EP4SGX530HH35C3N - Stratix IV GX FPGA 531K LE | Intel | 1152-BGA
MPN: EP4SGX530HH35C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18500 | $18,500.00 |
| 10 | $17250 | $172,500.00 |
| 100 | $15800 | $1,580,000.00 |
| 500 | $14400 | $7,200,000.00 |
| 1,000 | $13200 | $13,200,000.00 |
EP4SGX530HH35C3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by the user after manufacture via a hardware description language (HDL) and a configuration bitstream. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-class parallelism and throughput while retaining the re-programmability of software. Within the broader silicon taxonomy, an FPGA is a programmable logic device (PLD), a sub-category of logic ICs under Integrated Circuits, and ultimately a member of the power-managed semiconductor family. The Stratix IV GX sub-family specifically adds multi-gigabit transceivers for high-bandwidth serial connectivity.
Key features include 8.5T transceivers on the GX variant, embedded 10/100/1000 Ethernet MACs, and an internal clock network supporting up to 800 MHz operation. The HBGA-1152 package provides high-density signal escape with low inductance, making it suitable for high-performance systems requiring dozens of differential pairs. The 40 nm process technology balances performance and power consumption while delivering robust logic capacity.
Typical applications include high-end communications infrastructure (40G/100G line cards, wireless baseband), real-time signal processing for radar and test & measurement, ASIC prototyping, broadcast video processing, and industrial automation requiring deterministic hardware acceleration. The 1152-ball package is also well suited for high-density parallel interfaces and memory-rich subsystems.
When designing with this device, ensure the PCB provides adequate thermal dissipation given the 42.5 mm body size and use Altera's Quartus II design software (or the Intel Quartus Prime subscription) for synthesis, place-and-route, and timing closure. The C3 speed grade denotes a specific performance bin - engineers should consult the Stratix IV Device Handbook for detailed timing models.
Drop-in alternatives for EP4SGX530HH35C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX530HH35C3N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4SGX530HH35C3
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View Datasheet βEP4SGX530HH35C2NES
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View Datasheet βEP4SGX530HH35C3N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Stratix IV GX |
| Family | Stratix IV GX |
| Logic Elements | 531200 |
| Logic Array Blocks (LABs) | 21248 |
| Total Embedded Memory | 28033024 bits |
| User I/O Count | 564 |
| Package | 1152-BBGA, FCBGA (HBGA-1152) |
| Package Size | 42.50 x 42.50 mm |
| Internal Frequency | 800 MHz |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C3 |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 40 nm CMOS |
| Lead Free | Yes |
| RoHS Status | Compliant |
| Design Software | Altera Quartus II / Intel Quartus Prime |
EP4SGX530HH35C3N 42.50 x 42.50 mm Pin Configuration Guide
Pin configuration for EP4SGX530HH35C3N (42.50 x 42.50 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX530HH35C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX530HH35C3N is suitable for 6 applications: Telecom Line Card (40G/100G), ASIC Prototyping and Emulation, Wireless Baseband Processing, Broadcast Video Processing, Radar and Defense Signal Processing, Test & Measurement Instrumentation.
Telecom Line Card (40G/100G)
The EP4SGX530HH35C3N's 531K logic elements and embedded 6.5G to 8.5G transceivers make it well suited for 40G and 100G telecom line cards and OTN framer platforms. Its 564 user I/Os in the HBGA-1152 package provide ample escape for multiple SFP+/QSFP cages and external Interlaken or SPI4.2 interfaces to network processors. Compared with a smaller Stratix IV like the EP4SGX230, this device delivers more than 2x logic capacity to handle multi-channel PCS, MAC, and packet classification pipelines. Quartus II synthesis confirms timing closure at C3 speed grade for typical 156.25 MHz and 312.5 MHz reference clocks.
Recommended
ASIC Prototyping and Emulation
The 531K logic elements of the EP4SGX530HH35C3N map directly to ASIC gates for prototype validation. With 28 Mbits of embedded memory it can absorb mid-sized ASIC register and buffer requirements without external SSRAM. The 1152-ball package supports high-pin-count ASIC partitioning across multiple FPGAs using HAPS-style or custom daughter cards. Engineers use the C3 speed grade for the fastest possible prototype timing closure and rely on Quartus II incremental compile for rapid design iterations.
Recommended
Wireless Baseband Processing
The EP4SGX530HH35C3N is used in 4G/LTE and small-cell baseband units where its DSP blocks (up to 384 18x18 multipliers in the Stratix IV GX family) accelerate FFT, channel coding, and crest-factor-reduction algorithms. The 564 I/Os interface to CPRI or OBSAI links to remote radio heads through the integrated multi-gigabit transceivers. Operating at 0C to +85C commercial temperature, it suits indoor base-station enclosures with active cooling. Quartus II DSP Builder provides model-based design flows for rapid algorithm deployment.
Recommended
Broadcast Video Processing
The EP4SGX530HH35C3N delivers real-time processing for HD/3G-SDI broadcast video routers, format converters, and multiviewers. Its 28 Mbits embedded memory buffers line-rate video streams, while the 800 MHz internal fabric supports multi-stream 1080p60 processing. The HBGA-1152 package escapes dozens of SDI transceiver pairs alongside HDMI, DisplayPort, and audio interfaces. The C3 speed grade is critical for meeting 148.5 MHz pixel clock timing margins in 3G-SDI designs.
Recommended
Radar and Defense Signal Processing
The EP4SGX530HH35C3N's combination of 531K logic elements, embedded DSP blocks, and multi-gigabit transceivers makes it ideal for phased-array radar beamformers and electronic-warfare signal-processing subsystems. Real-time pulse compression, Doppler filtering, and CFAR detection fit comfortably in its logic and memory budget. Designers use the high I/O count to interface directly to ADC/DAC banks such as the EV12AS350 or ADC12D1800. Commercial-grade 0C to +85C parts are acceptable in temperature-controlled defense enclosures.
Recommended
Test & Measurement Instrumentation
The EP4SGX530HH35C3N forms the heart of high-end oscilloscopes, protocol analyzers, and logic-analyzer backends where parallel DSP, fast pattern matching, and multi-gigabit serial decode (PCIe Gen2, USB 3.0, SATA) are required simultaneously. The 564 I/Os drive custom probe interfaces and high-speed ADC data capture. Its embedded memory enables deep record lengths for transient analysis, while C3 speed grade supports the tightest timing margins for 5 Gbps serial decoders. Industrial-temperature variants are recommended for portable instruments.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX530HH35C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX530HH35C3 | EP4SGX530HH35C2N | EP4SGX530HH35C2 | EP4SGX530HH35C2NES | EP4SGX360NF45C3N |
|---|---|---|---|---|---|---|
| Package | HBGA-1152 (1152-BBGA, FCBGA) | HBGA-1152 - same | HBGA-1152 - same | HBGA-1152 - same | HBGA-1152 - same | BGA-1152 family - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same | Altera (Intel FPGA) - same |
| Logic Elements | 531200 | 531200 | 531200 | 531200 | 531200 | 360000 (-32%) |
| LABs | 21248 | 21248 | 21248 | 21248 | 21248 | 14400 (-32%) |
| Speed Grade | C3 | C3 - same | C2 (slower) | C2 (slower) | C2 (slower) | C3 - same |
| User I/O | 564 | 564 | 564 | 564 | 564 | varies by package variant |
| Embedded Memory | 28033024 bits | 28033024 bits | 28033024 bits | 28033024 bits | 28033024 bits | lesser density |
| Lead-Free ('N' suffix) | Yes | No (without N) | Yes | No (without N) | No (NES variant) | Yes |
Key Differentiators
- Highest logic density in Stratix IV GX family (531K LE) (vs EP4SGX360NF45C3N)
- C3 speed grade for tightest timing margins (vs EP4SGX530HH35C2N)
- Drop-in lead-free variant exists in same package (vs EP4SGX530HH35C3)
Design Notes
The 42.5 x 42.5 mm HBGA-1152 package of the EP4SGX530HH35C3N requires substantial PCB copper thermal relief. For typical Stratix IV GX designs consuming 10-15 W, follow the Altera Stratix IV Handbook thermal design guidelines: use a 1 oz copper inner plane and 2 oz top/bottom layers connected with at least 225 thermal vias under the center BGA ground balls. A heatsink is required for sustained operation above 70C ambient. Theta-JA for the HBGA-1152 with 0 LFM airflow is approximately 8-10 C/W; with 200 LFM airflow this drops to roughly 3-4 C/W. Always derate junction temperature to stay below 85C for commercial parts.
BGA breakout for the 1152-ball package requires an 8-layer or 10-layer stack-up with 0.4 mm or 0.5 mm pitch via-in-pad capability. Route all transceiver differential pairs with 100 ohm differential impedance, length-matched within 5 mils, and minimize vias (max 2 per pair). Use separate analog and digital ground planes, stitched together at a single point near the FPGA to avoid ground loops. Decoupling capacitors must be placed as close as possible to the BGA balls, with at least 200 ceramic 100nF/10nF capacitors distributed under and around the device. Follow Altera's Stratix IV GX layout reference design for the exact capacitor map.
The EP4SGX530HH35C3N's multi-gigabit transceivers up to 8.5 Gbps require strict signal-integrity practices: keep serial traces on inner stripline layers with continuous reference planes, use AC coupling capacitors (0.01uF to 0.1uF) at the transmitter side, and isolate reference clocks with proper guard traces. Reference clocks must be routed with 50 ohm controlled impedance and terminated at the FPGA pin. Pre-emphasis and equalization settings in Quartus II should be tuned with IBIS or HyperLynx simulations before PCB fabrication. Common pitfalls: unmatched via stubs, insufficient ground stitching, and shared power rails between analog PLL supplies and digital core.
Estimated: at full logic utilization with all 564 I/Os toggling at 250 MHz, the EP4SGX530HH35C3N can draw 8-12 A from the core VCC rails (per Stratix IV GX power calculator). Common pitfalls include: (1) under-estimating the number of decoupling capacitors required, (2) ignoring the special power sequencing requirements between VCCINT, VCCA, and VCCPD rails, (3) leaving JTAG TCK un-terminated which can cause configuration failures, (4) confusing Altera's speed-grade numbering (C2 is slower than C3, not the other way around). Always generate the pin-out using the Quartus II Pin Planner to ensure valid pin assignments and proper I/O standards.
Compliance Information
Lead-free per 'N' suffix in MPN per manufacturer datasheet. RoHS compliant. AEC-Q100 not applicable - this is a commercial-grade FPGA. Conflict-mineral compliance confirmed in Intel/Altera supply chain disclosures.
