EP4SGX360NF45I3N - 353K LEs, 920 I/O Stratix IV GX FPGA | Intel
MPN: EP4SGX360NF45I3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4625 | $46,250.00 |
| 100 | $4310 | $431,000.00 |
| 250 | $4120 | $1,030,000.00 |
| 500 | $3925 | $1,962,500.00 |
EP4SGX360NF45I3N Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Stratix IV GX parts sit in the high-end FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor, optimized for system bandwidth and signal integrity in wireline, wireless, and high-speed serial applications.
The EP4SGX360NF45I3N delivers up to 8.5 Gbps transceiver operation through its integrated GX transceivers, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI. With 14,144 adaptive logic modules (ALMs), 17.7 Mbits of MLAB memory, and Programmable Power Technology, this device targets high-performance systems requiring both massive parallelism and low static power consumption. Each transceiver channel consumes typically 200 mW at 6.5 Gbps, enabling high-density multi-channel line cards.
Architecturally, the EP4SGX360NF45I3N combines a sea-of-ALM fabric with dedicated memory blocks, DSP blocks, PLLs, and PCIe hard IP, allowing designers to instantiate complex multi-gigabit serial interfaces without consuming soft logic. The 40 nm process delivers roughly 35% lower dynamic power than the prior 65 nm Stratix III generation, while Programmable Power Technology allows unused logic to operate at near-zero static current.
Typical applications include high-end wireline networking line cards (40G/100G OTN), wireless baseband processing, military radar and electronic-warfare systems, and broadcast video infrastructure. The 1932-ball FC-BGA package supports the high pin density required for parallel memory interfaces (DDR3/QDRII+) and multiple multi-gigabit transceivers simultaneously.
When designing with this device, plan power architecture for the 0.9 V core rail and the 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V I/O rails using the PowerPlay Early Power Estimator. Use controlled-impedance routing for all transceiver channels and follow the Stratix IV GX pin-out guide for recommended decoupling. Lead time for this NRND-era part should be confirmed via franchised distributors.
This page synthesizes real-time distributor pricing, package-compatible same-family alternatives, and Stratix IV GX-specific design notes that go beyond what the manufacturer datasheet alone provides, including cross-references to other 360K-LE Stratix IV devices in the same NF45 package.
Drop-in alternatives for EP4SGX360NF45I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360NF45I3N (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Process Technology, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360NF45I3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP4SGX360NF45C3N
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →EP4SGX290NF45I3N
✅ Drop-In✓ In Stock
$9200 / Unit
View Datasheet →EP4SGX360NF45C4N
✅ Drop-In✓ In Stock
$3490 / Unit
View Datasheet →EP4SGX360NF45C2N
✅ Drop-In✓ In Stock
$11800 / Unit
View Datasheet →EP4SGX360NF45I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| Adaptive Logic Modules (ALM) | 141,440 |
| Embedded Memory (bits) | 23,105,536 |
| Maximum User I/O | 920 |
| Process Technology | TSMC 40 nm |
| Core Voltage (VCC) | 0.9 V |
| Transceiver Data Rate (max) | 8.5 Gbps |
| Transceiver Count | 24 (GX) |
| Package | 1932-ball FC-BGA (NF45) |
| Package Dimensions | 45 mm x 45 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | I3 |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Compliance | Yes (lead-free) |
EP4SGX360NF45I3N 45 mm x 45 mm Pin Configuration Guide
Pin configuration for EP4SGX360NF45I3N (45 mm x 45 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360NF45I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360NF45I3N is suitable for 7 applications: 40G/100G OTN Line Card, Wireless Baseband Processing, Military Radar and EW Systems, Broadcast Video Infrastructure, Test and Measurement Equipment, High-Performance Computing Acceleration, Medical Imaging and Diagnostics.
40G/100G OTN Line Card
The EP4SGX360NF45I3N's 24 GX transceivers at 8.5 Gbps and 353K LE support 40G OTU3 line cards with multiple 10G tributaries. Place the FPGA as the framer/mapper between client signals and line optics; its 23 Mbit embedded memory buffers packet bursts while 920 user I/Os interface to DDR3 QDRII+ and STS framer ASICs. PowerPlay allows unused ALMs to enter near-zero standby. The industrial -40C to +100C range suits outdoor enclosure deployments.
Recommended
Wireless Baseband Processing
For LTE and 5G NR baseband units, the EP4SGX360NF45I3N delivers 376 18x18 multipliers through its DSP blocks at up to 600 MHz, supporting multi-antenna MIMO channel processing. Its 8.5 Gbps transceivers connect directly to CPRI/OBSAI fronthaul links to remote radio heads. The 0.9 V core and Programmable Power Technology reduce dynamic power versus prior Stratix III by up to 35%, critical in densely packed BBU racks.
Recommended
Military Radar and EW Systems
The 1932-ball flip-chip BGA and industrial -40C to +100C temperature range of the EP4SGX360NF45I3N suit airborne and shipboard radar preprocessing arrays. Its 24 transceivers aggregate from A/D converters into a real-time FFT pipeline running at hundreds of MSPS, while 920 I/Os fan out to memory and DSP backends. The 40 nm process gives roughly 35% lower power than Stratix III, easing thermal budgets in sealed enclosures.
Recommended
Broadcast Video Infrastructure
Broadcast studios and contribution encoders use the EP4SGX360NF45I3N to multiplex uncompressed 3G-SDI, dual-link 6G-SDI, and emerging 12G-SDI streams from cameras and routers. The 24 transceivers carry up to 12 simultaneous 3G-SDI links or 6 dual-link 6G-SDI streams, while ALMs implement real-time color correction and HDR processing. The 0.9 V core and Programmable Power Technology reduce dynamic power versus prior Stratix III by up to 35%.
Recommended
Test and Measurement Equipment
High-end oscilloscopes, BERTs, and protocol analyzers use the EP4SGX360NF45I3N as a real-time waveform DSP engine. Its 23 Mbit embedded memory and 600 MHz block RAM capture deep acquisition windows, while 24 transceivers aggregate 8.5 Gbps links from multi-channel A/D converters. The 920 user I/Os drive external display controllers and LVDS buses, and the industrial temperature range supports outdoor and lab bench installations alike.
Recommended
High-Performance Computing Acceleration
HPC compute blades and FPGA-accelerator cards use the EP4SGX360NF45I3N for low-latency search, encryption, and floating-point kernels. Its 376 DSP blocks deliver sustained 18x18 multiply-accumulate at 600 MHz, while 24 transceivers feed data via PCIe Gen2 x8 directly to a host CPU. The 920 I/Os fan out to DDR3/QDRII+ memory banks, and the industrial temperature range tolerates dense server-rack airflow.
Recommended
Medical Imaging and Diagnostics
CT, MRI, and ultrasound imaging systems use the EP4SGX360NF45I3N for real-time back-projection and beamforming. The 353K LE supports back-end reconstruction pipelines, while 24 transceivers aggregate high-speed data from A/D front-ends. The 23 Mbit embedded buffer memory holds raw scan lines, and the industrial -40C to +100C temperature range fits clinical and mobile-cart deployment. Use the EP4SGX360NF45C3N for cost-sensitive non-medical variants.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360NF45I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360NF45I3 | EP4SGX360NF45C3N | EP4SGX360NF45C4N | EP4SGX360NF45C2N | EP4SGX290NF45I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) | 1932-ball FC-BGA (NF45) |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 291,200 (-18%) |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 17,402,624 (-25%) |
| User I/O | 920 | 920 | 920 | 920 | 920 | 920 |
| Speed Grade | I3 (industrial) | I3 | C3 (commercial) | C4 (commercial, slower) | C2 (commercial, faster) | I3 |
| Operating Temperature | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C |
| Transceiver Rate (max) | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest-density F45 BGA in 360K-LE Stratix IV GX family (vs EP4SGX290NF45I3N)
- Industrial temperature range with same F45 ball-out (vs EP4SGX360NF45C3N)
- I3 speed grade with F45 NF package suffix for lead-free compliance (vs EP4SGX360NF45I3)
- Pin-compatible with all F45 360K-LE Stratix IV GX variants (vs EP4SGX360KF43I3N)
Design Notes
Estimated: at 0.9 V core and 353K LE fully utilized, total core current can reach 15-25 A. Use the Intel PowerPlay Early Power Estimator (EPE) tool to size the 0.9 V regulator. Decouple with 0402/0201 ceramics placed immediately adjacent to every ball-grid VCC/GND pair, plus 220 uF bulk capacitors within the BGA shadow. The 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V I/O and PLL auxiliary rails each require independent regulators with their own isolation inductors for multi-gigabit transceiver jitter performance.
Use a high-density PCB stackup with at least 14 layers for the 1932-ball 1.0 mm pitch FC-BGA. Each transceiver channel must route on a single layer over a continuous ground plane with 100 ohm differential impedance; reference the Stratix IV GX High-Speed Board Design Guidelines for via patterns. Escape the BGA using buried vias to maximize routing density. Fanout for memory should follow the DDR3 read/write level-matching rules in the Stratix IV External Memory Interface Handbook.
Estimated: a Stratix IV GX at full 353K-LE utilization can dissipate 15-25 W depending on clock rate and toggle activity. The 45 mm BGA substrate has a theta_JA of approximately 0.5 C/W with a proper heatsink thermal interface material. Without airflow, derate by 50%. Provide a thermal pad contact or heat-spreader plate in the layout footprint, and avoid routing 12 inner layers as solid reference planes directly under hot transceiver lanes.
Do not apply power before all I/O and PLL rails are sequenced - the Stratix IV GX requires the 0.9 V core to ramp last. Mixing C-speed (commercial) and I-speed (industrial) parts on the same PCB causes JTAG IDCODE errors; verify date code per BOM. The 'N' suffix on EP4SGX360NF45I3N indicates lead-free / RoHS; confirm reflow profile matches the 260 C MSL-3 floor-life window if the part is repacked or stored.
Compliance Information
RoHS compliance confirmed by the 'N' suffix per Altera product ecology. REACH compliance is declared by Intel's Programmable Solutions Group. AEC-Q100 is not applicable as this is a high-end FPGA, not an automotive-grade IC. Halogen-free status is [DATA_NEEDED] - not explicitly listed in the verified web data.
