EPF10K100BFC256-3 - FLEX 10KE FPGA 100K Gates | Intel / Altera
MPN: EPF10K100BFC256-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $90.09 | $90.09 |
| 10 | $81.5 | $815.00 |
| 100 | $72.1 | $7,210.00 |
| 500 | $64.5 | $32,250.00 |
| 1,000 | $58.2 | $58,200.00 |
EPF10K100BFC256-3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (LBs), programmable interconnect, and I/O cells, all of which can be re-programmed in-system via SRAM configuration memory. The FLEX 10KE family combines traditional FPGA logic fabric with on-chip dual-port RAM through Embedded Array Blocks, blurring the boundary between pure logic and memory. The hierarchy in the broader market runs FPGA -> programmable logic -> PLD -> digital semiconductor. This positions the FLEX 10KE as a second-generation embedded-programmable-logic family intended for glue-logic, bus-interface, and modest DSP tasks in the late-1990s/early-2000s design ecosystem.
Key features include a maximum operating frequency of 200 MHz, 4,992 logic elements, 12 embedded array blocks providing 24,576 RAM bits, a maximum of 406 user I/O pins via the FBGA package, and on-chip JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990. The device also supports 5.0-V PCI Local Bus Specification Rev. 2.2 compliance at 33 MHz for -1 speed grade devices, and 3.3-V PCI compliance for other speed grades. The SRAM-based configuration memory means the device must be configured at every power-up from an external EEPROM or microcontroller.
Architecturally, the FLEX 10KE combines a logic array fabric organized into Logic Array Blocks (LABs), each containing ten LEs, with embedded array blocks that can be configured as wide RAM or ROM. FastTrack interconnect provides horizontal/vertical routing between rows and columns of LABs, and a per-pin I/O element supports tri-state buffers and registers. The 0.22 µm process delivers 200 MHz performance while supporting the 2.5-V core supply.
Typical applications include PCI bus interface cards, telecommunications glue logic, industrial control boards, embedded system I/O expansion, and legacy design re-spins. The 256-pin FBGA package provides ample I/O for high-pin-count bus interfaces. When designing with this FPGA, ensure that the configuration memory source (typically an EPC2 or EPC1 configuration device) is correctly specified, and confirm that the Quartus design software (or legacy MAX+PLUS II for older FLEX designs) supports the FLEX 10KE family for the targeted compile flow. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K100BFC256-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100BFC256-3 (same form factor and footprint) — differing in Process Technology, Speed Grade, Package, Operating Temperature, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100BFC256-2
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K100BFC256-1
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EPF10K100AFC484-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$152 / Unit
View Datasheet →EPF10K100ARI240-3N
✅ Drop-In✓ In Stock
$86.4 / Unit
View Datasheet →EPF10K100ARC240-3N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EPF10K100ABC356-2
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EPF10K100BFC256-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gates | 100,000 |
| Logic Elements (LEs) | 4,992 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V (range 2.3 V to 2.7 V) |
| Speed Grade | -3 |
| Package | 256-pin FineLine BGA (FBGA) |
| Operating Temperature Range | 0 °C to 70 °C |
| Configuration Method | SRAM, requires external config device |
| JTAG Boundary Scan | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| Mounting Type | Surface Mount (BGA) |
EPF10K100BFC256-3 256-pin fineline bga (fbga) Pin Configuration Guide
Pin configuration for EPF10K100BFC256-3 (256-pin fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100BFC256-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100BFC256-3 is suitable for 7 applications: PCI 33 MHz Bus Interface Card, Industrial Control and Factory Automation Backplane, Telecommunications Glue Logic and Protocol Bridge, Legacy Embedded System I/O Expansion, Test and Measurement Instrumentation Front-End, Aerospace and Defense Legacy Avionics Bridge, Medical Imaging Front-End Processing.
PCI 33 MHz Bus Interface Card
The EPF10K100BFC256-3 is well-suited for legacy 33 MHz 3.3-V PCI add-in cards where PCI Local Bus Specification Rev. 2.2 compliance is required. Its 256-ball FBGA package exposes ample user I/O to break out the 32-bit/64-bit PCI bus plus side-band signals (REQ#, GNT#, FRAME#, IRDY#, TRDY#, etc.) without multiplexing. The 4,992 LEs deliver sufficient logic for typical bus-target state machines, address decoding, and FIFO control. The on-chip dual-port RAM (24,576 bits across 12 EABs) supports scatter-gather descriptor tables and command queuing. Designed in with Quartus MAX+PLUS II legacy flows and paired with the EPC2 configuration EEPROM, it remains a familiar solution for industrial backplane and test-instrument cards that must match existing BOMs.
Recommended
Industrial Control and Factory Automation Backplane
In factory automation and process-control systems, the EPF10K100BFC256-3 serves as glue-logic, bus arbiter, or custom protocol bridge between PLC backplanes and I/O modules. Its 4,992 LEs provide sufficient capacity for proprietary fieldbus interfaces, custom serial protocols, and timing-critical interrupt controllers. The 0 °C to 70 °C operating range suits cabinet-mounted industrial environments. The 256-ball FBGA supports the high I/O count needed to break out parallel backplane data plus several UART/SPI/I2C channels. Engineers can implement deterministic control loops in the FPGA fabric while offloading simple tasks to microcontrollers, keeping the BOM compact.
Recommended
Telecommunications Glue Logic and Protocol Bridge
The EPF10K100BFC256-3 is widely deployed in telecom equipment as a glue-logic and protocol-bridge device, where it interfaces between legacy TDM buses, framers, and modern packet processors. The 12 embedded array blocks provide dual-port RAM for elastic FIFOs, hit/miss counters, and small lookup tables used in cell/packet header processing. With 200 MHz Fmax, the device handles TDM/E1/T1 stream aggregation and HDLC controllers without external logic. The FBGA-256 package supports the high fan-out required to connect multiple telecom ASICs while keeping signal integrity manageable on standard FR-4 stack-ups.
Recommended
Legacy Embedded System I/O Expansion
For embedded systems requiring custom I/O expansion, the EPF10K100BFC256-3 provides flexible parallel bus interfaces, PWM generators, quadrature encoder counters, and timer blocks that offload real-time tasks from the main MCU/MPU. The on-chip RAM (24,576 bits) supports small lookup tables and DSP coefficient memory, useful for motor-control feedback loops. Engineers frequently pair the FLEX 10KE with PowerPC or ARM host processors via the local bus, offloading deterministic I/O tasks to the FPGA while the host runs the application stack. The SRAM-based configuration allows field firmware upgrades.
Recommended
Test and Measurement Instrumentation Front-End
Test-and-measurement instruments such as logic analyzers, protocol exercisers, and custom ATE fixtures benefit from the EPF10K100BFC256-3's high-I/O count and dual-port on-chip RAM. The device can implement custom trigger sequencers, pattern generators, and time-stamping logic alongside high-speed parallel data acquisition. Its 200 MHz capability suits 100 MHz-class digital capture with 2x oversampling, while the EAB-based RAM captures pre-trigger samples. The 256-ball FBGA package breaks out enough channels for 32-bit-wide data plus extensive control signals, all while maintaining signal integrity on carefully controlled impedance traces.
Recommended
Aerospace and Defense Legacy Avionics Bridge
In long-lifecycle aerospace and defense programs, the EPF10K100BFC256-3 continues to serve as a qualified-design FPGA where re-spinning the PCB and re-qualifying a new part is cost-prohibitive. Its MIL-STD-454 compliance and rugged temperature variants support avionics buses such as MIL-STD-1553, ARINC 429, and custom discrete interfaces. The 4,992 LEs accommodate complete bus-interface cores plus protocol state machines, while the 12 EABs hold small lookup tables for message filtering. Although obsolete for new designs, the part remains available through defense-procurement channels for sustainment programs.
Recommended
Medical Imaging Front-End Processing
Medical imaging front-end boards (ultrasound, patient monitoring) historically used the EPF10K100BFC256-3 for beamforming, channel multiplexing, and timing generation. The on-chip dual-port RAM enables line-buffer memory for ultrasound channel summing, while the 200 MHz fabric handles multiplexer and timing-control logic. The 256-ball FBGA provides sufficient I/O for parallel ADC data capture (8-16 channels at 10-12 bits) plus downstream DSP links. Designers in this space match the FLEX 10KE's deterministic timing to medical-imaging latency requirements, which are easier to verify on established silicon than on newer FPGA families.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100BFC256-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100BFC256-2 | EPF10K100BFC256-1 | EPF10K100AFC484-2N | EPF10K100ARI240-3N | EPF10K100ARC240-3N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-ball FBGA (BFC256) | 256-ball FBGA (BFC256) - same | 256-ball FBGA (BFC256) - same | 484-ball FBGA - larger | 240-pin RQFP - different | 240-pin RQFP - different |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Speed Grade | -3 | -2 (faster) | -1 (fastest) | -2 | -3N | -3N |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C | 0 °C to 70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1) | $90.09 | $80-100 (aftermarket) | $95-120 (aftermarket) | $70-90 (aftermarket) | $40-60 (aftermarket) | $40-60 (aftermarket) |
Key Differentiators
- BFC256 package variant supports highest I/O count in FLEX 10KE family (vs EPF10K100ARI240-3N)
- -3 speed grade offers lowest cost within FLEX 10KE family (vs EPF10K100BFC256-1)
- Compatible configuration with all other FLEX 10KE packages (vs EPF10K100ABC356-2)
- 12 embedded array blocks provide 24,576 bits of dual-port RAM (vs Smaller FLEX 10K30/50 family)
Design Notes
Estimated: Core 2.5 V supply current for the EPF10K100BFC256-3 ranges from ~50 mA (static, no I/O toggling) to ~500 mA (typical 100 MHz operation, 50% toggle). I/O bank current (VCCIO at 3.3 V) depends on switching frequency and load - budget 1-2 mA per toggling pin into a 50 pF load at 100 MHz. Decoupling: place 0.1 µF X7R ceramics within 5 mm of every VCCINT and VCCIO ball, plus bulk 10-47 µF tantalum near the package. Power sequencing: VCCINT must reach 2.3 V before VCCIO exceeds 3.6 V; failure to sequence correctly can latch-up the I/O cells.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, requiring either 4-layer PCB with microvia-in-pad (laser-drilled stacked vias) or 6-layer PCB with dog-bone fanout. Each BGA ball should connect to a via-in-pad or a short dog-bone trace (≤2 mm). Maintain continuous ground plane on layer 2 beneath the BGA for return-current continuity and thermal spreading. Use 50 Ω controlled-impedance traces (≈4 mil wide on standard FR-4) for clock inputs (CLK0/CLK1) and global signals. Reference designators and recommended escape routing are documented in the FLEX 10KE Hardware Reference Guide.
Common pitfalls with the EPF10K100BFC256-3: (1) Forgetting that the device is SRAM-based - configuration is lost on power-down, requiring an external EPC1/EPC2 configuration EEPROM or microcontroller boot. (2) Driving JTAG TCK faster than 10 MHz can violate IEEE 1149.1 timing - keep TCK ≤10 MHz for chain integrity. (3) Mixing VCCIO banks at 3.3 V and 5.0 V on adjacent banks without isolation can cause bus contention; group pins by I/O standard. (4) Using -3 speed grade in a design that requires -1 timing margins (5V PCI) will fail PCI compliance - check the datasheet speed-grade table. (5) Configuring the device with a Quartus version newer than the last FLEX 10KE-supported release (Quartus 13.0) will not synthesize - use legacy MAX+PLUS II or Quartus 9.1/13.0.
The EPF10K100BFC256-3 supports multiple configuration schemes: passive serial (PS) from an EPC1/EPC2 EEPROM (most common), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG-based configuration. For production, pair with an EPC2LC20 in PS mode; this provides 1,695,008 configuration bits of storage (sufficient for the EPF10K100BFC256-3's bitstream) and supports in-system updates via JTAG. Add a 4.7 kΩ pull-up on nCONFIG and a 4.7 kΩ pull-up on nSTATUS to ensure clean boot. The CONF_DONE pin should also have a 4.7 kΩ pull-up. During configuration, hold all user I/O in tri-state via the DEV_OE pin if external bus contention is possible.
Estimated: The EPF10K100BFC256-3 in FBGA-256 has theta_JA ≈ 18 °C/W (with 1 oz copper ground plane on a 4-layer JEDEC test board) and theta_JC ≈ 0.5 °C/W. At maximum toggle activity (200 MHz internal, all I/O switching into 25 pF), power dissipation is ≈ 1.5-2.0 W, yielding a junction temperature rise of 27-36 °C above ambient - well within the 0 °C to 70 °C commercial range. For continuous operation above 70 °C ambient, consider airflow or downgrading to lower toggle activity. Industrial (-I) and military (-M) temperature grades exist for harsher environments.
Compliance Information
EPF10K100BFC256-3 was designed and shipped in the late 1990s/early 2000s; RoHS and REACH compliance data is not present in the verified web sources and would require consulting the original Altera/Intel material declaration. The part is obsolete for new designs but may still be available through authorized distributors stocking remaining inventory. AEC-Q100 is not applicable to FPGAs of this generation.
