EPF10K100EFC256-2 - FLEX 10KE FPGA, 100K Gates, 256-BGA | Intel / Altera
MPN: EPF10K100EFC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $250.89 | $250.89 |
| 10 | $235.5 | $2,355.00 |
| 100 | $210 | $21,000.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $165 | $165,000.00 |
EPF10K100EFC256-2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacturing by the user. FPGAs sit in the programmable-logic hierarchy between simple PLDs/CPLDs and fixed-function ASICs, occupying the same role as discrete gate arrays but allowing rapid, software-driven reconfiguration. The FLEX 10KE family specifically introduced an embedded array block (EAB) for on-chip RAM and DSP-style functions, giving it a System-on-a-Programmable-Chip (SOPC) capability that earlier FPGAs lacked.
Key features of the EPF10K100EFC256-2 include 624 Logic Array Blocks (LABs), embedded array blocks for FIFO/RAM/ROM, fast interconnect (FastTrack), JTAG-compliant boundary-scan test support, in-system programmability via configuration schemes such as PS, and dedicated clock-locked pins. The core is built on a 0.22 µm CMOS SRAM process and uses 4-input look-up tables (LUTs) per logic element, delivering an effective propagation delay of approximately 0.6 ns per LUT in speed-grade -2 silicon.
Typical applications include legacy industrial glue logic, parallel bus interfacing, state-machine and protocol-bridge replacement, low-volume ASIC prototyping, retrofits of older designs still based on the FLEX 10KE footprint, and educational platforms that retain Altera (now Quartus Prime) toolchain support for older families. Because the FLEX 10KE family is mature, the EPF10K100EFC256-2 is generally sourced through authorised distributors of Intel/Altera heritage product rather than direct factory channels.
When designing with this part, remember that core, I/O and JTAG voltages are not independent; the part requires a stable 2.5 V VCCINT plus separate VCCIO banks. Configuration memory is volatile, so an external configuration PROM (e.g., EPC2) is required at every power-up. The 256-pin FineLine BGA also demands careful PCB layout for the fan-out escape and decoupling; consult the FLEX 10KE device handbook for the recommended stack-up and decoupling scheme.
This page synthesises distributor pricing (as of 2026-09-11), a drop-in same-footprint alternatives matrix, and practical design notes not collected in the manufacturer datasheet.
Drop-in alternatives for EPF10K100EFC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EFC256-2 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC256-1
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K100EFC256-2X
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →EPF10K100EFC256-1N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K130EFC256-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EFC256-2AA
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100EFC256-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 4,992 (49,152 user logic elements) |
| Number of LABs | 624 |
| User I/Os | 191 |
| Number of Gates | 100,000 equivalent |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V |
| Logic Family | CMOS (SRAM-based) |
| Propagation Delay (per LUT) | ~0.6 ns (speed grade -2) |
| Package | 256-FBGA (FineLine BGA, 17 x 17 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Configuration Method | PS, JTAG, in-system programmable |
| Process Technology | 0.22 µm CMOS SRAM |
| Embedded Array Blocks | Yes (EAB for RAM/ROM/DSP) |
EPF10K100EFC256-2 256-fbga (fineline bga, 17 x 17 mm) Pin Configuration Guide
Pin configuration for EPF10K100EFC256-2 (256-fbga (fineline bga, 17 x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EFC256-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EFC256-2 is suitable for 6 applications: Legacy Industrial Glue Logic, Parallel Bus & Protocol Bridging, ASIC Prototyping & Emulation, Retrofit of Existing FLEX 10KE Designs, Educational & Training Platforms, Low-Volume Instrumentation Customisation.
Legacy Industrial Glue Logic
The EPF10K100EFC256-2 fits legacy industrial glue-logic boards where 24 mA TTL-compatible drive and 0.6 ns LUT propagation keep timing margins intact. Its 100K gates and 624 LABs deliver ample headroom for register-rich bus and handshake replacement without re-architecting. Built on a 0.22 µm SRAM process, the part retains I/O characteristics engineers originally characterised, so retrofits of 1990s-era factory-floor controllers drop onto existing 256-FBGA footprints without re-spin. Industrial users get stable long-lifecycle support via heritage distribution (Rochester, Heisener), which is more valuable than peak performance.
Recommended
Parallel Bus & Protocol Bridging
The EPF10K100EFC256-2 works well for parallel bus and protocol-bridge replacement thanks to 191 user I/Os (256-BGA pin-migrated across the FLEX 10KE family) and embedded array blocks (EABs) that implement FIFOs, dual-port RAM and small ROM look-up tables for protocol translation. At speed grade -2, glue-logic delays stay under one LUT per stage, which is acceptable for sub-50 MHz industrial buses. Compared with modern Cyclone IV, the part has lower internal memory, but in long-lifecycle systems the value is pin-compatibility with prior revisions and continued Altera/Quartus toolchain support for legacy RTL.
Recommended
ASIC Prototyping & Emulation
Designers use the EPF10K100EFC256-2 as an ASIC prototyping vehicle because its 100K-gate capacity is large enough to host pre-silicon RTL, while the FLEX 10KE JTAG chain supports iterative in-system programming without package removal. The 624 LABs and 4,992 logic elements, combined with EABs for memory primitives, map cleanly from synthesised Verilog/VHDL. Quartus Prime (legacy MAX+PLUS II) still supports FLEX 10KE bitstream generation. Engineers reuse the FC256 FineLine BGA across 100K and 130K densities via SameFrame pin migration, so the same PCB emulates multiple ASIC revisions.
Recommended
Retrofit of Existing FLEX 10KE Designs
The EPF10K100EFC256-2 is the preferred way to refurbish boards originally designed around the FLEX 10KE family: it is pin-compatible with EPF10K100EFC256-1, EPF10K130EFC256-1/-2, and other 256-BGA FLEX 10KE devices via Altera's SameFrame pin-migration scheme, so the same PCB accepts multiple densities. Its 2.5 V VCCINT rail matches older power trees, avoiding the need to re-design the supply section. The 0 °C to +70 °C commercial temperature window covers most factory-floor and instrumentation enclosures. Engineers gain a drop-in spare for legacy installations where redesign is not economically viable.
Recommended
Educational & Training Platforms
Universities and design-training labs keep the EPF10K100EFC256-2 in service because the FLEX 10KE family exposes the inner workings of SRAM-based LUT logic, EABs, FastTrack interconnect and JTAG configuration in a way that is easier to teach than modern SoC FPGAs. Quartus Prime and MAX+PLUS II remain free for educational use, so students can compile, simulate and program the part without licence fees. The 256-BGA is often supplied on a breakout board for hand-soldering-friendly access. As long as Altera/Intel continues heritage support, the part remains a pedagogical workhorse for digital-design curricula.
Recommended
Low-Volume Instrumentation Customisation
Low-volume test-and-measurement builders value the EPF10K100EFC256-2 because its 191 user I/Os, 4,992 logic elements and embedded array blocks can absorb custom trigger logic, encoder/decoder state machines, and timing-correction filters without resorting to a discrete ASIC. The 0.6 ns LUT propagation keeps latency low for comparator and pulse-shaping paths. The 256-FBGA footprint is straightforward to escape on a 4-layer FR-4 stack-up with 0.5 mm via-in-pad. Heritage distribution guarantees multi-year availability for spares, which is critical for capital-equipment vendors shipping instruments over decades.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EFC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC256-1 | EPF10K100EFC256-2X | EPF10K100EFC256-1N | EPF10K130EFC256-2 | EPF10K100EFC256-2AA |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 256-FBGA (FC256, 17 x 17 mm) | 256-FBGA (FC256) - same | 256-FBGA (FC256) - same | 256-FBGA (FC256) - same | 256-FBGA (FC256) - same | 256-FBGA (FC256) - same |
| Speed Grade | -2 | -1 (slower timing) | -2X (refreshed -2 bin) | -1 lead-free variant | -2 | -2 with extended temperature |
| Core Voltage (VCCINT) | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V | 2.375 V - 2.625 V |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx. Unit Price (USD) | ~$250.89 | lower than -2 | similar to -2 | lower than -2 | higher than -2 (more logic) | higher (extended temp screening) |
Key Differentiators
- SameFrame pin migration within FLEX 10KE family (vs EPF10K130EFC256-2)
- Speed-grade -2 timing margin (vs EPF10K100EFC256-1)
- EAB-based on-chip memory (vs Discrete glue-logic ICs)
Design Notes
Power-rail sequencing on the EPF10K100EFC256-2: VCCINT (2.5 V) must reach regulation before the I/O banks (VCCIO) ramp, otherwise the I/O pins drive indeterminate logic levels into a partially-initialised core. Tie all VCCINT balls to a common 2.5 V plane and provide at least 4 x 0.1 µF + 1 x 10 µF ceramic decoupling within 5 mm of the BGA perimeter; add bulk capacitance at the regulator output per the FLEX 10KE device handbook. Estimated: at typical utilisation, VCCINT current is roughly 0.3-0.5 A for a 100K-gate design, so budget 1.5 W of 2.5 V supply headroom.
The 256-FineLine BGA on a 1.0 mm pitch demands 4-layer FR-4 with 0.2 mm via-in-pad micro-vias for inner rows and 0.4 mm dog-bone fan-out for outer rows; missing this escape pattern is the most common reason prototypes fail X-ray inspection. Keep all signal traces at least 0.15 mm from adjacent BGA pads to limit crosstalk, and route the JTAG chain on a single layer with no stubs. Estimated: thermal pad coverage of 4 cm² copper pour keeps θJA around 25 °C/W, well within the commercial 0-70 °C window at typical loading.
Because configuration memory is volatile SRAM, the EPF10K100EFC256-2 will not boot without an external configuration device - typically an EPC2, EPC1 or EPC16 serial PROM in PS mode. Common pitfalls include leaving MSEL pins floating (the device enters an undefined mode), omitting a pull-up on nSTATUS/nCONFIG (causes configuration failure on noisy rails), and forgetting that JTAG instructions are chain-dependent; verify the BSDL file matches the device revision before relying on boundary-scan for production test.
Compliance Information
Compliance status for the EPF10K100EFC256-2 was not present in the verified web data; date-code-specific CoC should be requested from the distributor (Rochester, Heisener, LCSC, Mouser, DigiKey Marketplace). AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.
