EPF10K100ARI240 - FLEX 10KA FPGA 100K Gates | Intel / Altera
MPN: EPF10K100ARI240 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78 | $780.00 |
| 100 | $70 | $7,000.00 |
| 250 | $64 | $16,000.00 |
| 500 | $58 | $29,000.00 |
EPF10K100ARI240 Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a sea of configurable logic blocks, programmable interconnect, and dedicated I/O cells on a single piece of silicon. The FLEX 10KA family specifically embeds an array of embedded array blocks (EABs) used to implement megafunctions such as efficient memory and specialized logic functions, alongside the logic array used for general logic. This makes the EPF10K100ARI240 part of the System-on-a-Programmable-Chip (SOPC) integration tier introduced by Altera in the late 1990s.
Key features of the EPF10K100ARI240 include 189 user I/O pins (with the remaining pins used for power, ground, JTAG, and configuration), 624 logic array blocks (LABs), and up to 12 EABs providing a total of 24,576 bits of on-chip RAM (2,048 bits per EAB). The device supports multi-voltage I/O operation, allowing the I/O bank supply to be set independently from the core supply. Pin-compatibility across the FLEX 10KA family simplifies board migration between logic densities.
Architecturally, the EPF10K100ARI240 uses a 0.3 µm CMOS SRAM process with four-input look-up tables (LUT4) per LE, dedicated carry chain for fast adders, and a cascade chain for wide fan-in functions. The LUT-based architecture gives each LE the ability to implement any four-input Boolean function, while adjacent LABs share local interconnect for predictable timing closure on datapath logic. The device is configured at power-up from a serial PROM or via JTAG, with configuration data stored in SRAM cells.
Typical applications include telecommunications line cards, industrial control logic, glue logic in microprocessor systems, custom interface bridging (e.g., legacy parallel buses to high-speed serial), and prototyping of ASIC designs before mask production. The 240-pin RQFP footprint is widely supported by low-cost PCB assembly lines, making the EPF10K100ARI240 an economical choice for legacy and long-lifecycle industrial designs.
When designing with this part, engineers should budget for the external configuration PROM (EPC1, EPC2, or compatible), decouple all VCCINT and VCCIO pins with 0.1 µF and 10 µF capacitors, and route the JTAG chain (TCK, TMS, TDI, TDO) with controlled impedance to avoid programming errors. The exposed thermal pad on the RQFP-240 must be soldered to the ground plane for thermal relief.
This page consolidates distributor availability, JTAG programming guidance, drop-in FLEX 10KA alternatives, and lifecycle status information not always presented together on a single manufacturer page.
Drop-in alternatives for EPF10K100ARI240 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100ARI240 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Propagation Delay, Speed Grade, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100ARC240-3N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EPF10K100ARC240-2
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EPF10K100ARC240-1
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EPF10K200SRC240-1X
✅ Drop-In✓ In Stock
$540 / Unit
View Datasheet →EPF10K100ARI240 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KA |
| Typical Gates | 100,000 |
| Logic Elements (LEs) | 4,992 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| On-chip RAM | 24,576 bits (2,048 bits per EAB) |
| User I/O | 189 |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V (nominal 3.3 V) |
| Process Technology | 0.3 µm CMOS SRAM |
| Package | 240-RQFP (PowerQuad Flat Pack, exposed pad) |
| Configuration Interface | IEEE 1149.1 JTAG, ByteBlasterMV, BitBlaster |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Propagation Delay | 0.8 ns (per Ampheo listing) |
EPF10K100ARI240 240-rqfp (powerquad flat pack, exposed pad) Pin Configuration Guide
Pin configuration for EPF10K100ARI240 (240-rqfp (powerquad flat pack, exposed pad) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100ARI240.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100ARI240 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control Logic, Legacy Microprocessor Glue Logic, Custom Interface Bridging, ASIC Prototyping, Military and Aerospace Refurbishment.
Telecommunications Line Cards
The EPF10K100ARI240 suits legacy telecommunications line-card designs requiring custom protocol handling at modest clock rates up to 100 MHz. Its 4,992 LEs and 12 EABs (24,576 bits of RAM) provide enough logic density for HDLC framing, ATM segmentation-and-reassembly, and proprietary PHY interfaces without needing an external ASIC. The industrial temperature grade (-40 °C to +85 °C) is appropriate for central-office and outside-plant deployments where commercial parts would be unreliable. The 240-RQFP footprint remains in production on telecom backplanes designed before the migration to BGA packages, so this part continues to populate long-lifecycle line-card designs. Engineers should pair the FPGA with an EPC2 or EPC4 configuration PROM and route JTAG for in-field firmware updates.
Recommended
Industrial Control Logic
Factory-automation controllers using the EPF10K100ARI240 benefit from its 189 user I/O pins and 3.3 V tolerant I/O banks, which can interface directly to 24 V opto-isolated industrial sensors via simple resistor dividers. The 624 LABs provide ample headroom for state-machine-based motion-control logic, PID loops, and fieldbus bridges (Profibus, Modbus, or CAN). Its industrial temperature range ensures reliable operation in factory-floor enclosures where ambient temperatures can exceed 60 °C. Long-term availability through excess distributors is critical for industrial OEMs whose products have 10-20 year lifecycle requirements; the FLEX 10KA family has stable, mature tooling under the legacy Altera Quartus II design software (now supported as MAX+PLUS II baseline) that does not require expensive tool upgrades.
Recommended
Legacy Microprocessor Glue Logic
The EPF10K100ARI240 was widely deployed as glue logic between legacy microprocessors (Motorola 68000, Intel 8086, PowerPC 603) and their peripheral chipsets, replacing dozens of 74-series TTL parts with a single programmable device. Its 0.3 µm CMOS SRAM fabric provides nanosecond pin-to-pin delays suitable for memory-mapped peripheral decoding, wait-state generation, and bus-cycle extension logic. The 24,576 bits of embedded RAM are sufficient for FIFO buffers between mismatched bus widths. For boards where the FPGA must emulate a missing or obsolete peripheral, the FLEX 10KA's deterministic interconnect gives engineers a known-bad-or-good debugging boundary that discrete TTL could not offer.
Recommended
Custom Interface Bridging
Designers use the EPF10K100ARI240 to bridge between legacy parallel buses (ISA, VME, PCI) and modern high-speed serial links (LVDS, SPI, I2C) when off-the-shelf bridge ICs are unavailable or too costly in low volumes. The 189 user I/O pins support up to 47 LVDS pairs (94 pins) for multi-channel serial bridging, while the remaining I/Os handle parallel bus protocols. The on-chip EABs implement dual-port RAM for packet buffering at interface crossings. This application often pairs the FPGA with an external PHY or serializer, with the FLEX 10KA providing the protocol-conversion logic in a single, reprogrammable device.
Recommended
ASIC Prototyping
Before committing an ASIC design to mask production, engineers prototyped logic on the EPF10K100ARI240 to validate Verilog or VHDL code, verify timing closure, and run real-world firmware. Its 100,000-gate capacity and EAB-based embedded memory are sufficient to model sub-blocks of larger ASICs, and the JTAG interface allows iterative reprogramming within minutes. The 240-RQFP package is hand-solderable for prototype boards and easy to socket for burn-in testing. Many of the FLEX 10KA design flows used the same MAX+PLUS II synthesis backend as Altera's ASIC service, giving early-stage prototypes high correlation with the eventual silicon. Although the family is obsolete today, it remains in active use for niche military, aerospace, and industrial refurbishment programs.
Recommended
Military and Aerospace Refurbishment
Long-lifecycle military and aerospace programs (avionics retrofits, radar signal processing, secure communications) continue to use the EPF10K100ARI240 because the original system design is certified against this specific FPGA, and re-certifying a new part would cost more than stocking the legacy component for the program's remaining life. The industrial temperature grade and proven reliability of the mature 0.3 µm CMOS process make the part suitable for MIL-STD-810 environments when properly qualified by the program integrator. Distributors specializing in military and aerospace supply chains (such as Heisener) carry screened EPF10K100ARI240 inventory with traceability documentation, lot date codes, and per-part inspection records required by defense procurement specifications.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100ARI240 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100ARC240-3N | EPF10K100ARC240-2 | EPF10K100ARC240-1 | EPF10K200SRC240-1X |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 240-RQFP | 240-RQFP (same) | 240-RQFP (same) | 240-RQFP (same) | 240-RQFP (same) |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 200,000 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Speed Grade | A (suffix -3N equivalent speed) | -3N | -2 (slower) | -1 (slowest) | -1X |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade in FLEX 10KA family with 240-RQFP package (vs EPF10K100ARC240-3N)
- 100K-gate density in 240-RQFP with 189 user I/Os (vs EPF10K200SRC240-1X)
- Mature 0.3 µm CMOS SRAM process with multi-voltage I/O support (vs EPF10K100AFC484-2N)
Design Notes
The EPF10K100ARI240 requires separate decoupling for VCCINT (core) and VCCIO (I/O banks). Place one 0.1 µF ceramic capacitor per VCCINT pin and one 10 µF tantalum or ceramic bulk capacitor per power plane. VCCIO must be brought up simultaneously with or before VCCINT to avoid latch-up. For multi-voltage designs, route independent power planes for each VCCIO bank and avoid mixing 5 V-tolerant and 3.3 V peripherals on the same bank.
The 240-RQFP package has a 0.5 mm terminal pitch with gull-wing leads. Recommended PCB land pattern per Altera application note uses 0.30 mm × 1.50 mm pads with 0.10 mm solder-mask dams. The exposed thermal pad on the bottom of the package should be soldered to a 6 mm × 6 mm copper land connected to the ground plane for thermal dissipation, especially when operating at elevated ambient temperatures.
The FLEX 10KA family uses volatile SRAM configuration, so the FPGA loses its configuration when power is removed. A non-volatile configuration PROM (EPC1, EPC2, EPC4, or EPC8) is mandatory for stand-alone operation. JTAG chain length must not exceed the IEEE 1149.1 specification limits, and unused JTAG pins (TCK, TMS) should be pulled up or down per the datasheet to prevent spurious configuration starts. The nCONFIG pin must see a clean rising edge at power-up; if the host processor drives nCONFIG manually, ensure the rise time is below 1 µs.
When routing 189 user I/Os off a 240-RQFP, escape channels become congested on inner PCB layers. Use via-in-pad or blind-via technology to maintain signal integrity on high-speed signals. Differential pairs (LVDS) must be length-matched to within 100 mils and routed with controlled 100 Ω differential impedance. JTAG chain signals should be kept short (under 50 mm) and isolated from high-speed switching signals to avoid programming errors.
Compliance Information
RoHS, REACH, and lead-free status not explicitly stated in the provided verified web data. The part is from the 1990s FLEX 10KA family, when RoHS compliance was not yet a standard industry requirement. Engineers should request a Certificate of Compliance from the distributor when ordering for RoHS-regulated markets.
