EPF10K100EFI256-2 - FLEX 10KE FPGA 100K Gates 250MHz 256FBGA | Intel
MPN: EPF10K100EFI256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EPF10K100EFI256-2 Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of an ASIC with the flexibility of in-field reprogrammability. Hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Within the FPGA taxonomy, the FLEX 10KE family sits at the high-density end of the SRAM-based segment, featuring embedded array blocks (EABs) that allow memory functions (RAM, ROM, FIFO) to be efficiently distributed across the fabric alongside the logic array blocks (LABs). This hybrid embedded/logic architecture predates modern SoC FPGAs but was groundbreaking for its era as one of the first SOPC-capable platforms.
Key features of the EPF10K100EFI256-2 include 624 LABs organized across 4,992 logic cells, 12 embedded array blocks (EABs) providing up to 24 Kbits of distributed RAM, 191 usable I/O pins supporting multiple I/O standards including 3.3 V LVTTL and LVCMOS, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programming (ISP) via the serial passive configuration scheme and is supported by the Altera Quartus and MAX+PLUS II design toolchains.
The EPF10K100EFI256-2 is fabricated on a 0.22 µm four-layer metal CMOS process and uses a 2.5 V core supply with 3.3 V tolerant I/O. The architecture separates logic resources (LABs) from memory resources (EABs), enabling efficient implementation of glue logic, state machines, register-intensive datapaths, and small memory blocks in a single device. The 256-ball FineLine BGA package uses a 1.0 mm ball pitch and a 17 x 17 mm body suitable for high-density surface-mount designs.
Typical applications for the EPF10K100EFI256-2 include telecommunications interface bridging, industrial control logic, glue logic replacement for ASIC prototypes, and legacy system re-engineering where the FLEX 10KE family has been deployed for two decades. Engineers use this part when modernizing an existing FLEX-based design without re-laying out the PCB, or when the proven SOPC architecture is sufficient for the application.
When designing with this device, ensure that the configuration EEPROM and JTAG chain match the chosen configuration mode (PS, AS, or JTAG). The 2.5 V core requires careful power-rail sequencing relative to the 3.3 V I/O supply, and decoupling capacitors must be placed close to the FBGA balls to mitigate simultaneous switching noise on the high-density I/O banks.
This page synthesizes distributor pricing, SameFrame pin-compatible migration paths, and practical design considerations specific to the FLEX 10KE family not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K100EFI256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EFI256-2 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Logic Family, Logic Elements / Cells.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC256-2
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EPF10K100EFC256-2X
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →EPF10K100EFC256-3
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF10K100EFC256-3N
✅ Drop-In✓ In Stock
$49.2 / Unit
View Datasheet →EPF10K130EFC256-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K50EFC256-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K100EFI256-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gates | 100,000 |
| Logic Elements / Cells | 4,992 |
| Total RAM Bits | 49,152 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| User I/O Pins | 191 |
| Package | 256-Ball FineLine BGA (FBGA-256) |
| Package Body Size | 17 x 17 mm |
| Ball Pitch | 1.0 mm |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 3.3 V |
| Maximum Toggle Frequency | 250 MHz |
| Propagation Delay | 0.5 ns (typical) |
| Process Technology | 0.22 µm CMOS, 4-layer metal |
| Operating Temperature | 0C to +70C (commercial) |
| Configuration Mode | Passive Serial / JTAG |
| RoHS Status | unknown |
EPF10K100EFI256-2 17 x 17 mm Pin Configuration Guide
Pin configuration for EPF10K100EFI256-2 (17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EFI256-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EFI256-2 is suitable for 6 applications: Telecommunications Interface Bridging, Industrial Control Logic and Glue Logic, Legacy System Re-Engineering and ASIC Prototyping, Datacom and Networking Equipment, Test and Measurement Instrumentation, Aerospace and Defense Legacy Avionics.
Telecommunications Interface Bridging
The EPF10K100EFI256-2 fits telecommunications interface bridging by combining 4,992 logic elements and 49 Kbits of embedded RAM in a single device, enough to bridge between legacy TDM/E1 framers and modern packet-based backplanes. Its 191 user I/Os accommodate multiple interface standards simultaneously, including 3.3 V LVTTL glue logic to PHYs and DSPs. The 250 MHz toggle rate supports 155 Mbps POS-PHY or parallel RapidIO bridging without timing closure pain. The industrial temperature variant (the I suffix) handles outdoor cabinet deployments from -40C to +85C. Power sequencing between the 2.5 V core and 3.3 V I/O requires careful ramp ordering during system bring-up to avoid in-rush latch-up.
Recommended
Industrial Control Logic and Glue Logic
The EPF10K100EFI256-2 is well-suited for industrial control platforms because its 0.22 µm CMOS process and industrial temperature rating handle factory-floor thermal stress from 0C to +70C (commercial) or -40C to +85C (industrial suffix). The FLEX 10KE architecture provides 624 LABs ideal for state machines controlling motor drives, PLC scanners, and HMI timing logic, while the 12 EABs supply on-chip RAM for recipe storage and event logging. The 256-ball FBGA package supports high I/O count for multi-axis control with encoder feedback, limit switches, and analog-monitor MUXes. Engineers commonly use this device as a drop-in replacement for aging discrete TTL/CMOS glue logic, consolidating dozens of packages into one FPGA.
Recommended
Legacy System Re-Engineering and ASIC Prototyping
The EPF10K100EFI256-2 is frequently deployed as an ASIC prototype because its 100K-gate capacity and JTAG-based configuration let design teams iterate HDL revisions within hours rather than waiting for mask-set spins. The embedded array blocks (EABs) mimic ASIC SRAM macros, allowing engineers to validate memory-intensive datapaths before committing to silicon. The FLEX 10KE was the industry's first SOPC platform, integrating embedded processor cores (such as the ARM-based or Nios equivalents of the era) alongside custom logic. For legacy systems still in production, this FPGA provides a migration bridge from obsolete discrete logic or masked ASICs without changing the surrounding PCB.
Recommended
Datacom and Networking Equipment
The EPF10K100EFI256-2 fits datacom backplanes and mid-range routers because its 191 user I/Os support multiple parallel databus connections, and its 250 MHz toggle rate comfortably handles Fast Ethernet MAC bridging or POS-PHY interfaces. The 49 Kbits of distributed RAM implement small FIFOs and statistics counters without external SRAM, simplifying the BOM. The FineLine BGA package enables compact line-card designs with controlled impedance routing. Engineers often pair this FPGA with a network processor or switch fabric to offload classification, metering, and exception-handling tasks from the main CPU, offloading latency-critical paths into hardware.
Recommended
Test and Measurement Instrumentation
The EPF10K100EFI256-2 is deployed in test equipment where its reprogrammability allows the same hardware platform to host multiple instrument personalities (logic analyzer, pattern generator, protocol exerciser) by loading different configuration bitstreams. The 12 embedded array blocks implement deep sample buffers and lookup tables for protocol decoding, while the 4,992 logic elements handle trigger sequencing and timing generators. The JTAG interface supports in-system bitstream updates via the tester's USB or Ethernet port, simplifying field upgrades. Its 2.5 V core and 3.3 V I/O rails match legacy test-equipment power architectures, easing retrofit designs.
Recommended
Aerospace and Defense Legacy Avionics
The EPF10K100EFI256-2 continues to serve aerospace and defense programs that qualified the FLEX 10KE family decades ago and now require long-term sustainment. Its industrial temperature range and SRAM-based configuration support field reprogrammability for mission updates, while the FBGA package withstands vibration environments typical of avionics bays. The 4,992 logic elements and embedded RAM provide MIL-STD-1553, ARINC 429, and discrete signal conditioning in a single device, eliminating racks of discrete logic. For sustainment programs, the EPF10K100EFI256-2's well-documented SameFrame pin-out enables drop-in migration to higher-density FLEX 10KE variants without re-qualification of the PCB.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EFI256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC256-2 | EPF10K100EFC256-2X | EPF10K100EFC256-3 | EPF10K100EFC256-3N | EPF10K130EFC256-2 | EPF10K50EFC256-2 |
|---|---|---|---|---|---|---|---|
| Package | 256-Ball FineLine BGA (FBGA-256) | 256-Ball FineLine BGA - same | 256-Ball FineLine BGA - same | 256-Ball FineLine BGA - same | 256-Ball FineLine BGA - same | 256-Ball FineLine BGA - same | 256-Ball FineLine BGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | |
| Typical Gates | 100,000 | 100,000 - same | 100,000 - same | 130,000 (+30%) | 50,000 (-50%) | ||
| Speed Grade | -2 | -2 (same) | -3 (faster) | -3 (faster) | -2 | ||
| Temperature Grade | Industrial (I): -40C to +85C | Commercial (C): 0C to +70C | Commercial (C): 0C to +70C | Commercial (C): 0C to +70C | |||
| Lead-Free / RoHS | unknown | Yes (X suffix) | Yes (N suffix) | unknown | |||
| User I/Os | 191 | 191 - same | 191 - same | 191 - same (SameFrame) | |||
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade vs commercial alternatives (vs EPF10K100EFC256-2)
- SameFrame-compatible upgrade path to 130K gates (vs EPF10K130EFC256-2)
- SOPC-capable embedded array architecture (vs EPF10K10ATC100-3N)
Design Notes
The EPF10K100EFI256-2 requires separate 2.5 V core (VCCINT) and 3.3 V I/O (VCCIO) rails with controlled power-up sequencing: VCCINT must ramp before or simultaneously with VCCIO to prevent I/O latch-up. Use a power-on reset (POR) supervisor with monotonic ramp verification; estimated core current is approximately 200-400 mA at full toggle activity, so a 1 A regulator with 1.5 V headroom is recommended. Decouple each power pin pair with 0.1 µF and 10 µF capacitors placed within 5 mm of the FBGA balls. Estimated based on typical FLEX 10KE family datasheet figures and similar-density 0.22 µm FPGAs.
The 256-ball FineLine BGA at 1.0 mm pitch demands a 4-layer or 6-layer PCB with microvia-in-pad or sub-0.1 mm laser vias for the inner rows. Escape routing must use a dog-bone fan-out pattern with 0.1 mm trace width and 0.1 mm clearance to fit through the 0.5 mm BGA pad-to-pad spacing. Place configuration EEPROM and JTAG header within 25 mm of the dedicated configuration balls (MSEL0/1, nCE, nCONFIG, nSTATUS, CONF_DONE, DCLK) to minimize signal integrity issues. Reference the Altera AN-114 application note on FLEX 10KE board layout for detailed escape diagrams.
With 191 user I/Os and 250 MHz toggle rates, simultaneous switching output (SSO) noise is a major concern. Spread high-speed outputs across multiple I/O banks, enable slew-rate limiting on clocks and bus drivers, and add 22 ohm series termination on outputs driving >50 mm traces. The 3.3 V LVTTL/LVCMOS I/O standard is tolerant of 5 V inputs only with external clamping; design within 3.3 V domains or use level translators when mixing voltage rails. Estimated SSO analysis based on FLEX 10KE family datasheet guidelines and Altera AN-224 SSO mitigation recommendations.
Common pitfalls when designing with the EPF10K100EFI256-2 include: (1) attempting to use modern Quartus Prime software which does not support FLEX 10KE - you must use Quartus II version 13.0 or MAX+PLUS II; (2) ignoring VCCINT/VCCIO sequencing causes latch-up during brownout; (3) using the JTAG chain for both configuration and boundary-scan requires careful BSDL ordering; (4) SameFrame pin migration assumes I/O bank compatibility - verify the new device's I/O standard list matches before migrating between FLEX 10KE density variants; (5) configuration data must be loaded within 100 ms of POR or the device enters a fault state.
Compliance Information
RoHS / REACH / lead-free / halogen-free status not explicitly stated in the verified web data. The FLEX 10KE family was originally specified with lead-based solder balls; lead-free variants are typically denoted by an X suffix (e.g., EPF10K100EFC256-2X). AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part.
