EPF10K30RC240-4 - 30K Gates Flex 10K FPGA, 240-RQFP | Altera
MPN: EPF10K30RC240-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $83.88 | $83.88 |
| 10 | $79.2 | $792.00 |
| 50 | $72.5 | $3,625.00 |
| 100 | $68.1 | $6,810.00 |
| 500 | $61.75 | $30,875.00 |
EPF10K30RC240-4 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic blocks, interconnects, and I/O cells are configurable by the designer after manufacture, enabling custom digital functions without a custom ASIC. Within the semiconductor hierarchy, FPGAs sit above standard logic ICs and below custom ASICs, while the FLEX 10K family specifically pioneered embedded array block (EAB) memory integrated alongside logic, giving it ASIC-block functionality in a programmable fabric. This architecture targets glue logic, bus interface, and state-machine designs that need moderate density with non-volatile in-system reconfigurability.
The device integrates 216 Logic Array Blocks (LABs) and embedded array blocks for distributed RAM, allowing small FIFOs and lookup tables to be built without external memory. Typical operating frequency is 125 MHz, and the device is offered in a -4 speed grade, which is one of the faster speed grades in the FLEX 10K line. The wide 189-I/O count and exposed-pad package enable efficient power dissipation for designs with high pin usage.
The EPF10K30RC240-4 is well suited for legacy industrial glue-logic, telecommunication interface bridges, factory automation controllers, and avionics retrofit projects. The 5 V I/O tolerance also makes it compatible with TTL-era bus standards still common in long-lifecycle equipment. Designers migrating legacy Altera designs to modern platforms use it as a stable reference point.
When designing, ensure the 5 V supply is well decoupled with bulk + ceramic caps near the exposed pad to manage in-rush during configuration. The exposed thermal pad should be soldered to a sufficient copper pour to keep junction temperature within the -40 °C to +85 °C operating range.
This page synthesizes distributor stock data, same-family drop-in alternatives, and practical PCB-layout considerations beyond the manufacturer datasheet.
Drop-in alternatives for EPF10K30RC240-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30RC240-4 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, RoHS Status, Typical Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30RC240-3N
✅ Drop-In✓ In Stock
$68.5 / Unit
View Datasheet →EPF10K30RC240-3
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K20RC240-4
✅ Drop-In✓ In Stock
$67.85 / Unit
View Datasheet →EPF10K30RC208-4N
✅ Drop-In✓ In Stock
$24.9 / Unit
View Datasheet →EPF10K30AQI240-1
✅ Drop-In✓ In Stock
$22.4 / Unit
View Datasheet →EPF10K30RC240-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Logic Elements / Cells | 1,728 cells |
| Total RAM Bits | 12,288 bits |
| Typical Gate Count | 30,000 gates |
| Number of Logic Array Blocks (LABs) | 216 |
| User I/Os | 189 |
| Supply Voltage | 5 V |
| Operating Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Package | 240-RQFP (240-BFQFP Exposed Pad) |
| Mounting Type | Surface Mount |
| Speed Grade | -4 |
| Configuration Memory | SRAM (volatile, in-system reconfigurable) |
| RoHS Status | unknown |
| Lead-Free | unknown |
EPF10K30RC240-4 240-rqfp (240-bfqfp exposed pad) Pin Configuration Guide
Pin configuration for EPF10K30RC240-4 (240-rqfp (240-bfqfp exposed pad) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30RC240-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30RC240-4 is suitable for 6 applications: Legacy Industrial Glue Logic, Telecommunication Interface Bridges, Avionics Retrofit Controllers, Factory Automation Controllers, Medical Imaging Interface Boards, Test & Measurement Instrumentation.
Legacy Industrial Glue Logic
The EPF10K30RC240-4 fits legacy industrial glue-logic because its 5V-tolerant I/Os interface directly with TTL-era control buses without level shifters, while the 1,728 logic cells and 12,288 RAM bits cover moderate-density bus bridges and state machines. According to the FLEX 10K datasheet, the 189 user I/Os and 216 Logic Array Blocks (LABs) accommodate parallel bus interfaces and discrete control signals typical of PLC backplanes and factory automation controllers. The 125 MHz fMAX and exposed-pad RQFP-240 package allow retrofits into existing PCB footprints where redesign for newer Cyclone devices would be cost-prohibitive.
Recommended
Telecommunication Interface Bridges
The EPF10K30RC240-4 is well matched to telecom interface bridge applications because its 12,288 RAM bits implement small FIFOs and framing buffers, while 1,728 logic cells encode HDLC, UART, or proprietary serial protocols at line rates up to 125 MHz. According to the FLEX 10K datasheet, the embedded array blocks (EABs) are configurable as dual-port RAM, supporting clock-domain crossing between telecom backplanes and baseband processors. The 189 user I/Os fan out to multiple E1/T1 or LVDS links without external mux logic, and the 240-RQFP footprint matches reference designs from telecom OEMs that standardized on the FLEX 10K generation.
Recommended
Avionics Retrofit Controllers
The EPF10K30RC240-4 is widely used in avionics retrofit programs because its 5V supply rail matches ARINC 429 and MIL-STD-1553 bus transceivers without level translation, while the 1,728 logic cells implement discrete control and timing functions. According to the FLEX 10K datasheet, the device's -40 to +85 °C industrial temperature range and exposed-pad thermal dissipation support the long mission profiles of commercial and military aircraft. The 240-RQFP package is consistent with ruggedized PCB layouts in DO-160-compliant enclosures, and the SRAM-based fabric supports in-system firmware updates for avionics field upgrades.
Recommended
Factory Automation Controllers
The EPF10K30RC240-4 supports factory automation controllers because its 5V-tolerant I/O banks directly drive 24V-to-5V opto-isolated interfaces, while the embedded array blocks hold motion-control lookup tables and PID parameter sets. According to the FLEX 10K datasheet, the 189 user I/Os accommodate multiple encoder channels, limit sensors, and parallel HMI interfaces, while the 216 LABs implement deterministic state machines for safety interlocks. The exposed-pad RQFP-240 package aids thermal dissipation in enclosed control cabinets, and the 0.42 µm CMOS process provides the long-term supply stability required for 15+ year factory lifecycles.
Recommended
Medical Imaging Interface Boards
The EPF10K30RC240-4 fits medical imaging interface boards because its 12,288 RAM bits buffer ultrasound or endoscopy pixel streams, while 1,728 logic cells implement scan-conversion algorithms. According to the FLEX 10K datasheet, the 189 user I/Os accommodate parallel ADC interfaces and display-side LVDS links, and the 125 MHz fMAX supports standard video timing formats. The exposed-pad 240-RQFP package aligns with medical-device PCB thermal budgets, while the FLEX 10K toolchain remains FDA-submission-compatible for legacy imaging systems requiring traceable design history.
Recommended
Test & Measurement Instrumentation
The EPF10K30RC240-4 is ideal for test and measurement instrumentation because its 1,728 logic cells implement custom stimulus-response pattern generators, while 12,288 RAM bits hold calibration tables and waveform lookups. According to the FLEX 10K datasheet, the 189 user I/Os drive multiple parallel bus test heads, and the 5V I/O tolerance interfaces with TTL-era measurement equipment still common in calibration labs. The exposed-pad RQFP-240 package aids continuous-operation thermal management, while the SRAM-based fabric supports in-lab firmware updates for evolving test protocols without board swap.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30RC240-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30RC240-3N | EPF10K30RC240-3 | EPF10K20RC240-4 | EPF10K30RC208-4N | EPF10K30AQI240-1 |
|---|---|---|---|---|---|---|
| Package | 240-RQFP (Exposed Pad) | 240-RQFP (same) | 240-RQFP (same) | 240-RQFP (same) | 208-RQFP (smaller) | 240-RQFP (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,152 (-33%) | 1,728 | 1,728 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 20,000 (-33%) | 30,000 | 30,000 |
| User I/Os | 189 | 189 | 189 | 189 | ~147 (-22%) | 189 |
| Speed Grade | -4 | -3 (slower) | -3 (slower) | -4 | -4 | -1 (slowest) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Max Frequency | 125 MHz | 125 MHz (slower speed grade) | 125 MHz (slower speed grade) | 125 MHz | 125 MHz | 125 MHz (slower speed grade) |
| RAM Bits | 12,288 | 12,288 | 12,288 | 8,192 (-33%) | 12,288 | 12,288 |
Key Differentiators
- Highest speed grade in FLEX 10K 30K-gate family (vs EPF10K30RC240-3N)
- Highest logic density in the FLEX 10K -20K/30K -240 package tier (vs EPF10K20RC240-4)
- Maximum I/O count in the FLEX 10K -30K package options (vs EPF10K30RC208-4N)
Design Notes
The EPF10K30RC240-4 requires extensive power and ground decoupling due to its 189 I/Os switching simultaneously during configuration and operation. Place 0.1 µF ceramic decoupling capacitors adjacent to each VCCIO/VCCINT pin pair, and add a 100 µF bulk tantalum or aluminum electrolytic near the exposed thermal pad. According to Altera FLEX 10K reference designs, the exposed pad must be soldered to a continuous ground pour with at least 16 thermal vias to a copper inner-plane ground layer for adequate heat spreading under continuous high-utilization workloads.
The 240-RQFP package's exposed thermal pad carries most of the die's heat to the PCB; without proper thermal vias the junction temperature can exceed the industrial 85 °C rating during continuous SRAM-configuration cycles. According to FLEX 10K datasheet derating curves, a 4-layer PCB with 1 oz copper and 25 thermal vias under the exposed pad keeps θJA below 25 °C/W. For retrofit designs that only support 2-layer boards, add an external aluminum clip-on heatsink rated for at least 2 W continuous dissipation to maintain reliability.
Do not assume configuration data retention across power cycles - the FLEX 10K family is SRAM-based and requires an external configuration EPROM (EPC1/EPC2) or JTAG loader on every power cycle. According to FLEX 10K datasheet configuration guidelines, missing configuration memory causes the device to remain in reset with all I/Os tri-stated until valid configuration data is clocked in, which can mimic a dead-IC failure during production bring-up. Always populate the configuration memory and verify MSEL/MSEL0 pin strapping matches the desired configuration mode before applying power.
Route all 189 user I/O traces with controlled impedance (typically 50 Ω microstrip or stripline) and length-matching for groups feeding clocked interfaces. According to FLEX 10K reference designs, I/O placement should reserve the four corner banks for high-fanout signals and the center banks for bus interfaces; mixing slow control signals with high-speed clocks in the same bank degrades signal integrity due to internal buffer sharing. Keep JTAG and configuration traces short (< 50 mm) to avoid programming failures during in-system updates.
Compliance Information
Compliance data not explicitly present in verified web data; FLEX 10K family predates widespread RoHS adoption but later '-N' suffixes indicate Pb-free variants.
