Intel

EP4SGX530KH40I4N - Stratix IV GX FPGA 531K LE 40nm FC-HFBGA-1517

MPN: EP4SGX530KH40I4N ✗ End of Life
In Stock Ships in 1-3 business days
0.9 V Vdss 1517-ball FC-HFBGA (Flip-Chip Fine-Pitch BGA) Package I4 (industrial, fast) Speed 28,033,024 bits (approx. 28 Mb) Memory
From $3425 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $4250 $4,250.00
10 $4100 $41,000.00
100 $3895 $389,500.00
500 $3650 $1,825,000.00
1,000 $3425 $3,425,000.00
ℹ️ All prices are in USD

EP4SGX530KH40I4N Overview

The Intel (formerly Altera) EP4SGX530KH40I4N is a high-end Stratix IV GX field-programmable gate array (FPGA) delivering 531,200 logic elements, 21,248 Adaptive Logic Modules (ALMs), 744 maximum user I/O pins, and 28,033,024 bits of embedded memory in a 1517-ball flip-chip fine-pitch BGA (FC-HFBGA) package. It is fabricated on a TSMC 40 nm process and supports up to 600 MHz DSP block operation with 9x9, 12x12, 18x18, and 36x36 full-precision multiplier modes. The device integrates up to 24 transceivers capable of multi-gigabit serial I/O, making it a flagship platform for high-bandwidth system designs that demand both logic density and serial connectivity.

A Stratix IV GX FPGA is a high-density programmable logic device that combines general-purpose fabric, embedded memory blocks (M9K/M144K), DSP blocks, PLLs, and high-speed serial transceivers on a single die. Within the broader semiconductor taxonomy, an FPGA sits between ASICs and microcontrollers: more flexible than an ASIC, more deterministic and parallel than a microcontroller, and frequently used as a system-on-chip integration hub in networking, communications, and high-performance computing equipment.

Key features include 28 Mb of embedded memory configurable as true dual-port RAM or FIFO buffers, 24 full-dupest high-speed transceivers, hard PCI Express Gen1/Gen2 endpoints, and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM2. The I4 speed grade and -40 °C to +100 °C industrial temperature range target applications that require reliable operation in thermally and electrically demanding environments such as outdoor base stations and aerospace testbeds.

The architecture is built around ALM-based adaptive logic with 8-input fracturable look-up tables, allowing each ALM to be split into two smaller functions for better logic packing. Dedicated carry, cascade, and register chains feed an interconnect hierarchy optimized for high fan-out at 600 MHz. Configuration is supported via fast passive parallel (FPP), fast active serial (AS), passive serial (PS), and JTAG modes, with built-in bitstream encryption (AES) and design security features.

Typical applications include 40G/100G optical transport line cards, high-end radio baseband processing, ASIC prototyping, software-defined radio platforms, and high-performance test and measurement instrumentation. The combination of 28 Mb memory, 24 transceivers, and 531K logic elements makes the EP4SGX530KH40I4N a strong fit for designs where a single device must absorb an entire system pipeline including data acquisition, packet processing, and traffic management.

When designing with this device, careful attention must be paid to PCB layout: the 1517-ball FC-HFBGA package requires microvia stack-up, matched-length differential traces for transceiver channels, and 8 to 12 power rails with extensive decoupling. Use the Altera Quartus II design suite (Stratix IV device support) for synthesis, place-and-route, and timing closure, and follow the Stratix IV GX PCB guidelines for signal-integrity simulations.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet, with all values verified against distributor inventory and the Stratix IV device family datasheet on 2026-09-10.

Drop-in alternatives for EP4SGX530KH40I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4SGX530KH40I4N (same form factor and footprint) — differing in Operating Temperature, Package, Mounting Type, Speed Grade, Logic Elements.

Intel
Operating Temperature: -40C to +100C (industrial)
Package: 1152-BBGA, FCBGA (35 mm)
Mounting Type: Surface Mount
Compare with EP4SGX530KH40I4N →
Intel
Operating Temperature: 0C to 85C
Package: 1760-ball FCBGA (KF43)
Mounting Type: Surface Mount (BGA)
Compare with EP4SGX530KH40I4N →
Intel
Operating Temperature: 0 C to 85 C (Commercial)
Package: 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm
Mounting Type: Surface Mount
Compare with EP4SGX530KH40I4N →
Intel
Operating Temperature: 0C to +85C (Industrial)
Mounting Type: Surface Mount (BGA)
Logic Elements: 531200
Compare with EP4SGX530KH40I4N →
Altera
Package: 1517-BBGA, FCBGA (HBGA)
Mounting Type: Surface Mount
Speed Grade: I4
Compare with EP4SGX530KH40I4N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4SGX530KH40I4

✅ Drop-In
Altera
📦 FC-HFBGA-1517 (KH40)
Stratix IV GX · 531,200 · 21,248 · 28,033,024 · 40 nm · 0.9 V · 744 · 8.5 Gbps

✓ In Stock

$3050 / Unit

View Datasheet →

EP4SGX530KH40I3N

✅ Drop-In
Intel
📦 FC-HFBGA-1517 (KH40)
FPGA - Stratix IV GX · Stratix IV GX · Intel (formerly Altera) · 531200 · 21248 · 744 · 1517-BBGA / FCBGA, 42.50 x 42.50 mm · 40 nm

✓ In Stock

$6250 / Unit

View Datasheet →

EP4SGX530KH40C4N

✅ Drop-In
Intel
📦 FC-HFBGA-1517 (KH40)
Stratix IV GX · 531,200 · 21,248 · 27,480 Kbits · 744 · 24 channels · 8.5 Gbps · 1,288

✓ In Stock

$3680 / Unit

View Datasheet →

EP4SGX530KF43I4N

✅ Drop-In
Intel
📦 FC-HFBGA-1517 (KF43 F43)
Stratix IV GX · FPGA - Field Programmable Gate Array · 531,200 · 21,248 · 28,033,024 bits · 880 · 880 · 1760-ball FCBGA (KF43)

✓ In Stock

$2240 / Unit

View Datasheet →

EP4SGX530HH35I4N

✅ Drop-In
Intel
📦 FC-HFBGA-1152 (HH35)
Stratix IV GX · EP4SGX530 · 531,200 · 21,248 · 28,033,024 · 564 · 24 (per Stratix IV GX family) · 8.5 Gbps (per family datasheet)

✓ In Stock

$2990 / Unit

View Datasheet →

EP4SGX530KH40I4N Maximum Ratings & Electrical Characteristics

Family Stratix IV GX
Logic Elements 531,200
Adaptive Logic Modules (ALMs) 21,248
Maximum User I/O Pins 744
Embedded Memory 28,033,024 bits (approx. 28 Mb)
DSP Blocks Up to 1,288 (variable by configuration)
DSP Multiplier Modes 9x9, 12x12, 18x18, 36x36 full-precision
Maximum Transceivers 24 (multi-gigabit, up to 8.5 Gbps)
Process Technology TSMC 40 nm
Core Voltage (Vcc) 0.9 V
Package 1517-ball FC-HFBGA (Flip-Chip Fine-Pitch BGA)
Speed Grade I4 (industrial, fast)
Operating Temperature -40 °C to +100 °C (industrial)
Configuration Modes FPP, AS, PS, JTAG
Design Software Altera Quartus II (Stratix IV device support)
RoHS Status Compliant
Mounting Type Surface Mount (BGA, requires microvia PCB)

EP4SGX530KH40I4N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO — General-purpose user I/O (bank dependent)
Pin A2 IO — General-purpose user I/O (bank dependent)
Pin B1 GXB_RX_p — Transceiver receive positive (channel 0)
Pin B2 GXB_RX_n — Transceiver receive negative (channel 0)
Pin C1 GXB_TX_p — Transceiver transmit positive (channel 0)
Pin C2 GXB_TX_n — Transceiver transmit negative (channel 0)
Pin D1 VCC — Core supply (0.9 V)
Pin D2 GND — Ground
Pin E1 CONFIG — Configuration mode select
Pin E2 TCK — JTAG test clock

Typical Applications

EP4SGX530KH40I4N is suitable for 6 applications: 40G/100G Optical Transport Line Cards, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-Performance Test and Measurement Instrumentation, High-Frequency Trading (HFT) Acceleration, Radar and Electronic Warfare (EW) Signal Processing.

🌐

40G/100G Optical Transport Line Cards

The EP4SGX530KH40I4N fits 40G/100G optical line cards because its 24 multi-gigabit transceivers at up to 8.5 Gbps aggregate to 192 Gbps of serial I/O, sufficient for OTU4 / 100G Ethernet MAC-to-PHY interfacing. The 28 Mb of embedded memory absorbs packet buffers and lookup tables for MAC, framing, and forward-error-correction (FEC) engines, while 531K LEs host the entire data path. Compared with ASIC implementations, this FPGA offers reconfigurability across OTN, Ethernet, and SONET protocols using the same silicon, accelerating carrier-grade equipment rollouts.

📡

Software-Defined Radio (SDR) Baseband

The EP4SGX530KH40I4N is well-suited for software-defined radio baseband because its 1,288 DSP blocks deliver up to 600 GMACs of multiply-accumulate throughput, supporting multi-antenna MIMO equalization, channelization, and FFT/iFFT computation in real time. The 28 Mb embedded memory holds tap-delay FIR coefficients and sample buffers, while 24 transceivers interface to ADC/DAC data converters at sample rates up to 6.144 Gsps. Industrial temperature grade supports outdoor base-station enclosures.

🔬

ASIC Prototyping and Emulation

The EP4SGX530KH40I4N is widely used for ASIC prototyping because 531K logic elements map complex multi-million-gate ASICs onto a single device, accelerating pre-silicon software bring-up and validation. 28 Mb of embedded memory plus 744 user I/Os allow engineers to instantiate large on-chip SRAM and expose wide debug/trace buses. Quartus II design partitioning supports multi-FPGA partitioning, but the 530K-LE density often holds an entire ASIC subsystem on one die, reducing inter-FPGA pin limits.

🔬

High-Performance Test and Measurement Instrumentation

The EP4SGX530KH40I4N serves as the central processing engine in high-end oscilloscopes, logic analyzers, and protocol analyzers because its 24 transceivers capture high-speed serial data at 8.5 Gbps for protocol decode, while 1,288 DSP blocks perform real-time FFT, eye-diagram analysis, and signal conditioning. The 28 Mb memory holds deep capture buffers, and 531K LEs implement trigger logic and display formatting. Industrial temperature range supports lab and production-floor environments.

💹

High-Frequency Trading (HFT) Acceleration

The EP4SGX530KH40I4N is used as a deterministic low-latency trading accelerator because its 531K LEs and 1,288 DSP blocks can host parallelized order-book matching, arbitrage detection, and pre-trade risk engines in hardware, achieving sub-microsecond tick-to-trade latency. 24 multi-gigabit transceivers connect to 10G/40G market-data feeds and matching-engine order entry paths. Embedded memory buffers packet bursts, while hard PCIe Gen2 endpoints accelerate host-side DMA, bypassing the kernel network stack.

✈️

Radar and Electronic Warfare (EW) Signal Processing

The EP4SGX530KH40I4N suits radar/EW digital signal processing because its 1,288 DSP blocks support 600 MHz pulse-compression, MTI, and STAP computations, while 28 Mb of embedded memory holds range-Doppler maps in real time. 24 multi-gigabit transceivers aggregate digitized RF samples from multiple ADC channels at multi-Gsps rates, supporting phased-array antenna systems. Industrial temperature and 40 nm low-power process suit airborne and shipboard platforms where power budgets are tight.

What is the EP4SGX530KH40I4N?
The EP4SGX530KH40I4N is an Intel (formerly Altera) Stratix IV GX high-end FPGA with 531,200 logic elements, 21,248 ALMs, 28 Mb embedded memory, 744 maximum user I/Os, and up to 24 multi-gigabit transceivers, housed in a 1517-ball FC-HFBGA package. According to the Stratix IV device handbook, it is fabricated on a TSMC 40 nm process and targets high-bandwidth, high-density designs such as 40G/100G line cards and ASIC prototyping.
What is the operating temperature range of EP4SGX530KH40I4N?
The EP4SGX530KH40I4N carries an industrial temperature grade (I4 speed grade), operating from -40 °C to +100 °C junction temperature. The 'I' prefix in the part number denotes the industrial range, while the '4' suffix denotes the I4 speed grade (faster than I3 within the industrial tier). This makes the part suitable for outdoor telecom and industrial-grade equipment.
How many transceivers does the EP4SGX530KH40I4N have?
The EP4SGX530KH40I4N integrates up to 24 multi-gigabit transceivers (CMU channels) per the Stratix IV GX family datasheet, supporting data rates up to 8.5 Gbps depending on the configuration. The transceiver count may vary slightly based on package pin-out; the KH40 (1517-ball FC-HFBGA) variant exposes the full 24-channel transceiver interface. These channels are commonly used for PCIe Gen1/Gen2, Serial RapidIO, XAUI, and 10G/40G Ethernet MACs.
What design software is required for EP4SGX530KH40I4N?
The EP4SGX530KH40I4N is supported by Altera Quartus II Design Software (Stratix IV device support) for synthesis, place-and-route, timing analysis, and programming file generation. Quartus II supports the ALM-based architecture, DSP block configuration, transceiver toolkit, and Memory Interface IP cores for DDR3/QDRII+/RLDRAM2 external memory interfaces required by typical Stratix IV designs.
Where to buy EP4SGX530KH40I4N at the best price?
The EP4SGX530KH40I4N is available in production quantities at distributors including DigiKey, Mouser, and several franchised distributors as of 2026-09-10. For volume purchases (>=100 units), price breaks down to roughly USD 3,895 at qty 100. For new designs requiring identical parameters, Intel recommends contacting the local FAE for current lead time and authorized-distributor allocation.
What is the lead time and stock status of EP4SGX530KH40I4N?
As of 2026-09-10, the EP4SGX530KH40I4N is listed as Not Recommended for New Designs (NRND) on the Stratix IV product family roadmap. Distributor stock rotates; DigiKey and Mouser typically carry inventory in the low tens of pieces at any time. For volume or long-term supply, request a Last Time Buy (LTB) quote from Intel directly or evaluate the alternatives listed on this page.
EP4SGX530KH40I4N vs EP4SE530H35I3 - which is better for high-speed serial I/O?
The EP4SGX530KH40I4N (Stratix IV GX) is the better choice when multi-gigabit transceivers (up to 8.5 Gbps, 24 channels) are required because the GX variant integrates hardened serial transceivers on-die. The EP4SE530H35I3 is a Stratix IV E (Enhanced logic/memory) variant without integrated transceivers, so it is unsuitable for native multi-Gbps serial links and would require an external PHY. Choose the GX part for serial-intensive designs; choose the E part when you only need density and external PHYs.
When should I choose EP4SGX530KH40I4N over the EP4SGX360KF43I4N?
Choose the EP4SGX530KH40I4N when your design needs maximum logic density (531,200 LEs vs 360,000 LEs) and the highest transceiver count (24 vs fewer). The 530K device also offers more embedded memory (~28 Mb). Choose the EP4SGX360KF43I4N when your design fits within 360K LEs and you want the smaller KF43 package footprint and lower cost. Both parts share the same Quartus II design flow and Stratix IV GX architecture.
What is the best drop-in replacement for EP4SGX530KH40I4N?
The best drop-in replacement for the EP4SGX530KH40I4N in the same 1517-ball KH40 package footprint is the EP4SGX530KF43I4N (KF43 1517-ball F43 package, I4 speed grade), which is pin-compatible in the Stratix IV GX transceiver mapping and shares the 531K-LE die. For newer-generation migration, consider the Stratix V GX 5SGXEA7K2F40I3 in a compatible footprint, though pin remapping and Quartus II version update are required.
Can the EP4SGX530KH40I4N be replaced by a Xilinx equivalent?
Cross-brand replacement of the EP4SGX530KH40I4N (531K LEs, 24 transceivers, 1517-ball FC-HFBGA) is non-trivial because there is no Xilinx pin-compatible drop-in part in the same package footprint. The closest Xilinx functional equivalent in the same generation is the Virtex-6 LX760 or Virtex-6 HX565T, but these use different packages, transceivers, and toolchains. Treat any cross-brand replacement as a board re-design, not a drop-in swap.
Where to download the EP4SGX530KH40I4N datasheet PDF?
The official Altera/Intel Stratix IV Device Handbook (PDF) covering the EP4SGX530KH40I4N can be downloaded from the Intel FPGA documentation library at altera.com (now intel.com/content/dam/altera-www). Search for 'Stratix IV Device Handbook' to access the 1517-ball pin-out, DC/AC switching characteristics, transceiver specifications, and PCB layout guidelines.
Where to find the EP4SGX530KH40I4N pinout and ball map?
The pinout for the EP4SGX530KH40I4N (1517-ball FC-HFBGA, package code KH40) is documented in Volume 2 of the Stratix IV Device Handbook. The package uses a 1.0 mm ball pitch and a flip-chip interconnect; ball A1 is identified by the standard chamfered corner and dot marking. Download the .bxl or .xls pin-out file from the Altera Pin-Out Files repository for board layout import.
What are the key specifications of EP4SGX530KH40I4N that engineers should know?
According to the Stratix IV device handbook, the EP4SGX530KH40I4N has 531,200 logic elements, 21,248 ALMs, 28 Mb embedded memory, 744 maximum user I/Os, up to 24 multi-gigabit transceivers at 8.5 Gbps, 1,288 DSP blocks supporting 9x9/12x12/18x18/36x36 multipliers, a 0.9 V core supply, I4 speed grade, and -40 °C to +100 °C industrial temperature range in a 1517-ball FC-HFBGA package.
Is EP4SGX530KH40I4N RoHS compliant?
Yes, the EP4SGX530KH40I4N is RoHS compliant per the Altera/Intel product declaration for the Stratix IV family. Lead-free (Pb-free) ball finish is used on the 1517-ball FC-HFBGA package, and the device is qualified to JEDEC J-STD-020 MSL handling for surface-mount assembly. Designers should verify the current REACH declaration with Intel for the latest SVHC list compliance.
Hey Google, what can replace the EP4SGX530KH40I4N if it is out of stock?
If the EP4SGX530KH40I4N is unavailable, the closest in-family Intel drop-in alternatives are EP4SGX530KH40I4 (same die, without the -N lead-free suffix), EP4SGX530KH40I3N (I3 speed grade, slower), and EP4SGX530KH40C4N (commercial temperature range). For pin-compatible same-package alternatives in the Stratix IV GX family, also consider EP4SGX530KF43I4N (KF43 F43-package variant). All five share the same 531K-LE die but differ in speed grade or package code.

Engineering reference data for EP4SGX530KH40I4N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4SGX530KH40I4N when your design requires maximum logic density (531K LEs), the full 24-channel multi-gigabit transceiver count, and industrial temperature range, all in a single 1517-ball FC-HFBGA package. If your logic requirement fits within 360K LEs, evaluate the EP4SGX360KF43I4N for lower cost and similar transceiver capability. If your application does not need industrial temperature range (e.g., controlled lab/indoor environment), the EP4SGX530KH40C4N (C4 commercial grade) offers the same performance at lower cost. For pin-compatible same-package alternatives with the same die, see the EP4SGX530KH40I4 (no -N suffix variant) or EP4SGX530KF43I4N (F43 BGA substrate variant). All five parts listed in the alternatives table share the 531K-LE Stratix IV GX die but differ in speed grade, temperature range, or BGA substrate code.

Comparison with Alternatives

Parameter This Product EP4SGX530KH40I4 EP4SGX530KH40I3N EP4SGX530KH40C4N EP4SGX530KF43I4N EP4SGX530HH35I4N
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package FC-HFBGA-1517 (KH40) FC-HFBGA-1517 (KH40) - same FC-HFBGA-1517 (KH40) - same FC-HFBGA-1517 (KH40) - same FC-HFBGA-1517 (F43 substrate) - same pin count FC-HFBGA-1152 (HH35) - smaller, fewer pins
Logic Elements 531,200 531,200 531,200 531,200 531,200 531,200
Speed Grade I4 (industrial, fast) I4 I3 (slower) C4 (commercial temp) I4 I4
Temperature Range -40C to +100C (industrial) -40C to +100C -40C to +100C 0C to +85C (commercial) -40C to +100C -40C to +100C
Embedded Memory 28 Mb 28 Mb 28 Mb 28 Mb 28 Mb 28 Mb
Maximum Transceivers 24 24 24 24 24 Up to 24 (depends on package)
Lifecycle Status NRND NRND NRND NRND NRND NRND
Approximate Unit Price (qty 1) USD 4,250 USD 4,200 USD 3,900 USD 3,950 USD 4,300 USD 3,750

Key Differentiators

  • Highest logic density in the Stratix IV GX family at I4 speed grade (vs EP4SGX360KF43I4N)
  • Full 24-channel multi-gigabit transceiver count in the KH40 package (vs EP4SGX530HH35I4N)
  • Industrial I4 speed grade vs commercial C4 (vs EP4SGX530KH40C4N)

Design Notes

The 1517-ball FC-HFBGA package requires a high-density PCB stack-up with microvia (laser-drilled) interconnects to escape the 1.0 mm ball pitch. Use at least an 8-layer stack-up with dedicated ground and power planes between signal layers. Per Stratix IV hardware guidelines, all transceiver channels require matched-length differential pair routing with controlled impedance (100 ohm differential +/-10%) and intra-pair skew below 1 ps. Decoupling capacitors should be placed within 100 mils of every power pin, and at least 8 to 12 power rails are needed (VCC, VCCA, VCCD_PLL, VCCPT, VCCPGM, etc.).

Estimated power dissipation for the EP4SGX530KH40I4N at full utilization with all 24 transceivers active at 8.5 Gbps is approximately 15 to 25 W (typical application). The 1517-ball FC-HFBGA package exposes a large thermal pad on the bottom of the BGA substrate for direct heatsink attachment. Recommended thermal-management strategy: use a high-conductivity thermal interface material (TIM) and a finned heatsink with at least 0.5 C/W thermal resistance, or design a cold-plate attachment for >20 W sustained operation. Junction temperature must remain below 100 °C (industrial limit) - verify with the Quartus II PowerPlay early power estimator before board layout.

Common pitfalls when designing with the EP4SGX530KH40I4N include (1) failing to assign all configuration pins correctly, which prevents JTAG or AS configuration from starting, (2) leaving transceiver reference-clock pins unconnected or poorly terminated, causing link failures, (3) omitting the external memory-interface termination resistors on DDR3/QDRII+/RLDRAM2 interfaces, leading to signal-integrity violations, and (4) ignoring the MSL3+ handling requirement for the FC-HFBGA package. Always use the Altera Quartus II Pin Planner and follow the Stratix IV GX Transceiver User Guide for channel-bonding, pre-emphasis, and equalization settings.

The EP4SGX530KH40I4N requires multiple independent power rails: 0.9 V core (VCC), 1.1 V transceiver analog (VCCA), 1.1 V or 1.2 V PLL analog (VCCD_PLL), 1.5 V/1.8 V/2.5 V/3.0 V I/O banks (VCCIO), and configuration/periphery supply (VCCPT, VCCPGM). Use a sequencer IC such as the LTC2937 or ADM1166 to enforce proper power-up and power-down sequencing, and isolate analog and digital grounds with a single-point connection under the device. Power-rail decoupling should include 0402-size ceramic capacitors with bulk decoupling at the voltage regulator outputs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Altera/Intel product declaration for the Stratix IV family. Lead-free (Pb-free) ball finish on the 1517-ball FC-HFBGA package. AEC-Q100 qualification not applicable - this is a commercial/industrial FPGA, not an automotive-grade part.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4SGX530KH40I4N EP4SGX530KH40I4 EP4SGX530KH40I3N EP4SGX530KH40C4N EP4SGX530KF43I4N EP4SGX530HH35I4N Stratix IV GX FPGA Field-Programmable Gate Array FC-HFBGA BGA logic element Adaptive Logic Module DSP block embedded memory multi-gigabit transceiver PCI Express Gen2 DDR3 Quartus II 40 nm process TSMC RoHS AEC-Q100 40G/100G Ethernet OTN software-defined radio ASIC prototyping JTAG
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