EP4SGX360NF45I4N - 353.6K LE Stratix IV GX FPGA, 1932-FCBGA | Intel
MPN: EP4SGX360NF45I4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3680 | $36,800.00 |
| 100 | $3475 | $347,500.00 |
| 500 | $3295 | $1,647,500.00 |
| 1,000 | $3120 | $3,120,000.00 |
EP4SGX360NF45I4N Overview
What is an FPGA (Field Programmable Gate Array)? An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as transceivers, DSP blocks, and block RAM. Within the broader semiconductor taxonomy, an FPGA sits alongside microcontrollers, ASICs, and CPLDs in the digital logic / programmable logic category. The Stratix IV GX family specifically targets high-speed serial I/O (SERDES) applications, integrating up to 24 transceivers per device for protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CEI-6G.
Key features of the EP4SGX360NF45I4N include 23,105,536 bits of embedded memory, hardened PCIe Gen1/Gen2 IP blocks, dedicated DSP blocks for fixed- and floating-point math, and a comprehensive clock management network with PLLs. The 40 nm process enables lower static power versus prior 65 nm Stratix III devices while supporting high toggle rates required by 6.375 Gbps transceivers.
Architecturally, the EP4SGX360NF45I4N uses Altera's Adaptive Logic Module (ALM) - an 8-input fracturable LUT supporting any 6-input LUT plus two independent outputs - giving higher effective logic utilization than 4-input LUT architectures. Embedded memory blocks (M512, M4K, and M-RAM blocks) can be concatenated to build FIFOs and large buffers, while the variable-precision DSP blocks handle 18x18 and 36x36 multipliers, accelerating signal-processing pipelines.
Typical applications include high-speed serial interface bridging (PCIe Gen2 endpoint / root-port designs, XAUI backplanes), radio baseband processing, test-and-measurement instrumentation front-ends, military and aerospace signal processing, and high-end ASIC prototyping. The wide transceivers and abundant logic make the EP4SGX360NF45I4N a common choice for protocol bridging and FPGA-based co-processing where discrete ASSPs are unavailable.
When designing with this device, ensure that PCB layout supports the flip-chip BGA with controlled-impedance transceiver lanes and adequate via-in-pad or microvia fan-out. Decoupling must follow the Quartus II power distribution network guidelines; an isolated, low-noise 0.9 V core supply with bulk and ceramic decoupling is critical. Power estimation should be performed early using the Quartus Early Power Estimator (EPE) spreadsheet, since a fully populated EP4SGX360NF45I4N can draw tens of amps on the core rail.
This page synthesizes distributor stock indicators, drop-in alternatives in the same 1932-FCBGA footprint, and practical PCB / power-distribution design notes not found in the standalone manufacturer datasheet, so engineers can accelerate second-source decisions and layout planning for Stratix IV GX designs.
Drop-in alternatives for EP4SGX360NF45I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX360NF45I4N (same form factor and footprint) — differing in Speed Grade, Package, Process Technology, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX360NF45I4
✅ Drop-In✓ In Stock
$2350 / Unit
View Datasheet →EP4SGX360NF45I3N
✅ Drop-In✓ In Stock
$3925 / Unit
View Datasheet →EP4SGX360NF45I3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP4SGX360NF45C4N
✅ Drop-In✓ In Stock
$3490 / Unit
View Datasheet →EP4SGX360NF45C4
✅ Drop-In✓ In Stock
$2600 / Unit
View Datasheet →EP4SGX360NF45C3N
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →EP4SGX290NF45I4N
✅ Drop-In✓ In Stock
$2095 / Unit
View Datasheet →EP4SGX360NF45I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix IV GX |
| Logic Elements (LE) | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| User I/O Pins | 920 |
| Total Embedded Memory | 23,105,536 bits (approx. 27.5 Mbits) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FC-FBGA (NF45) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) |
| Speed Grade | I4 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount (BGA) |
| Number of Logic Cells (Cells) | 353,600 |
EP4SGX360NF45I4N 1932-ball fc-fbga (nf45) Pin Configuration Guide
Pin configuration for EP4SGX360NF45I4N (1932-ball fc-fbga (nf45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX360NF45I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX360NF45I4N is suitable for 7 applications: PCIe Gen2 Endpoint / Root-Port Design, High-Speed Serial Interface Bridging (XAUI / Serial RapidIO / CEI-6G), ASIC Prototyping and Emulation, Software Defined Radio (SDR) Baseband Processing, Test and Measurement Instrumentation Front-End, Military and Aerospace Signal Processing, Video Broadcast and Image Processing.
PCIe Gen2 Endpoint / Root-Port Design
The EP4SGX360NF45I4N integrates hardened PCIe Gen1/Gen2 IP blocks alongside up to 24 SERDES transceivers supporting 6.375 Gbps, making it ideal for PCIe endpoint or root-port designs on motherboards, storage controllers, and FPGA accelerator cards. Its 353,600 logic elements and 23 Mbits of embedded memory allow the FPGA fabric to implement complete protocol stacks, DMA engines, and application logic in one device. Compared with discrete PCIe ASSPs, the EP4SGX360NF45I4N offers reconfigurable lane widths (x1/x4/x8) and protocol switching without silicon re-spin. Designers should follow the Stratix IV Device Handbook PCIe chapter for reference clocking, transceiver pre-emphasis, and PIPE interface timing.
Recommended
High-Speed Serial Interface Bridging (XAUI / Serial RapidIO / CEI-6G)
With integrated SERDES transceivers up to 6.375 Gbps and abundant logic, the EP4SGX360NF45I4N bridges between XAUI 10 Gbps backplanes, Serial RapidIO, and CEI-6G links in telecom and military systems. The device supports multiple clock domains and reference clock inputs needed to deskew incoming serial streams. The 920 user I/O pins permit wide parallel system-side buses, and the 40 nm process supports sustained 6.375 Gbps operation with proper signal-integrity PCB layout. Use the Stratix IV GX transceiver toolkit for eye-diagram verification and pre-emphasis tuning during bring-up.
Recommended
ASIC Prototyping and Emulation
The EP4SGX360NF45I4N's 353,600 logic elements, large embedded memory, and abundant I/O make it a workhorse for ASIC prototyping and in-circuit emulation, where multiple FPGAs partition a large ASIC design. The 'I4' speed grade and industrial temperature range allow prototyping in lab and harsh environments, while Quartus II synthesis supports incremental compilation to manage long compile times. Designers commonly map ASIC blocks into the FPGA's ALMs, M-RAM, and DSP blocks, with multi-FPGA pin multiplexing handled by GTL transceivers. This avoids the cost and risk of ASIC re-spins during verification.
Recommended
Software Defined Radio (SDR) Baseband Processing
For SDR baseband designs, the EP4SGX360NF45I4N's variable-precision DSP blocks accelerate 18x18 and 36x36 multiply-accumulate pipelines used in digital down-conversion, FFT, and channelization. The 23 Mbits of embedded memory buffer large FFT windows and symbol buffers without external SRAM, reducing BOM cost. Transceivers accept ADC sample streams directly at 6.375 Gbps, simplifying the analog front-end. Compared with DSP processors, the FPGA fabric delivers deterministic latency and parallel processing, which is essential for low-latency modem chains and MIMO systems.
Recommended
Test and Measurement Instrumentation Front-End
The EP4SGX360NF45I4N fits benchtop instruments such as protocol analyzers, logic analyzers, and high-speed digitizers because of its parallel I/O count, large block RAM, and integrated transceivers. Industrial temperature grading allows instrumentation to be deployed in production-line environments, while the I4 speed grade supports real-time triggering and on-chip state compression. Compared with discrete logic, the FPGA enables rapid protocol update via in-system programming, extending the instrument's useful life without hardware changes.
Recommended
Military and Aerospace Signal Processing
The EP4SGX360NF45I4N's industrial temperature range (-40 °C to +100 °C) and high logic density suit military and aerospace applications such as radar front-end processing, electronic warfare, and secure communications. Conformal coating and vibration-qualified assembly on the 1932-FCBGA enable deployment in avionics and rugged enclosures. The integrated transceivers feed digitized IF or RF data into the FPGA fabric, where DSP blocks perform pulse compression, beamforming, and crypto acceleration. Designers should review the Stratix IV military / aerospace product brief for derating guidance.
Recommended
Video Broadcast and Image Processing
The EP4SGX360NF45I4N's 920 I/Os and 23 Mbits of embedded memory enable multi-stream video processing pipelines, including 4K upscaling, color-space conversion, and real-time frame-rate conversion. The 40 nm process supports high DDR3 / QDR II + external memory bandwidth through dedicated PHY blocks, while ALMs implement parallel pixel processing. Compared with GPU-based broadcast systems, the FPGA delivers deterministic frame latency required for live production. The industrial temperature range allows broadcast equipment installation in unconditioned spaces.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX360NF45I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX360NF45I4 | EP4SGX360NF45I3N | EP4SGX360NF45C4N | EP4SGX360NF45C3N | EP4SGX290NF45I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) | 1932-ball FC-FBGA (NF45) |
| Logic Elements (LE) | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 290,000 |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Industrial (-40 to +100 °C) | Commercial (0 to +85 °C) | Commercial (0 to +85 °C) | Industrial (-40 to +100 °C) |
| Speed Grade | I4 | I4 | I3 | C4 | C3 | I4 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest-density Stratix IV GX FPGA with industrial temperature in NF45 footprint (vs EP4SGX290NF45I4N)
- Industrial temperature grade with full pin compatibility to commercial variants (vs EP4SGX360NF45C4N)
- Fastest speed grade (I4) available on NF45 footprint (vs EP4SGX360NF45I3N)
Design Notes
Estimated: the EP4SGX360NF45I4N can dissipate 15-25 W at full utilization; design the FCBGA thermal solution with at least a thermal pad, heat spreader, and forced airflow (200 LFM minimum). Industrial temperature grade requires junction-to-ambient derating; use the Quartus PowerPlay EPE spreadsheet for application-specific power estimation. Avoid placing tall components directly upstream to the airflow path over the FPGA heat spreader.
The 1932-ball FC-FBGA requires via-in-pad or microvia fan-out with controlled-impedance routing for the SERDES lanes. Use stripline or microstrip with 100-ohm differential impedance for transceiver pairs, keep reference clock traces length-matched to within 25 mil, and isolate analog power from digital power with ferrite beads. Follow the Stratix IV Device Handbook board design guidelines for ball pad pitch and antipad geometry.
Estimated: design a low-noise 0.9 V core supply capable of 30 A peak with bulk ceramic decoupling (220 µF + 47 µF + 22 µF + 4.7 µF + 100 nF) on each regulator output. Split 0.9 V digital, 0.9 V analog, 1.0 V analog, and 1.5 V/2.5 V/3.0 V I/O rails with separate sense lines; use remote-sense at the BGA. Power sequencing (POR delay) must follow the Stratix IV Device Handbook recommended order to avoid latch-up.
Transceiver channels require pre-emphasis and equalization tuning; start with Quartus II Transceiver Toolkit eye-diagram sweeps at 6.375 Gbps and adjust TX pre-emphasis taps and RX CTLE/DFE settings. Reference clock jitter must stay below 1 ps RMS to meet BER < 1e-12; use a dedicated low-jitter clock synthesizer like the CDCE62005. Keep AC-coupling capacitors on SERDES differential pairs to avoid DC bias drift.
Do not substitute the EP4SGX360KF43I4N (KF43 package) into a board designed for NF45 - the ball maps are different and will fail to function. Do not use commercial grade (C4/C2) parts in industrial temperature designs - they will fail at low temperature. Ensure configuration scheme (EPCS / CFI flash / JTAG) uses the correct MSEL[3:0] pin settings per the Stratix IV handbook; a wrong MSEL setting results in no boot. Always validate pinout against the latest Intel FPGA support file before tape-out.
Compliance Information
RoHS compliant per full-electronic.com and Intel FPGA product pages. Industrial temperature grade verified. AEC-Q100 not applicable for FPGAs. REACH and conflict minerals data not in verified web data.
