rail power architecture (VCC, VCCL, VCCPT, VCCPGM, VCCA_PLL, VCCIO per bank) with sequenced enable. Use the Altera/Intel PowerPlay Early Power Estimator spreadsheet to size the regulator and thermal budget before PCB commitment.
The 1517-FCBGA has a junction-to-ambient thermal resistance in the range of 8-12 C/W with a properly designed PCB thermal pad and thermal vias. For applications targeting >15 W core dissipation, attach a heatsink with adequate airflow or use a cold-plate solution. Use the Quartus Prime thermal-aware place-and-route flow to identify hotspots.
Transceiver channels must be routed with controlled impedance (typically 100 ohm differential) and matched lengths within the skew budget declared by the IP. Keep AC-coupling capacitors close to the transmitter pins; route reference planes continuous under the transceiver lanes. Consult the Altera/Intel Stratix IV GX Transceiver Layout Guide for lane-to-lane and lane-to-PCB-edge spacing rules.
Do not assume all KH40-package Stratix IV GX variants share the same pinout - speed and temperature grade changes can move configuration and JTAG pins across ball positions in some family members. Always load the specific .pin file from Quartus Prime for the exact order code you are designing in. Also confirm MSL handling per J-STD-033 before reflow to avoid package cracking.
Compliance Information
RoHS compliance inferred from N suffix per Altera/Intel part-number convention; AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete); halogen-free status not explicitly stated in the verified web data.
