EP4SGX290NF45I3N - Stratix IV GX 291K LEs FPGA 1932-FCBGA | Intel
MPN: EP4SGX290NF45I3N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11576.72 | $11,576.72 |
| 10 | $11050 | $110,500.00 |
| 25 | $10500 | $262,500.00 |
| 50 | $9900 | $495,000.00 |
| 100 | $9200 | $920,000.00 |
EP4SGX290NF45I3N Overview
An FPGA is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks (transceivers, memory controllers, DSP slices) that engineers can reconfigure after manufacturing. Stratix IV GX sits in the high-performance transceiver-equipped tier of the Stratix IV family, bridging the gap between mainstream Cyclone-class FPGAs and the largest Arria-class mid-range parts, and is positioned below Stratix V/Stratix 10 for bandwidth-hungry applications.
Key features include up to 36 embedded transceivers supporting rates up to 8.5 Gbps for protocols such as PCIe Gen2, XAUI, CEI-6G, Interlaken, and Serial RapidIO, hard PCIe Gen2 IP blocks with Γ1/Γ2/Γ4/Γ8 endpoint and root-port support, dedicated 18Γ18 multipliers and variable-precision DSP blocks, up to 17.66 Mbits of embedded memory (M9K/M144K blocks), and 8 PLLs plus clock networks for multi-domain timing. The I3 speed grade combined with the industrial temperature rating (-40 Β°C to +100 Β°C) and NF45 (1932-ball, lead-free FCBGA, 45 mm body) addresses demanding industrial, defense, and test-equipment deployments.
Typical applications include high-speed serial backplane aggregation, multi-port 10 Gbps Ethernet line cards, radar and signal-intelligence baseband processing, medical imaging front-ends, and ASIC prototyping. Hard PCIe Gen2 endpoint blocks reduce logic consumption for accelerator cards, while the transceiver-rich fabric also suits software-defined radio and high-speed data-acquisition platforms.
When designing with this device, plan power integrity carefully - the 1932-ball FCBGA and dense transceiver fabric can pull tens of amps through the core rail and demand multi-phase VRMs and aggressive PCB layer-stack de-coupling. Use the Quartus II power analyzer with the EP4SGX290 device model to estimate worst-case thermal load before committing to the PCB stack-up.
Drop-in alternatives for EP4SGX290NF45I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX290NF45I3N (same form factor and footprint) β differing in Package, Transceivers, Process Technology, Core Voltage, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX290HF35I4G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX290NF45I3N-AA
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX290NF45C2N
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX290KF40I3N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP4SGX290HF35C3G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XC6VLX365T-1FFG1156C
β Drop-Inπ Reference alternative (not in catalog)
EP4SGX290NF45I3N Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Logic Elements | 291,200 |
| Embedded Memory | 17,661,952 bits |
| Maximum User I/O | 920 |
| LABs/CLBs | 11,648 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 1932-BBGA, FC-FBGA (NF45, 45 mm) |
| Mounting Type | Surface Mount |
| Speed Grade | I3 |
| Operating Temperature | -40 Β°C to +100 Β°C (Industrial) |
| Transceivers | Up to 36 multi-gigabit transceivers |
| Maximum Transceiver Rate | 8.5 Gbps |
| DSP Blocks | Yes (variable-precision, 18Γ18 multipliers) |
| PLLs | 8 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP4SGX290NF45I3N 1932-bbga, fc-fbga (nf45, 45 mm) Pin Configuration Guide
Pin configuration for EP4SGX290NF45I3N (1932-bbga, fc-fbga (nf45, 45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX290NF45I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX290NF45I3N is suitable for 6 applications: 10 Gbps Ethernet Line Card Aggregation, Software-Defined Radio (SDR) Baseband Processing, Medical Imaging Front-End (Ultrasound/CT), High-Speed Data Acquisition System, ASIC Prototyping Platform, Radar and Signal Intelligence Processing.
10 Gbps Ethernet Line Card Aggregation
The EP4SGX290NF45I3N is well suited to multi-port 10 Gbps Ethernet aggregation line cards thanks to its up to 36 embedded multi-gigabit transceivers supporting rates up to 8.5 Gbps and the hard PCIe Gen2 endpoint/root-port IP. Each transceiver can natively drive XAUI, 10GBASE-R, or KR backplanes while exposing the MAC, classification, and traffic-shaping logic in user-defined fabric. The 291K logic elements and 17.66 Mbits of embedded memory let designers implement large flow tables, deep packet buffers, and quality-of-service scheduling without external SRAM. Placed on the line card as the central packet processor, the FPGA aggregates 4-12 10 Gbps links and presents them as a single PCIe Gen2 Γ8 link to the host ASIC. Source: Stratix IV GX Device Handbook (Intel/Altera).
Recommended
Software-Defined Radio (SDR) Baseband Processing
The EP4SGX290NF45I3N delivers up to 36 transceivers at 8.5 Gbps paired with hundreds of variable-precision DSP blocks and 18Γ18 multipliers, making it an excellent platform for wideband SDR baseband processing. The 291K logic elements host wideband digital down-conversion, channelization, and demodulation chains across multiple simultaneous RF inputs sampled at hundreds of MSPS. Industrial temperature grade and the 1932-ball FCBGA package suit ruggedized mil/aero SDR chassis. Designers typically place the FPGA between the ADC array and an external processor, using the transceivers for CPRI/OBSAI fronthaul to remote radio heads and the DSP fabric for physical-layer bit-stream processing.
Recommended
Medical Imaging Front-End (Ultrasound/CT)
The EP4SGX290NF45I3N provides the logic density and DSP resources required for high-channel-count medical imaging front-ends such as 128-256 channel ultrasound beamformers or CT detector pre-processors. With 291K logic elements, abundant 18Γ18 multipliers, and up to 36 transceivers, the device can implement beamforming FIR filters, envelope detection, and high-speed LVDS-to-transceiver aggregation for image transfer. Industrial temperature rating (-40 to +100 Β°C) ensures compliance with medical device environmental requirements. The NF45 1932-ball FCBGA footprint fits standard medical board form factors while exposing enough I/O to interface with multi-channel ADCs.
Recommended
High-Speed Data Acquisition System
The EP4SGX290NF45I3N enables multi-channel high-speed data acquisition systems operating at gigasamples-per-second rates by aggregating LVDS or JESD204B ADC data streams through its embedded transceivers. The 17.66 Mbits of embedded memory provides deep sample buffering, while the variable-precision DSP blocks support real-time FIR filtering and decimation. Used in test & measurement, radar digitizers, and scientific instrumentation, the FPGA sits between the ADC array and a host processor over PCIe Gen2, offloading streaming, triggering, and FFT computation. The 920 user I/Os accept parallel LVDS data and provide GPIO for control/status.
Recommended
ASIC Prototyping Platform
The EP4SGX290NF45I3N is widely deployed as an ASIC prototyping platform for verification of large SoC designs. Its 291K logic elements map multi-million-gate ASICs through partitioning across multiple Stratix IV GX FPGAs connected via the embedded transceivers. Hard PCIe Gen2 and memory controller IP reduce bring-up time, while the NF45 1932-ball FCBGA package provides sufficient I/O for ASIC peripheral emulation. Engineering teams use the device to validate RTL before tape-out, debug firmware in pre-silicon form, and run real-world workload scenarios. Quartus II synthesis and TimeQuest timing analysis support iterative design turnaround.
Recommended
Radar and Signal Intelligence Processing
The EP4SGX290NF45I3N supports radar and signal-intelligence baseband processing applications where wideband RF front-ends produce high-rate digital streams that must be filtered, FFT-processed, and detected in real time. Its 291K logic elements, 17.66 Mbits embedded memory, and abundant variable-precision DSP blocks enable multi-channel pulse compression, MTI filtering, and CFAR detection. The up-to-36 transceivers at 8.5 Gbps accept aggregated ADC data or drive high-speed DACs for exciter waveforms. Industrial temperature grade and rugged FCBGA packaging suit airborne, naval, and ground-mobile radar platforms. Designers place the FPGA as the central baseband processor, with optional companion DSPs for downstream tracking.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX290NF45I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX290HF35I4G | EP4SGX290NF45C2N | EP4SGX290KF40I3N | EP4SGX290HF35C3G | XC6VLX365T-1FFG1156C |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | AMD / Xilinx |
| Package | 1932-BBGA, FC-FBGA (NF45) | 1932-BBGA, FC-FBGA (HF35) | 1932-BBGA, FC-FBGA (NF45) - same | 1517-BBGA, FC-FBGA (KF40) | 1932-BBGA, FC-FBGA (HF35) | 1156-ball FCBGA |
| Logic Elements | 291,200 | 291,200 | 291,200 | 291,200 | 291,200 | 364,160 |
| Embedded Memory | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits | 17,661,952 bits | 14,976 Kb (~14.6 Mbits) |
| Maximum User I/O | 920 | 864 | 920 | 650 | 864 | 720 |
| Speed Grade | I3 | I4 | C2 | I3 | C3 | -1 |
| Temperature Range | -40 Β°C to +100 Β°C (Industrial) | -40 Β°C to +100 Β°C (Industrial) | 0 Β°C to +85 Β°C (Commercial) | -40 Β°C to +100 Β°C (Industrial) | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) |
| Transceivers | Up to 36 at 8.5 Gbps | Up to 36 at 8.5 Gbps | Up to 36 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 36 at 8.5 Gbps | Up to 24 at 6.5 Gbps |
Key Differentiators
- Highest logic density in the Stratix IV GX NF45 package (vs EP4SGX230KF40I3N)
- Industrial temperature rating (-40 to +100 Β°C) in NF45 package (vs EP4SGX290NF45C2N)
- Up to 36 multi-gigabit transceivers at 8.5 Gbps (vs XC6VLX365T-1FFG1156C)
Design Notes
The 1932-ball FCBGA Stratix IV GX can pull tens of amps through the 0.9 V core rail at full transceiver and DSP utilization. Use the Quartus II PowerPlay early in the design to estimate worst-case current, then design a multi-phase buck VRM with adequate bulk decoupling (typically 10Γ 470 Β΅F polymer + 100 Β΅F ceramic per phase). Decoupling requirements for BGA-package FPGAs typically include 0.1 Β΅F X7R capacitors placed on the bottom side of the BGA footprint within the breakout region. Estimated: at 60 W total device power (0.9 V Γ 66 A) the thermal design must dissipate ~25 W at 85 Β°C ambient using a heatsink with Ο_JT β€ 1 Β°C/W.
The 1932-ball FCBGA has limited ΞΈ_JA headroom. Reference the Stratix IV GX Thermal Management guide for the recommended heatsink attachment (thermal interface material at Ο_JT β€ 0.2 Β°C/W) and airflow guidance. For -40 Β°C to +100 Β°C industrial applications, junction-to-ambient thermal resistance of the bare FCBGA is typically 8-12 Β°C/W depending on PCB layer count. Use thermal vias under the central die flag and a copper spreader on the top side to reduce spreading resistance. Estimated: at 25 W dissipation and 8 Β°C/W ΞΈ_JA, junction-to-ambient rise is 200 Β°C - heatsink is mandatory.
The NF45 1932-ball FCBGA requires high-density PCB routing with microvia (laser-drilled) stack-ups. Use at least 8 PCB layers with split power/ground planes; for transceiver signal integrity, 12+ layers are recommended. Pair the FPGA's RX/TX pins with AC-coupled capacitors rated for the protocol (typically 0.1 Β΅F X7R for β€8 Gbps). Place PCIe edge fingers within 250 mils of the FPGA's PCIe edge I/O bank to maintain signal-integrity margins. Always follow the Stratix IV GX board design guidelines.
Multi-gigabit transceivers running at 8.5 Gbps demand controlled-impedance routing (100 Ξ© differential) with length matching within 5 mils per lane. Use a 3D EM solver (ANSYS HFSS, Cadence Clarity) to extract channel S-parameters and run post-layout channel simulation with the Stratix IV GX IBIS-AMI models. Reference-plane stitching vias must be placed at β€ Ξ»/20 spacing to maintain return-path continuity through layer transitions. Pre-emphasis and equalization settings should be optimized per-channel using the Quartus II Transceiver Toolkit.
Do not assume all 36 transceivers are usable simultaneously - physical placement depends on the chosen package. The NF45 package supports the maximum transceiver count but pinout files must be consulted. PCIe Gen2 hard IP requires careful reference-clock jitter management: use a low-jitter clock generator and keep the PCIe reference clock trace short (< 2 inches). Configuration mode (AS, PS, FPP, JTAG) must match the chosen boot device; do not forget to provision the JTAG chain if in-system programming is required. Finally, validate configuration timing in Quartus II before taping out.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free (Pb-free) FCBGA packaging. Halogen-free per datasheet specifications. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
