Intel

EP4SGX360KF40I3N - Stratix IV GX FPGA, 360K LEs, 1517-FBGA | Intel

MPN: EP4SGX360KF40I3N ⚠ Last Time Buy

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0.9 V Vdss 1517-BGA, FC-FBGA Package 23,105,536 Memory

From $5120 USD / Unit

MOQ: 1 |

Price updated: 2026-09-10

Volume Pricing

Qty	Unit Price	Extended
1	$6545.98	$6,545.98
10	$6190.5	$61,905.00
50	$5820	$291,000.00
100	$5490	$549,000.00
250	$5120	$1,280,000.00

ℹ️ All prices are in USD

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EP4SGX360KF40I3N Overview

The Intel (formerly Altera) EP4SGX360KF40I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 adaptive logic modules (LABs), 23,105,536 bits of embedded memory, and 744 user I/O pins in a 1517-ball Flip-Chip BGA (FCBGA) package. It is built on a 40 nm process and targets high-performance, transceiver-rich designs in communications, signal processing, and ASIC prototyping.

An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than at the factory. FPGAs sit between fixed-function ASICs and software-defined processors in the design hierarchy, offering hardware-timed parallelism, sub-nanosecond latency, and the ability to integrate multi-gigabit transceivers, memory controllers, and DSP blocks on a single die. The Stratix IV GX family specifically adds embedded transceivers up to 8.5 Gbps, distinguishing it from logic-only or memory-optimized predecessors.

Key features include 48 full-duplex transceiver channels supporting common serial protocols, dedicated hard IP for PCI Express Gen1/Gen2, 8-input adaptive logic modules (ALMs), and on-chip memory with optional ECC. The 1517-FCBGA package exposes 744 general-purpose I/Os distributed across 16 banks, allowing flexible mixed-voltage interfacing (1.2 V to 3.3 V). Eight phase-locked loops (PLLs) provide robust clock management across multiple frequency domains, critical for protocol bridging and source-synchronous memory interfaces.

Architecture highlights include the ALM (Adaptive Logic Module) which combines the capabilities of LUT-based logic with dedicated arithmetic paths, and the MLAB (Memory Logic Array Block) which can operate as either distributed SRAM or as additional logic. Hard IP blocks for transceivers, PCIe, and external memory controllers free up logic resources and reduce latency compared to soft implementations. Power is managed via the PowerPlay toolkit with fine-grained quiescent power gating.

Typical applications include 40G/100G line card packet processing, OTN/SONET framer designs, ASIC and DSP prototyping, high-frequency trading accelerators, and broadcast video processing. The integrated transceivers and high logic density make it well suited for protocol bridging and high-throughput data aggregation where deterministic latency is required.

When designing with this device, pay close attention to PCB escape routing for the 1517-ball FCBGA; high-speed transceiver channels require impedance-controlled differential pairs and length matching. Plan power sequencing across multiple supply rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) and consult the Stratix IV GX Handbook for transceiver channel placement rules. Configuration via JTAG or fast passive parallel mode is required at every power-up.

This page synthesizes Intel distributor pricing, verified drop-in alternatives from the same Stratix IV GX family, and engineering design notes that go beyond what the manufacturer datasheet alone provides.

Drop-in alternatives for EP4SGX360KF40I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4SGX360KF40I3N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, Embedded Memory.

EP4SGX360KF40C2

Intel

Package: 1517-ball FCBGA, 42.5 x 42.5 mm

Speed Grade: C2 (commercial)

Operating Temperature: 0C to +85C (commercial)