EPF10K100AFC484-2N - 100K Gates FLEX 10KA FPGA 484-FBGA | Altera
MPN: EPF10K100AFC484-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $152 | $76,000.00 |
EPF10K100AFC484-2N Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of in-system programmability. FPGAs occupy the middle ground between simple PLDs/CPLDs and ASICs, allowing engineers to implement complex combinational and sequential logic, soft microcontrollers, and high-speed datapath functions in a single IC. The FLEX 10KA family introduced embedded array blocks (EABs) that double as on-chip RAM or ROM, enabling System-on-a-Programmable-Chip (SOPC) integration. This positions the EPF10K100AFC484-2N in the hierarchical taxonomy: FPGA -> programmable logic device -> digital IC -> semiconductor.
Key features include 624 Logic Array Blocks (LABs), 12 embedded array blocks (EABs), and propagation delays as low as 0.6 ns. The device provides tri-state buffers on every I/O pin, supports PCI-compliant I/O standards at 33 MHz, and offers configurable JTAG-based in-system programmability through the IEEE 1149.1 boundary-scan interface. The 484-pin FBGA (23 x 23 mm) package with 1.0 mm ball pitch supports high-density board layouts while remaining compatible with standard surface-mount assembly.
The architecture pairs a continuous interconnect network of FastTrack rows and columns with the embedded array blocks, giving designers simultaneous access to fine-grained logic and large memory structures. The -2 speed grade places the device in the mid-performance tier of the FLEX 10KA line, balancing timing margin against cost in commercial (0 °C to 70 °C) operating environments. Pin-to-pin delays through the FastTrack interconnect are deterministic, simplifying static timing closure for synchronous designs.
Typical applications include telecommunications line cards, industrial control and factory automation backplanes, test and measurement instrumentation, glue logic replacement, and PCI bus interfaces. The combination of high gate count, 369 user I/Os, and on-chip memory blocks suits bus-bridging, protocol conversion, and small DSP datapath tasks.
When designing with this part, plan power sequencing carefully - the FLEX 10KA family requires VCCINT to be stable before VCCIO ramps. Use the Altera MAX+PLUS II or Quartus (legacy support) toolchain for synthesis, fitting, and programming, and verify BSDL files against the device's JTAG ID for production test.
This page synthesizes distributor stock data, drop-in and package-compatible alternatives, and design notes compiled from the FLEX 10KA datasheet and Altera application notes - information not bundled together in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K100AFC484-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100AFC484-2N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Series, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC484-2N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100AFC484-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100AFC484-2
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EPF10K100AFC484-1
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EFC484-3
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K100AFC484-2N Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KA |
| Family | FLEX 10KA (FLEX-10KA) |
| Logic Cells / Elements | 4992 |
| Equivalent Gate Count | 100000 |
| Number of Logic Array Blocks (LABs) | 624 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24576 (from 12 EABs) |
| User I/O Pins | 369 |
| Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch) |
| Supply Voltage (VCCINT/VCCIO) | 3.0 V to 3.6 V |
| Process Technology | 0.30 µm CMOS |
| Speed Grade | -2 (mid performance) |
| Propagation Delay | 0.6 ns |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Mounting Type | Surface Mount |
| Internal Memory Type | EAB (RAM/ROM block) |
| JTAG Support | IEEE 1149.1 boundary scan |
| PCI Compliance | PCI 33 MHz compliant I/O available |
| Lead Free / RoHS | Refer to distributor data - FLEX 10KA generation often non-RoHS |
| Programming Toolchain | MAX+PLUS II / Quartus legacy support |
EPF10K100AFC484-2N 484-fbga (23 x 23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EPF10K100AFC484-2N (484-fbga (23 x 23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100AFC484-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100AFC484-2N is suitable for 6 applications: Telecommunications Line Cards, PCI Bus Interface and Bridging, Industrial Control and Factory Automation Backplanes, Test and Measurement Instrumentation, Glue Logic Consolidation, Legacy Defense and Avionics Retrofit.
Telecommunications Line Cards
The EPF10K100AFC484-2N fits telecommunications line card designs because it delivers 100K gates of glue logic, 369 user I/Os to aggregate multiple low-speed serial channels, and 12 EABs (24,576 bits) for small on-chip FIFOs and lookup tables. Place it between the framer ASIC and the backplane SERDES to perform channelized protocol conversion, idle-frame insertion, and per-channel policing at line rates up to 155 Mbps. The -2 speed grade (0.6 ns LE delay) is comfortable for 33 MHz PCI bus interfaces and for H.110 CT bus glue logic common in legacy CompactPCI designs.
Recommended
PCI Bus Interface and Bridging
Use the EPF10K100AFC484-2N to implement a 33 MHz or 66 MHz PCI target interface plus a secondary local bus bridge (e.g., PCI-to-ISA or PCI-to-VME). The device is PCI-compliant at 33 MHz across the 369 user I/Os, providing enough margin for hot-swap control, interrupt steering, and I/O expansion. The 12 EABs supply distributed RAM for transaction buffers and configuration headers (256-byte PCI config space fits comfortably in EABs), eliminating an external SRAM. The 0.6 ns LUT delay plus FastTrack interconnect keeps register-to-register paths well under the 30 ns PCI 33 MHz clock period.
Recommended
Industrial Control and Factory Automation Backplanes
The EPF10K100AFC484-2N is well suited to factory automation backplane controllers because it provides 100K gates of deterministic logic with 369 I/Os that can sink/source 24 mA per pin, driving backplane transceivers directly. Use it to implement fieldbus bridges (Profibus, CAN, DeviceNet glue logic), encoder counters, and safety interlocks. The 12 EABs handle small PID controller tables and lookup-based setpoint generators. Industrial designers value the FLEX 10KA generation for its long lifecycle support and abundant application notes covering 24 V industrial environments.
Recommended
Test and Measurement Instrumentation
Instrument manufacturers rely on the EPF10K100AFC484-2N to build timing generators, pulse-pattern sequencers, and protocol analyzers with up to 369 channels of stimulus or capture. The 12 EABs provide on-chip pattern memory; with 2,048 bits per EAB, designers can store 24 K samples of stimulus data without an external SRAM. The -2 speed grade comfortably sequences 100 MHz pattern rates, and the JTAG interface (IEEE 1149.1) supports boundary-scan on assembled PCBs for production test. The 484-FBGA 23 x 23 mm footprint fits standard instrument mezzanine cards.
Recommended
Glue Logic Consolidation
The EPF10K100AFC484-2N replaces 20-30 discrete 74-series logic packages by integrating all board-level glue logic in a single 484-FBGA. Use it to consolidate address decoding, bus arbitration, interrupt steering, and reset sequencing on legacy CPU boards (e.g., 68K, PowerPC 6xx, or x86 companion logic). The 100K gates are overkill for pure glue logic but the EABs allow embedding boot ROM and reset vector tables, replacing a separate EPROM. For cost-sensitive designs the EPF10K50VBC356-2 (50K gates, 356-BGA) is a smaller-footprint option when pin count permits.
Recommended
Legacy Defense and Avionics Retrofit
Defense and avionics programs that originally qualified the FLEX 10KA family continue to procure the EPF10K100AFC484-2N for spare-parts and form-fit-function replacement of failed boards. The -2 speed grade and 0 °C to 70 °C commercial temperature range match original equipment designs; military variants (EPF10K100BFC484-2N) cover -55 °C to +125 °C operation. Aftermarket brokers and Rochester Electronics provide ongoing supply under DMSMS (Diminishing Manufacturing Sources and Material Shortages) programs. Pin-compatible FLEX 10KE variants (EPF10K100EFC484-2N) are accepted by most retrofit programs because the ballmap is identical.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100AFC484-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC484-2N | EPF10K100AFC484-3 | EPF10K100AFC484-2 | EPF10K100AFC484-1 | EPF10K100EFC484-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-FBGA (23x23 mm) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Family | FLEX 10KA | FLEX 10KE | FLEX 10KA | FLEX 10KA | FLEX 10KA | FLEX 10KE |
| Equivalent Gate Count | 100K | 100K | 100K | 100K | 100K | 100K |
| Speed Grade | -2 | -2 | -3 (faster) | -2 | -1 (slower) | -3 (faster) |
| Core Voltage | 3.3 V (3.0-3.6 V) | 2.5 V (FLEX 10KE) | 3.3 V | 3.3 V | 3.3 V | 2.5 V |
| User I/Os | 369 | 369 | 369 | 369 | 369 | 369 |
| LE / Logic Cell Count | 4992 | 4992 | 4992 | 4992 | 4992 | 4992 |
| Embedded Array Blocks (EABs) | 12 (24 Kbit) | 12 (larger in 10KE) | 12 | 12 | 12 | 12 (larger) |
| Lifecycle Status | Obsolete (Last Time Buy) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) |
Key Differentiators
- Highest-density FLEX 10KA member with 369 user I/Os (vs EPF10K50VBC356-2)
- Pin-compatible migration path to FLEX 10KE 2.5 V core (vs EPF10K100EFC484-2N)
- Speed grade flexibility (-1/-2/-3) within same ballmap (vs EPF10K100AFC484-3)
Design Notes
The FLEX 10KA family requires VCCINT (3.3 V) to be stable before VCCIO ramps during power-up; violating this sequence can cause latch-up. According to the FLEX 10KA datasheet, in-rush current during configuration can reach 500 mA peak, so decouple every VCCIO/VCCINT ball with a 0.1 µF X7R ceramic placed within 5 mm of the ball, and add a 47 µF tantalum bulk capacitor near the package. In-rush current scales with the number of user I/Os switching simultaneously; gate outputs that drive large buses with staggered enables to limit di/dt.
The 484-FBGA 23 x 23 mm package uses 1.0 mm ball pitch, which requires 0.5 mm via capture pads on a 4-layer PCB with 0.5 oz copper. Fan-out uses dog-bone vias on the top layer to break out to 0.127 mm (5 mil) trace and space; 6-layer stackups can route directly between balls. Match all four inner-layer reference planes (GND/VCC) to maintain 50 Ω controlled impedance on critical clocks. The FLEX 10KA JTAG pins (TCK/TMS/TDO/TDI) should be pulled to known states - TCK and TMS require 1 kΩ pull-ups to VCCIO, TDO is high-Z.
Do not assume a 5 V-tolerant I/O on FLEX 10KA: the device uses 3.3 V LVTTL/LVCMOS and 5 V inputs require external clamping or resistor dividers. Do not omit the configuration PROM (EPC2, EPC4, EPC8, or EPC16) - SRAM-based FPGAs lose configuration at every power-down. Do not confuse the FLEX 10KA EPF10K100AFC484-2N with the FLEX 10KE EPF10K100EFC484-2N - the 10KE core voltage is 2.5 V and substituting the wrong part will destroy the device. Always verify the JTAG ID (Altera manufacturer ID 0x020F) before programming on the production line.
Place the configuration PROM (EPC2/EPC4/EPC8/EPC16) within 50 mm of the FLEX 10KA data pins (DATA0..DATA7) to keep passive-serial configuration timing inside spec. Route the 8-bit DATA bus with matched lengths (delta < 5 mm) and isolate from switching signals with a guard trace tied to GND. Place the JTAG chain header on the board edge for in-system programming access. For multi-FPGA designs, daisy-chain TMS/TCK through all devices and provide a separate TDI/TDO path; the Quartus software can generate BSDL files for boundary-scan test.
Compliance Information
RoHS status for EPF10K100AFC484-2N is lot-dependent because the FLEX 10KA generation predates the RoHS directive. Some Rochester Electronics re-releases are lead-free; verify with distributor. Not AEC-Q100 qualified - commercial temperature grade only.
