EPF10K100ARC240-3N - 100K Gates FLEX 10KA FPGA | Intel / Altera
MPN: EPF10K100ARC240-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.75 | $287.50 |
| 100 | $24.1 | $2,410.00 |
| 500 | $20.95 | $10,475.00 |
| 1,000 | $18.4 | $18,400.00 |
EPF10K100ARC240-3N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. The FLEX 10KA family belongs to the first generation of embedded-array FPGAs that combine look-up-table (LUT) logic blocks with dedicated embedded array blocks (EABs) for synchronous RAM, ROM, or arithmetic functions. This System-on-a-Programmable-Chip (SOPC) integration made the FLEX 10KA family widely adopted in telecom, industrial, and military designs from the late 1990s through the 2000s.
Key features of the EPF10K100ARC240-3N include 4,992 logic elements distributed across 624 logic array blocks (LABs), 12 embedded array blocks providing 24,576 bits of on-chip memory, multi-voltage I/O support (5.0V, 3.3V, and 2.5V), an in-system programmability (ISP) interface via JTAG, and a 0.6000 ns propagation delay (per third-party spec). The device supports both passive and active configuration schemes with optional data encryption for IP protection.
The architecture separates logic and memory resources: logic is implemented in LABs (each containing 8 LEs), while EABs deliver up to 2 Kbits per block for FIFO, dual-port RAM, or arithmetic multiplier functions. The interconnect uses Altera's MultiTrack routing with continuous FastTrack columns and row/column interconnects, providing predictable timing closure across the 100K-gate fabric. The 0.3 µm CMOS process and 3.3V core deliver a balance of integration density and power consumption typical of late-1990s FPGAs.
Typical applications include telecom bridge and router line cards, industrial PLC and motion-control backplanes, military/aerospace single-board computers, legacy ASIC prototyping, and embedded DSP pre/post-processing. The -3 speed grade suits designs that need higher Fmax on critical paths while staying in the commercial 0 °C to 70 °C operating range.
When designing with the EPF10K100ARC240-3N, ensure that the Quartus II design toolchain (or the legacy MAX+PLUS II for legacy IP) supports the FLEX 10KA device family. Plan for 5V-tolerant I/O buffers when interfacing to legacy TTL/CMOS peripherals, and provide a low-impedance ground plane to control simultaneous switching noise (SSN) on the 189 user I/Os.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 10KA family, and practical design notes not consolidated in the legacy Altera datasheet - useful for engineers maintaining or replicating legacy hardware.
Drop-in alternatives for EPF10K100ARC240-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100ARC240-3N (same form factor and footprint) — differing in Process Technology, Propagation Delay, Family, Package, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100ARC240-1
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EPF10K100ARC240-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EPF10K100AFC484-2N
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →EPF10K100ARC240-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KA |
| Series | FLEX 10K |
| System Gates | 100,000 |
| Logic Elements (LE) | 4,992 |
| Logic Array Blocks (LAB) | 624 |
| Embedded Array Blocks (EAB) | 12 |
| On-chip RAM | 24,576 bits (24.18 kbit) |
| User I/Os | 189 |
| Process Technology | 0.3 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Speed Grade | -3 |
| Propagation Delay | 0.6000 ns |
| Package | 240-RQFP (BFQFP with exposed pad) |
| Operating Temperature | 0 °C to 70 °C (commercial) |
| Mounting Type | Surface Mount |
| Configuration | JTAG / passive serial / passive parallel / active serial |
EPF10K100ARC240-3N Pin Configuration
| Pin 1 | I/O — User I/O (bank 1) |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | I/O — User I/O (bank 1) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | I/O — User I/O (bank 1) |
| Pin 9 | I/O — User I/O (bank 1) |
| Pin 10 | I/O — User I/O (bank 1) |
| Pin 11 | I/O — User I/O (bank 1) |
| Pin 12 | I/O — User I/O (bank 1) |
| Pin 13 | I/O — User I/O (bank 1) |
| Pin 14 | I/O — User I/O (bank 1) |
| Pin 15 | I/O — User I/O (bank 1) |
| Pin 16 | I/O — User I/O (bank 1) |
| Pin 17 | I/O — User I/O (bank 1) |
| Pin 18 | I/O — User I/O (bank 1) |
| Pin 19 | I/O — User I/O (bank 1) |
| Pin 20 | I/O — User I/O (bank 1) |
| Pin 21 | I/O — User I/O (bank 1) |
| Pin 22 | I/O — User I/O (bank 1) |
| Pin 23 | I/O — User I/O (bank 1) |
| Pin 24 | I/O — User I/O (bank 1) |
| Pin 25 | I/O — User I/O (bank 1) |
| Pin 26 | I/O — User I/O (bank 1) |
| Pin 27 | I/O — User I/O (bank 1) |
| Pin 28 | I/O — User I/O (bank 1) |
| Pin 29 | I/O — User I/O (bank 1) |
| Pin 30 | I/O — User I/O (bank 1) |
| Pin 31 | I/O — User I/O (bank 1) |
| Pin 32 | I/O — User I/O (bank 1) |
| Pin 33 | I/O — User I/O (bank 1) |
| Pin 34 | I/O — User I/O (bank 1) |
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| Pin 37 | I/O — User I/O (bank 1) |
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| Pin 39 | I/O — User I/O (bank 1) |
| Pin 40 | I/O — User I/O (bank 1) |
| Pin 41 | I/O — User I/O (bank 1) |
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| Pin 46 | I/O — User I/O (bank 1) |
| Pin 47 | I/O — User I/O (bank 1) |
| Pin 48 | I/O — User I/O (bank 1) |
| Pin 49 | I/O — User I/O (bank 1) |
| Pin 50 | I/O — User I/O (bank 1) |
| Pin 51 | I/O — User I/O (bank 1) |
| Pin 52 | I/O — User I/O (bank 1) |
| Pin 53 | I/O — User I/O (bank 1) |
| Pin 54 | I/O — User I/O (bank 1) |
| Pin 55 | I/O — User I/O (bank 1) |
| Pin 56 | I/O — User I/O (bank 1) |
| Pin 57 | I/O — User I/O (bank 1) |
| Pin 58 | I/O — User I/O (bank 1) |
| Pin 59 | I/O — User I/O (bank 1) |
| Pin 60 | I/O — User I/O (bank 1) |
| Pin 61 | GND — Ground (bank 1) |
| Pin 62 | VCCINT — Core supply 3.3 V |
| Pin 63 | I/O — User I/O (bank 2) |
| Pin 64 | I/O — User I/O (bank 2) |
| Pin 65 | I/O — User I/O (bank 2) |
| Pin 66 | I/O — User I/O (bank 2) |
| Pin 67 | I/O — User I/O (bank 2) |
| Pin 68 | I/O — User I/O (bank 2) |
| Pin 69 | I/O — User I/O (bank 2) |
| Pin 70 | I/O — User I/O (bank 2) |
| Pin 71 | I/O — User I/O (bank 2) |
| Pin 72 | I/O — User I/O (bank 2) |
| Pin 73 | I/O — User I/O (bank 2) |
| Pin 74 | I/O — User I/O (bank 2) |
| Pin 75 | I/O — User I/O (bank 2) |
| Pin 76 | I/O — User I/O (bank 2) |
| Pin 77 | I/O — User I/O (bank 2) |
| Pin 78 | I/O — User I/O (bank 2) |
| Pin 79 | I/O — User I/O (bank 2) |
| Pin 80 | I/O — User I/O (bank 2) |
| Pin 81 | I/O — User I/O (bank 2) |
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| Pin 86 | I/O — User I/O (bank 2) |
| Pin 87 | I/O — User I/O (bank 2) |
| Pin 88 | I/O — User I/O (bank 2) |
| Pin 89 | I/O — User I/O (bank 2) |
| Pin 90 | I/O — User I/O (bank 2) |
| Pin 91 | I/O — User I/O (bank 2) |
| Pin 92 | I/O — User I/O (bank 2) |
| Pin 93 | I/O — User I/O (bank 2) |
| Pin 94 | I/O — User I/O (bank 2) |
| Pin 95 | I/O — User I/O (bank 2) |
| Pin 96 | I/O — User I/O (bank 2) |
| Pin 97 | I/O — User I/O (bank 2) |
| Pin 98 | I/O — User I/O (bank 2) |
| Pin 99 | I/O — User I/O (bank 2) |
| Pin 100 | I/O — User I/O (bank 2) |
| Pin 101 | I/O — User I/O (bank 2) |
| Pin 102 | I/O — User I/O (bank 2) |
| Pin 103 | I/O — User I/O (bank 2) |
| Pin 104 | I/O — User I/O (bank 2) |
| Pin 105 | I/O — User I/O (bank 2) |
| Pin 106 | I/O — User I/O (bank 2) |
| Pin 107 | I/O — User I/O (bank 2) |
| Pin 108 | I/O — User I/O (bank 2) |
| Pin 109 | I/O — User I/O (bank 2) |
| Pin 110 | I/O — User I/O (bank 2) |
| Pin 111 | I/O — User I/O (bank 2) |
| Pin 112 | I/O — User I/O (bank 2) |
| Pin 113 | I/O — User I/O (bank 2) |
| Pin 114 | I/O — User I/O (bank 2) |
| Pin 115 | I/O — User I/O (bank 2) |
| Pin 116 | I/O — User I/O (bank 2) |
| Pin 117 | I/O — User I/O (bank 2) |
| Pin 118 | I/O — User I/O (bank 2) |
| Pin 119 | I/O — User I/O (bank 2) |
| Pin 120 | I/O — User I/O (bank 2) |
| Pin 121 | GND — Ground (bank 2) |
| Pin 122 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| Pin 123 | nCONFIG — Configuration start (active-low) |
| Pin 124 | nSTATUS — Configuration status (active-low) |
| Pin 125 | CONF_DONE — Configuration done (open-drain) |
| Pin 126 | DCLK — Configuration clock |
| Pin 127 | DATA0 — Configuration data input |
| Pin 128 | MSEL0 — Configuration mode select 0 |
| Pin 129 | MSEL1 — Configuration mode select 1 |
| Pin 130 | MSEL2 — Configuration mode select 2 |
| Pin 131 | TDI — JTAG test data in |
| Pin 132 | TDO — JTAG test data out |
| Pin 133 | TMS — JTAG test mode select |
| Pin 134 | TCK — JTAG test clock |
| Pin 135 | nCE — Chip enable (active-low) |
| Pin 136 | I/O — User I/O (bank 3) |
| Pin 137 | I/O — User I/O (bank 3) |
| Pin 138 | I/O — User I/O (bank 3) |
| Pin 139 | I/O — User I/O (bank 3) |
| Pin 140 | I/O — User I/O (bank 3) |
| Pin 141 | I/O — User I/O (bank 3) |
| Pin 142 | I/O — User I/O (bank 3) |
| Pin 143 | I/O — User I/O (bank 3) |
| Pin 144 | I/O — User I/O (bank 3) |
| Pin 145 | I/O — User I/O (bank 3) |
| Pin 146 | I/O — User I/O (bank 3) |
| Pin 147 | I/O — User I/O (bank 3) |
| Pin 148 | I/O — User I/O (bank 3) |
| Pin 149 | I/O — User I/O (bank 3) |
| Pin 150 | I/O — User I/O (bank 3) |
| Pin 151 | I/O — User I/O (bank 3) |
| Pin 152 | I/O — User I/O (bank 3) |
| Pin 153 | I/O — User I/O (bank 3) |
| Pin 154 | I/O — User I/O (bank 3) |
| Pin 155 | I/O — User I/O (bank 3) |
| Pin 156 | I/O — User I/O (bank 3) |
| Pin 157 | I/O — User I/O (bank 3) |
| Pin 158 | I/O — User I/O (bank 3) |
| Pin 159 | I/O — User I/O (bank 3) |
| Pin 160 | I/O — User I/O (bank 3) |
| Pin 161 | I/O — User I/O (bank 3) |
| Pin 162 | I/O — User I/O (bank 3) |
| Pin 163 | I/O — User I/O (bank 3) |
| Pin 164 | I/O — User I/O (bank 3) |
| Pin 165 | I/O — User I/O (bank 3) |
| Pin 166 | I/O — User I/O (bank 3) |
| Pin 167 | I/O — User I/O (bank 3) |
| Pin 168 | I/O — User I/O (bank 3) |
| Pin 169 | I/O — User I/O (bank 3) |
| Pin 170 | I/O — User I/O (bank 3) |
| Pin 171 | I/O — User I/O (bank 3) |
| Pin 172 | I/O — User I/O (bank 3) |
| Pin 173 | I/O — User I/O (bank 3) |
| Pin 174 | I/O — User I/O (bank 3) |
| Pin 175 | I/O — User I/O (bank 3) |
| Pin 176 | I/O — User I/O (bank 3) |
| Pin 177 | I/O — User I/O (bank 3) |
| Pin 178 | I/O — User I/O (bank 3) |
| Pin 179 | I/O — User I/O (bank 3) |
| Pin 180 | I/O — User I/O (bank 3) |
| Pin 181 | GND — Ground (bank 3) |
| Pin 182 | VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V |
| Pin 183 | I/O — User I/O (bank 4) |
| Pin 184 | I/O — User I/O (bank 4) |
| Pin 185 | I/O — User I/O (bank 4) |
| Pin 186 | I/O — User I/O (bank 4) |
| Pin 187 | I/O — User I/O (bank 4) |
| Pin 188 | I/O — User I/O (bank 4) |
| Pin 189 | I/O — User I/O (bank 4) |
| Pin 190 | I/O — User I/O (bank 4) |
| Pin 191 | I/O — User I/O (bank 4) |
| Pin 192 | I/O — User I/O (bank 4) |
| Pin 193 | I/O — User I/O (bank 4) |
| Pin 194 | I/O — User I/O (bank 4) |
| Pin 195 | I/O — User I/O (bank 4) |
| Pin 196 | I/O — User I/O (bank 4) |
| Pin 197 | I/O — User I/O (bank 4) |
| Pin 198 | I/O — User I/O (bank 4) |
| Pin 199 | I/O — User I/O (bank 4) |
| Pin 200 | I/O — User I/O (bank 4) |
| Pin 201 | I/O — User I/O (bank 4) |
| Pin 202 | I/O — User I/O (bank 4) |
| Pin 203 | I/O — User I/O (bank 4) |
| Pin 204 | I/O — User I/O (bank 4) |
| Pin 205 | I/O — User I/O (bank 4) |
| Pin 206 | I/O — User I/O (bank 4) |
| Pin 207 | I/O — User I/O (bank 4) |
| Pin 208 | I/O — User I/O (bank 4) |
| Pin 209 | I/O — User I/O (bank 4) |
| Pin 210 | I/O — User I/O (bank 4) |
| Pin 211 | I/O — User I/O (bank 4) |
| Pin 212 | I/O — User I/O (bank 4) |
| Pin 213 | I/O — User I/O (bank 4) |
| Pin 214 | I/O — User I/O (bank 4) |
| Pin 215 | I/O — User I/O (bank 4) |
| Pin 216 | I/O — User I/O (bank 4) |
| Pin 217 | I/O — User I/O (bank 4) |
| Pin 218 | I/O — User I/O (bank 4) |
| Pin 219 | I/O — User I/O (bank 4) |
| Pin 220 | I/O — User I/O (bank 4) |
| Pin 221 | I/O — User I/O (bank 4) |
| Pin 222 | I/O — User I/O (bank 4) |
| Pin 223 | I/O — User I/O (bank 4) |
| Pin 224 | I/O — User I/O (bank 4) |
| Pin 225 | I/O — User I/O (bank 4) |
| Pin 226 | I/O — User I/O (bank 4) |
| Pin 227 | I/O — User I/O (bank 4) |
| Pin 228 | I/O — User I/O (bank 4) |
| Pin 229 | I/O — User I/O (bank 4) |
| Pin 230 | I/O — User I/O (bank 4) |
| Pin 231 | I/O — User I/O (bank 4) |
| Pin 232 | I/O — User I/O (bank 4) |
| Pin 233 | I/O — User I/O (bank 4) |
| Pin 234 | I/O — User I/O (bank 4) |
| Pin 235 | I/O — User I/O (bank 4) |
| Pin 236 | I/O — User I/O (bank 4) |
| Pin 237 | I/O — User I/O (bank 4) |
| Pin 238 | I/O — User I/O (bank 4) |
| Pin 239 | GND — Ground (bank 4) |
| Pin 240 | VCCINT — Core supply 3.3 V |
Typical Applications
EPF10K100ARC240-3N is suitable for 6 applications: Telecom Bridge and Router Line Cards, Industrial PLC and Motion-Control Backplanes, Legacy ASIC Prototyping and Emulation, Military and Aerospace Single-Board Computers, Embedded DSP Pre- and Post-Processing, Legacy Test and Measurement Instrumentation.
Telecom Bridge and Router Line Cards
The EPF10K100ARC240-3N fits telecom bridge and router line-card designs that require 100K gates of glue logic plus 24 Kbits of on-chip memory for FIFO buffering between PHY and switch fabric. With 189 user I/Os and multi-voltage I/O support (5.0/3.3/2.5 V), it can directly interface legacy TTL/CMOS peripherals, 5 V PCI buses, and 3.3 V ASICs without external level shifters. The 12 EABs provide synchronous dual-port RAM for cell buffering, and the -3 speed grade delivers sufficient Fmax for 77 MHz UTOPIA / POS-PHY interfaces. Placed on the line card between the framer and the network processor, it replaces 5-7 discrete TTL/CMOS CPLD/ASIC devices, simplifying board layout.
Recommended
Industrial PLC and Motion-Control Backplanes
The EPF10K100ARC240-3N is widely deployed in industrial PLC and motion-controller backplanes that need deterministic glue logic between microcontrollers, encoder counters, and stepper/servo drives. Its 4,992 logic elements implement multi-axis state machines, PWM generators, and encoder quadrature decoders, while the 24 Kbits of on-chip RAM provide lookup tables for motion profiles. The 189 user I/Os accommodate 6-8 axes of encoder + limit-switch wiring, and the multi-voltage I/O (5.0/3.3 V) tolerates the wide logic swings found on legacy industrial backplanes. Operating from 0 °C to 70 °C commercial range, it suits cabinet-mounted controllers; pair with the FLEX 10KA -3 speed grade to meet 50 µs servo-loop update intervals.
Recommended
Legacy ASIC Prototyping and Emulation
Engineers use the EPF10K100ARC240-3N as an ASIC prototype vehicle for designs in the 50K-100K gate range, where the 4,992 LEs and 12 EABs (24 Kbits of RAM) provide ample capacity to emulate medium-complexity ASICs with embedded SRAM blocks. The -3 speed grade delivers timing margins adequate for 33 MHz PCI or 50 MHz CPU-bus emulation, and the 240-RQFP exposed-pad package simplifies bring-up with standard QFP sockets. Quartus II and MAX+PLUS II flows accept the same VHDL/Verilog that targets the final ASIC, enabling rapid retargeting once silicon is available. Designers can also use the JTAG-based in-system programmability (ISP) for fast design-iteration cycles.
Recommended
Military and Aerospace Single-Board Computers
The EPF10K100ARC240-3N is qualified for legacy military and aerospace single-board computers that require deterministic glue logic between PowerPC/68040 processors, MIL-STD-1553 bus interfaces, and Flash/ SRAM banks. With 189 user I/Os, it can drive the address/data buffering for 32-bit processor buses while providing ChipSelect decoders and wait-state generators. The 0.3 µm CMOS process and 3.3 V core deliver the radiation-tolerance margin that older defense programs require, and the 240-RQFP exposed-pad package simplifies thermal management in conduction-cooled enclosures. Choose the EPF10K100ARI240-3N industrial-temperature variant when -40 °C to +85 °C operation is mandatory.
Recommended
Embedded DSP Pre- and Post-Processing
The EPF10K100ARC240-3N's 12 EABs and 4,992 logic elements provide sufficient capacity for FIR filter pre/post-processing in embedded DSP data paths, complementing a fixed-point DSP processor such as the TMS320C50 or ADSP-218x. EABs implement dual-port RAM coefficient buffers while LEs provide the multiplier array logic for 16-bit fixed-point FIRs at audio sample rates. The 240-RQFP package exposes enough I/Os to fan out to multiple DSP host ports, and the -3 speed grade sustains 100 kHz FIR throughput on 8-channel audio. Use Quartus II FIR Compiler IP to map coefficient sets and exploit the FLEX 10KA architecture's predictable timing closure.
Recommended
Legacy Test and Measurement Instrumentation
The EPF10K100ARC240-3N integrates the timing generator, pattern sequencer, and bus-interface logic in legacy test and measurement instruments such as logic analyzers, oscilloscope acquisition front-ends, and protocol analyzers. Its 189 user I/Os drive high-density probe pods directly, and the 12 EABs implement deep FIFO capture buffers for transient analysis. The multi-voltage I/O (5.0/3.3/2.5 V) interfaces both legacy TTL probe pods and modern 2.5 V ASIC PHYs without level translation. Designers standardize on the FLEX 10KA family because MAX+PLUS II-generated programming files remain bit-compatible across instrument revisions, simplifying field upgrades.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100ARC240-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100ARC240-1 | EPF10K100ARC240-2 | EPF10K100AFC484-2N | EPF10K100ABI356-3 | EPF10K100ABC356-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-RQFP (BFQFP exposed pad) | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 240-RQFP (BFQFP exposed pad) - same | 356-BGA - different package | 356-BGA - different package |
| System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -3 (fastest) | -1 (slowest) | -2 (mid) | -2 (mid) | -3 (fastest) | -2 (mid) |
| On-chip RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Core Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- -3 fastest speed grade in 240-RQFP exposed-pad FLEX 10KA (vs EPF10K100ARC240-1)
- Same silicon as EPF10K100ARC240-3 with lead-free (N-suffix) assembly (vs EPF10K100ARC240-3)
- 240-RQFP exposed-pad package for top-side cooling (vs EPF10K100ARI240-3N)
Design Notes
The EPF10K100ARC240-3N core runs from a 3.3 V VCCINT rail while VCCIO can be tied to 5.0 V, 3.3 V, or 2.5 V depending on the I/O bank. Provide at least 4 decoupling capacitors (0.1 µF ceramic) within 5 mm of each VCCINT/VCCIO pin pair and a 10 µF bulk capacitor at the board entry point. Multi-voltage I/O banks require separate VCCIO pins for each bank; never tie 5 V VCCIO to a 2.5 V-only peripheral bus because the PCI-compliant 5 V tolerance only applies to inputs, not to VCCIO itself.
The 240-RQFP exposed-pad package dissipates heat primarily through the exposed die-attached pad on the bottom of the package. Estimated: with all 4,992 LEs switching at 50 MHz into 189 I/Os, the die consumes approximately 0.5 W-1.0 W. The exposed pad should be soldered to a copper pour (≥ 1 sq inch) on the top layer with thermal vias to inner ground planes. Without this thermal pad soldered, junction temperature can rise 20 °C-30 °C above ambient at full utilization, pushing the 0 °C-to-70 °C commercial range toward its limit.
Place the EPF10K100ARC240-3N's configuration memory (typically an EPC2 or EPC1 configuration device) within 50 mm trace length to minimize DCLK skew. Use 22 Ω series damping resistors on high-fanout clock outputs (e.g., global clock nets driving ≥ 8 LABs) to control simultaneous switching noise (SSN) on the 189 user I/Os. Keep at least 4 PCB layers with a continuous ground plane adjacent to the FPGA to provide low-impedance return paths for the 5 V-tolerant I/O signals.
Do not confuse the EPF10K100ARC240-3N with the EPF10K100ARI240-3N: although both are FLEX 10KA devices with 4,992 LEs and 240 pins, the RQFP exposed-pad pinout and commercial temperature grade of the ARC240 variant differ from the RQFP non-exposed-pad pinout and industrial temperature grade of the ARI240 variant. Substituting one for the other requires PCB rework. Also, do not exceed the 3.3 V VCCINT maximum; the legacy FLEX 10KA family is not 5 V-tolerant on the core supply.
Compliance Information
Trailing 'N' suffix indicates Pb-free (lead-free) assembly finish, consistent with RoHS intent. RoHS/REACH compliance status not explicitly stated in the verified web data; [DATA_NEEDED: full RoHS / REACH / halogen-free documentation]. FLEX 10KA family is commercial-temperature grade (0 °C to 70 °C) and not AEC-Q100 qualified - not recommended for new automotive designs.
