EPF10K100EFC256-3N - FLEX 10KE FPGA 100K Gates | Altera/Intel
MPN: EPF10K100EFC256-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $56.75 | $28,375.00 |
| 1,000 | $49.2 | $49,200.00 |
EPF10K100EFC256-3N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, routing interconnects, and I/O cells that can be re-programmed in-system to implement arbitrary digital circuits. FPGAs sit in the semiconductor hierarchy below ASICs (custom silicon) but above CPLDs in density, and belong to the broader programmable logic device (PLD) family. The FLEX 10KE family was Altera's first embedded programmable logic family offering System-on-a-Programmable-Chip (SOPC) integration with an embedded array block (EAB) usable as RAM, ROM, or product-term logic.
Key features include 100K typical gates (with up to ~250K maximum system gates), 4992 logic cells, twelve Embedded Array Blocks (EABs) providing 24,576 RAM bits each, multi-voltage I/O supporting 2.5 V and 3.3 V interfaces, and a -3 speed grade targeting higher Fmax than -1/-2 grades. The 256-pin FineLine BGA package supports 191 user I/O and is compliant with PCI Local Bus Specification Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz.
The architecture pairs logic array blocks (LABs) with EABs to deliver both fine-grained logic and high-density on-chip SRAM, while four-phase clocking and global/regional clock networks provide deterministic timing closure. JTAG boundary-scan support compliant with IEEE Std. 1149.1-1990 enables in-system test without consuming device logic.
Typical applications include PCI bus interface bridges, glue logic replacement, custom DSP datapaths, industrial control and communications backplanes, and legacy telecommunication line-card designs where the FLEX 10KE delivered compelling cost-per-gate at product launch.
When designing with the EPF10K100EFC256-3N, ensure the 2.5 V core supply is well-decoupled with 0.1 µF ceramic capacitors near each VCCINT pin and use the JTAG chain carefully ordered to avoid TAP contention during in-system programming.
Drop-in alternatives for EPF10K100EFC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EFC256-3N (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Logic Elements / Cells, PCI Compliance.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EFC256-3
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF10K100EFC256-2X
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →EPF10K100EFC256-2
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EPF10K100EFC256-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K100BFC256-3
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →EPF10K100EFC256-3N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 4992 cells |
| Typical Gates | 100,000 |
| Embedded Memory | 49152 bits |
| User I/O | 191 |
| Package | 256-pin FineLine BGA (FBGA) |
| Speed Grade | -3 (fastest grade of family) |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature | 0C to +70C (commercial) |
| Logic Family | CMOS, SRAM-based |
| Embedded Array Blocks (EABs) | 12 |
| JTAG Support | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | PCI Local Bus Rev. 2.2 (3.3 V at 33/66 MHz) |
| Mounting Type | Surface Mount |
EPF10K100EFC256-3N 256-pin fineline bga (fbga) Pin Configuration Guide
Pin configuration for EPF10K100EFC256-3N (256-pin fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EFC256-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EFC256-3N is suitable for 6 applications: PCI Bus Interface Bridge, Industrial Control Glue Logic, Telecommunication Line-Card Designs, Custom DSP Datapath Acceleration, Legacy Embedded Computing Platform, Test & Measurement Instrumentation.
PCI Bus Interface Bridge
The EPF10K100EFC256-3N's PCI 2.2 compliance at 33 MHz and 66 MHz, combined with 49152 bits of embedded memory for buffer FIFOs and 191 user I/O for multi-bus bridging, makes it ideal for legacy PCI add-in card designs. The 100K-gate density supports glue-less master/target state machines, scatter-gather DMA engines, and on-chip configuration-space registers. Place the FPGA between a host CPU bus and a downstream peripheral (e.g., custom DSP or memory), utilizing 3.3 V VCCIO on the PCI bank and 2.5 V core for low power. The -3 speed grade provides timing margin for 66 MHz PCI at 33 MHz or 66 MHz operation per the Altera datasheet.
Recommended
Industrial Control Glue Logic
For PLC backplanes and motor-control boards, the EPF10K100EFC256-3N replaces dozens of 74-series TTL parts with a single programmable device, integrating address decoding, interrupt prioritization, watchdog timers, and PWM generation. Its 191 user I/O support multi-axis encoder inputs and isolated I/O expansion; the 12 Embedded Array Blocks (EABs) provide 49152 bits of on-chip memory for FIFO buffering of sensor streams. Industrial users should note the 0C-70C commercial temp grade and design with adequate margin; conformal coating and external watchdog supervisors are recommended for harsh environments.
Recommended
Telecommunication Line-Card Designs
Legacy telecom line cards rely on the EPF10K100EFC256-3N for HDLC framing, time-slot interchange, and E1/T1 framer glue logic. The 100K-gate density accommodates 32+ channel HDLC controllers plus custom signalling processing, while 49152 bits of EAB memory provides elastic stores for jitter attenuation. Designers typically pair the FPGA with a TDM bus backplane and a framer IC; the 2.5 V core and 3.3 V I/O simplify multi-voltage interfacing. Use the -3 speed grade for tight HDLC bit-clock budgets per the FLEX 10KE datasheet.
Recommended
Custom DSP Datapath Acceleration
The FLEX 10KE EABs can implement synchronous RAM-look-up tables for small FIR/IIR filter coefficient storage, and the 4992 logic cells support custom multiply-accumulate datapaths for sample rates up to 200 MHz. Engineers typically use the EPF10K100EFC256-3N for protocol-specific signal processing (e.g., modem equalizers, audio sample-rate converters) where general-purpose DSPs are too power-hungry. Pair the FPGA with an external ADC/DAC; use the 256-pin FBGA for high pin-count LVCMOS interfacing. The -3 speed grade is critical for meeting DSP pipeline timing closure.
Recommended
Legacy Embedded Computing Platform
In VME/CompactPCI single-board computers, the EPF10K100EFC256-3N provides local-bus arbitration, interrupt steering, and BIOS extension glue between a host CPU and peripherals. The 49152 bits of on-chip memory back small DMA descriptor rings and boot-ROM shadows, while 191 user I/O connect to backplane transceivers. The 0.22 µm CMOS process and 2.5 V core give relatively low power for a 100K-gate device, suitable for air-cooled slots. Confirm the 0C-70C commercial temp range meets chassis thermal profile; -3 speed grade eases setup-and-hold on the local bus.
Recommended
Test & Measurement Instrumentation
ATE pin-electronics and protocol-analyzer cards use the EPF10K100EFC256-3N for pattern-generation timing, vector capture, and stimulus-response sequencing. The 200 MHz performance on -3 speed grade enables 100 MHz pattern rates, while 49152 bits of EAB memory provide deep stimulus-vector buffering. The 191 user I/O drive high-channel-count PMU buses. Pair the FPGA with high-speed comparator front-ends and a host CPU over PCI; the JTAG port supports in-system test (IEEE 1149.1) per the FLEX 10KE datasheet.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EFC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EFC256-3 | EPF10K100EFC256-2X | EPF10K100EFC256-2 | EPF10K100EFC256-1X | EPF10K100BFC256-3 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-pin FineLine BGA | 256-pin FineLine BGA - same | 256-pin FineLine BGA - same | 256-pin FineLine BGA - same | 256-pin FineLine BGA - same | 256-pin FineLine BGA - same footprint, verify BGA ball map vs KE family |
| Speed Grade | -3 (fastest) | -3 (same) | -2X (slower) | -2 (slower) | -1X (slowest) | -3 (same) |
| Logic Elements | 4992 cells | 4992 cells | 4992 cells | 4992 cells | 4992 cells | 4992 cells |
| Embedded Memory | 49152 bits | 49152 bits | 49152 bits | 49152 bits | 49152 bits | 24576 bits (10KB family, half the memory) |
| User I/O | 191 | 191 | 191 | 191 | 191 | 191 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V |
| Terminal Finish (RoHS) | Lead-free (N suffix) | SnPb (non-N) | SnPb | SnPb | SnPb | SnPb |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in compatibility with all FLEX 10KE 256-FBGA speed grades (vs EPF10K100EFC256-2X)
- Higher embedded memory than FLEX 10KB predecessor (vs EPF10K100BFC256-3)
- Lead-free terminal finish vs SnPb variants (vs EPF10K100EFC256-3)
Design Notes
The EPF10K100EFC256-3N requires a clean 2.5 V core supply with bulk decoupling (10 µF tantalum + 0.1 µF ceramic) within 1 inch of each VCCINT ball per Altera FLEX 10KE design guidelines. Multi-voltage VCCIO banks must be tied to 2.5 V or 3.3 V; mixing voltages within a bank is not permitted. Estimated ICCINT for a fully-utilized 100K-gate design at 100 MHz is approximately 200-400 mA; verify with actual utilization before sizing the regulator.
The 256-pin FineLine BGA has a 1.0 mm ball pitch, requiring microvia or HDI PCB technology. Per Altera BGA layout guidelines, all four inner layers should be dedicated ground/power planes to provide controlled-impedance return paths for LVCMOS signals. Recommend 4-6 layer stack-up with continuous GND reference under BGA; avoid signal routing under the BGA field except for escape vias.
Do not assume the FLEX 10KE 0.22 µm process is hot by modern standards - it is, and the part lacks modern low-power features such as programmable slew rate or per-bank I/O voltage scaling beyond the original 2.5 V / 3.3 V support. JTAG chain ordering matters when multiple Altera devices share TCK/TMS: keep TDI-to-TDO daisy chain short and place the EPF10K100EFC256-3N last to minimize TCK skew. Programming via obsolete Quartus II software requires legacy parallel-port ByteBlaster or USB-Blaster download cables.
Estimated: with 191 user I/O at LVCMOS 3.3 V and 50 MHz edge rates, expect 2-3 ns edge transition times. Route critical clocks (CLK0-CLK3) on inner stripline layers with 50 Ω characteristic impedance and match trace lengths within 200 mils. For PCI 66 MHz designs, all 66 MHz signals must be 65 Ω impedance, length-matched within 1500 mils per PCI Local Bus 2.2 spec.
Compliance Information
RoHS compliance inferred from the -3N suffix per Altera ordering convention (N = lead-free finish). No AEC-Q100 variant exists for FLEX 10KE family; not_applicable. Halogen-free status not documented in available sources; mark unknown.
