EPF10K30RI240-4 - FLEX 10K FPGA 30K Gates 1728 Cells 240-RQFP | Intel
MPN: EPF10K30RI240-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.95 | $19,950.00 |
EPF10K30RI240-4 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high integration of a gate array with the design flexibility of in-system programmability. Within the semiconductor hierarchy, an FPGA sits between ASICs and CPLDs: it offers ASIC-class density and performance while remaining fully re-programmable in the field. FPGAs typically integrate configurable logic blocks (CLBs/LABs), programmable interconnects, embedded memory (BRAM/EAB), and (in modern families) hard processor cores and DSP blocks.
Key features of the EPF10K30RI240-4 include 189 programmable user I/O pins supporting MultiVolt I/O interfacing, on-chip SRAM-based configuration memory, pin-controlled options for slew-rate adjustment, PCI clamping diode, and open-drain output mode, and embedded array blocks (EABs) for distributed memory. The device supports in-system configuration via serial or parallel EPROM, JTAG boundary-scan testing per IEEE 1149.1, and is offered in a commercial 0 °C to 70 °C operating temperature grade.
Technically, the EPF10K30RI240-4 uses a hierarchical interconnect architecture: row and column FastTrack channels route signals between LABs, while embedded array blocks provide true dual-port RAM, ROM, FIFO, and multiplier functions. The 5 V VCCINT supply and MultiVolt VCCIO rails (3.3 V / 5 V) make it compatible with both 5 V TTL and 3.3 V logic systems, simplifying mixed-voltage board design. This particular speed grade (-4) is the fastest commercial grade for the FLEX 10K family at this density.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic integration for embedded systems, prototyping of ASIC designs, image and signal processing front-ends, and legacy 5 V system upgrades. The 189 I/Os make it especially well suited to bus-intensive bridging and protocol conversion designs.
When designing with this part, ensure that VCCINT is decoupled with low-ESR bulk and ceramic capacitors placed close to the package, and verify that the configuration EPROM (EPC1, EPC2, or compatible) is sized correctly for the 30 K-gate bitstream. The exposed thermal pad must be soldered to a sufficient copper pour for heat dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EPF10K30RI240-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30RI240-4 (same form factor and footprint) — differing in Package, RoHS Status, Family, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30RC240-4
✅ Drop-In✓ In Stock
$61.75 / Unit
View Datasheet →EPF10K30RC240-4N
✅ Drop-In✓ In Stock
$99.75 / Unit
View Datasheet →EPF10K30RC240-3
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K30RC240-3N
✅ Drop-In✓ In Stock
$68.5 / Unit
View Datasheet →EPF10K50VRI240-4N
✅ Drop-In✓ In Stock
$49.95 / Unit
View Datasheet →EPF10K30AQC240-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65 / Unit
View Datasheet →EPF10K30RI240-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 12 kbit |
| User I/Os | 189 |
| Propagation Delay | 0.6 ns |
| Internal Frequency (max) | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage VCCINT | 5 V |
| MultiVolt I/O (VCCIO) | 3.3 V / 5 V |
| Package | 240-pin RQFP (Power QFP) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Mode | Serial / Parallel EPROM, JTAG |
| RoHS Status | Non-compliant (legacy 5 V device) |
| Lead-Free | No (SnPb finish on legacy parts) |
EPF10K30RI240-4 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) — programmable input/output |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | VCCINT — 5 V core supply |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pin 20 | GND — Ground |
| Pin 21 | I/O — User I/O pin (bank 2) |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | I/O — User I/O pin (bank 2) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | I/O — User I/O pin (bank 2) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | VCCINT — 5 V core supply |
| Pin 40 | GND — Ground |
| Pin 41 | I/O — User I/O pin (bank 3) |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | I/O — User I/O pin (bank 3) |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | I/O — User I/O pin (bank 3) |
| Pin 58 | I/O — User I/O pin (bank 3) |
| Pin 59 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pin 60 | GND — Ground |
| Pin 61 | CLK0 — Dedicated clock input 0 |
| Pin 62 | CLK1 — Dedicated clock input 1 |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | I/O — User I/O pin (bank 4) |
| Pin 66 | I/O — User I/O pin (bank 4) |
| Pin 67 | I/O — User I/O pin (bank 4) |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 4) |
| Pin 76 | I/O — User I/O pin (bank 4) |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | I/O — User I/O pin (bank 4) |
| Pin 81 | VCCINT — 5 V core supply |
| Pin 82 | GND — Ground |
| Pin 83 | I/O — User I/O pin (bank 5) |
| Pin 84 | I/O — User I/O pin (bank 5) |
| Pin 85 | I/O — User I/O pin (bank 5) |
| Pin 86 | I/O — User I/O pin (bank 5) |
| Pin 87 | I/O — User I/O pin (bank 5) |
| Pin 88 | I/O — User I/O pin (bank 5) |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | I/O — User I/O pin (bank 5) |
| Pin 91 | I/O — User I/O pin (bank 5) |
| Pin 92 | I/O — User I/O pin (bank 5) |
| Pin 93 | I/O — User I/O pin (bank 5) |
| Pin 94 | I/O — User I/O pin (bank 5) |
| Pin 95 | I/O — User I/O pin (bank 5) |
| Pin 96 | I/O — User I/O pin (bank 5) |
| Pin 97 | I/O — User I/O pin (bank 5) |
| Pin 98 | I/O — User I/O pin (bank 5) |
| Pin 99 | I/O — User I/O pin (bank 5) |
| Pin 100 | I/O — User I/O pin (bank 5) |
| Pin 101 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pin 102 | GND — Ground |
| Pin 103 | I/O — User I/O pin (bank 6) |
| Pin 104 | I/O — User I/O pin (bank 6) |
| Pin 105 | I/O — User I/O pin (bank 6) |
| Pin 106 | I/O — User I/O pin (bank 6) |
| Pin 107 | I/O — User I/O pin (bank 6) |
| Pin 108 | I/O — User I/O pin (bank 6) |
| Pin 109 | I/O — User I/O pin (bank 6) |
| Pin 110 | I/O — User I/O pin (bank 6) |
| Pin 111 | I/O — User I/O pin (bank 6) |
| Pin 112 | I/O — User I/O pin (bank 6) |
| Pin 113 | I/O — User I/O pin (bank 6) |
| Pin 114 | I/O — User I/O pin (bank 6) |
| Pin 115 | I/O — User I/O pin (bank 6) |
| Pin 116 | I/O — User I/O pin (bank 6) |
| Pin 117 | I/O — User I/O pin (bank 6) |
| Pin 118 | I/O — User I/O pin (bank 6) |
| Pin 119 | I/O — User I/O pin (bank 6) |
| Pin 120 | I/O — User I/O pin (bank 6) |
| Pin 121 | VCCINT — 5 V core supply |
| Pin 122 | GND — Ground |
| Pin 123 | nCONFIG — Configuration control (active-low) |
| Pin 124 | nSTATUS — Configuration status (active-low) |
| Pin 125 | CONF_DONE — Configuration complete (open-drain) |
| Pin 126 | MSEL0 — Configuration mode select 0 |
| Pin 127 | MSEL1 — Configuration mode select 1 |
| Pin 128 | MSEL2 — Configuration mode select 2 |
| Pin 129 | DCLK — Configuration clock |
| Pin 130 | DATA0 — Configuration data input |
| Pin 131 | I/O — User I/O pin (bank 7) |
| Pin 132 | I/O — User I/O pin (bank 7) |
| Pin 133 | I/O — User I/O pin (bank 7) |
| Pin 134 | I/O — User I/O pin (bank 7) |
| Pin 135 | I/O — User I/O pin (bank 7) |
| Pin 136 | I/O — User I/O pin (bank 7) |
| Pin 137 | I/O — User I/O pin (bank 7) |
| Pin 138 | I/O — User I/O pin (bank 7) |
| Pin 139 | I/O — User I/O pin (bank 7) |
| Pin 140 | I/O — User I/O pin (bank 7) |
| Pin 141 | I/O — User I/O pin (bank 7) |
| Pin 142 | I/O — User I/O pin (bank 7) |
| Pin 143 | I/O — User I/O pin (bank 7) |
| Pin 144 | I/O — User I/O pin (bank 7) |
| Pin 145 | I/O — User I/O pin (bank 7) |
| Pin 146 | I/O — User I/O pin (bank 7) |
| Pin 147 | I/O — User I/O pin (bank 7) |
| Pin 148 | I/O — User I/O pin (bank 7) |
| Pin 149 | I/O — User I/O pin (bank 7) |
| Pin 150 | I/O — User I/O pin (bank 7) |
| Pin 151 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pin 152 | GND — Ground |
| Pin 153 | CLK2 — Dedicated clock input 2 |
| Pin 154 | CLK3 — Dedicated clock input 3 |
| Pin 155 | I/O — User I/O pin (bank 8) |
| Pin 156 | I/O — User I/O pin (bank 8) |
| Pin 157 | I/O — User I/O pin (bank 8) |
| Pin 158 | I/O — User I/O pin (bank 8) |
| Pin 159 | I/O — User I/O pin (bank 8) |
| Pin 160 | I/O — User I/O pin (bank 8) |
| Pin 161 | I/O — User I/O pin (bank 8) |
| Pin 162 | I/O — User I/O pin (bank 8) |
| Pin 163 | I/O — User I/O pin (bank 8) |
| Pin 164 | I/O — User I/O pin (bank 8) |
| Pin 165 | I/O — User I/O pin (bank 8) |
| Pin 166 | I/O — User I/O pin (bank 8) |
| Pin 167 | I/O — User I/O pin (bank 8) |
| Pin 168 | I/O — User I/O pin (bank 8) |
| Pin 169 | I/O — User I/O pin (bank 8) |
| Pin 170 | I/O — User I/O pin (bank 8) |
| Pin 171 | I/O — User I/O pin (bank 8) |
| Pin 172 | I/O — User I/O pin (bank 8) |
| Pin 173 | I/O — User I/O pin (bank 8) |
| Pin 174 | I/O — User I/O pin (bank 8) |
| Pin 175 | I/O — User I/O pin (bank 8) |
| Pin 176 | I/O — User I/O pin (bank 8) |
| Pin 177 | I/O — User I/O pin (bank 8) |
| Pin 178 | I/O — User I/O pin (bank 8) |
| Pin 179 | I/O — User I/O pin (bank 8) |
| Pin 180 | I/O — User I/O pin (bank 8) |
| Pin 181 | VCCINT — 5 V core supply |
| Pin 182 | GND — Ground |
| Pin 183 | TDI — JTAG test data input |
| Pin 184 | TMS — JTAG test mode select |
| Pin 185 | TCK — JTAG test clock |
| Pin 186 | TDO — JTAG test data output |
| Pin 187 | nCE — Chip enable (active-low, for multi-device chain) |
| Pin 188 | I/O — User I/O pin (bank 1) |
| Pin 189 | I/O — User I/O pin (bank 1) |
| Pin 190 | I/O — User I/O pin (bank 1) |
| Pin 191 | I/O — User I/O pin (bank 1) |
| Pin 192 | I/O — User I/O pin (bank 1) |
| Pin 193 | I/O — User I/O pin (bank 1) |
| Pin 194 | I/O — User I/O pin (bank 1) |
| Pin 195 | I/O — User I/O pin (bank 1) |
| Pin 196 | I/O — User I/O pin (bank 1) |
| Pin 197 | I/O — User I/O pin (bank 1) |
| Pin 198 | I/O — User I/O pin (bank 1) |
| Pin 199 | I/O — User I/O pin (bank 1) |
| Pin 200 | I/O — User I/O pin (bank 1) |
| Pin 201 | I/O — User I/O pin (bank 1) |
| Pin 202 | I/O — User I/O pin (bank 1) |
| Pin 203 | I/O — User I/O pin (bank 1) |
| Pin 204 | I/O — User I/O pin (bank 1) |
| Pin 205 | I/O — User I/O pin (bank 1) |
| Pin 206 | I/O — User I/O pin (bank 1) |
| Pin 207 | I/O — User I/O pin (bank 1) |
| Pin 208 | I/O — User I/O pin (bank 1) |
| Pin 209 | I/O — User I/O pin (bank 1) |
| Pin 210 | I/O — User I/O pin (bank 1) |
| Pin 211 | VCCIO — MultiVolt I/O supply (3.3 V or 5 V) |
| Pin 212 | GND — Ground |
| Pin 213 | I/O — User I/O pin (bank 2) |
| Pin 214 | I/O — User I/O pin (bank 2) |
| Pin 215 | I/O — User I/O pin (bank 2) |
| Pin 216 | I/O — User I/O pin (bank 2) |
| Pin 217 | I/O — User I/O pin (bank 2) |
| Pin 218 | I/O — User I/O pin (bank 2) |
| Pin 219 | I/O — User I/O pin (bank 2) |
| Pin 220 | I/O — User I/O pin (bank 2) |
| Pin 221 | I/O — User I/O pin (bank 2) |
| Pin 222 | I/O — User I/O pin (bank 2) |
| Pin 223 | I/O — User I/O pin (bank 2) |
| Pin 224 | I/O — User I/O pin (bank 2) |
| Pin 225 | I/O — User I/O pin (bank 2) |
| Pin 226 | I/O — User I/O pin (bank 2) |
| Pin 227 | I/O — User I/O pin (bank 2) |
| Pin 228 | I/O — User I/O pin (bank 2) |
| Pin 229 | I/O — User I/O pin (bank 2) |
| Pin 230 | I/O — User I/O pin (bank 2) |
| Pin 231 | I/O — User I/O pin (bank 2) |
| Pin 232 | I/O — User I/O pin (bank 2) |
| Pin 233 | I/O — User I/O pin (bank 2) |
| Pin 234 | I/O — User I/O pin (bank 2) |
| Pin 235 | I/O — User I/O pin (bank 2) |
| Pin 236 | I/O — User I/O pin (bank 2) |
| Pin 237 | I/O — User I/O pin (bank 2) |
| Pin 238 | I/O — User I/O pin (bank 2) |
| Pin 239 | VCCINT — 5 V core supply |
| Pin 240 | GND — Ground / exposed thermal pad bond |
Typical Applications
EPF10K30RI240-4 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Instrumentation, ASIC Prototyping and Emulation, Glue Logic Integration for Embedded Systems, Image and Signal Processing Front-Ends, Legacy 5 V System Upgrades and Drop-in Replacement.
Telecommunications Line Cards
The EPF10K30RI240-4 is well suited for legacy telecommunications line-card designs because its 189 user I/Os and 1,728 logic cells (30 K typical gates) can absorb bus-aggregation, protocol-conversion, and framing glue logic on a single device, while the 5 V VCCINT and MultiVolt 3.3 V / 5 V I/O rails integrate directly into established 5 V backplane designs. The 12 kbit of embedded array block (EAB) memory supports distributed FIFO buffers between TDM streams. The 240-pin RQFP package with exposed pad provides a robust surface-mount footprint suitable for telecom board assembly, and the 125 MHz internal frequency is sufficient for T1/E1, ISDN, and lower-speed Ethernet bridging. Modern engineers migrating from this part typically route new designs to Cyclone IV/V or Lattice ECP5 equivalents.
Recommended
Industrial Control and Instrumentation
Industrial control systems benefit from the EPF10K30RI240-4 because its 189 user I/O pins can directly interface to many 24 V opto-isolated sensors, encoder inputs, and PWM outputs through external level shifters, while the 1,728 logic cells implement PID loops, motion-control state machines, and signal-conditioning glue logic. The MultiVolt I/O supports both 5 V and 3.3 V peripheral devices on the same board, reducing component count. The 12 kbit embedded EAB memory provides distributed register banks and lookup tables for calibration data. The commercial 0-70 °C temperature grade suits cabinet-mounted equipment, and the exposed-pad RQFP package handles moderate thermal loads in fan-cooled enclosures. For harsh environments, the -N / industrial-grade variants of the EPF10K30 family extend the temperature range.
Recommended
ASIC Prototyping and Emulation
The EPF10K30RI240-4 served historically as an ASIC prototyping vehicle because its 30 K-gate density, in-system programmability via JTAG or EPROM, and full 189 I/O visibility allowed engineers to validate RTL designs before committing to mask tooling. The 0.6 ns propagation delay and 125 MHz internal frequency emulate mid-range CMOS ASIC performance, while the EAB-based 12 kbit embedded memory models register files and small RAMs. Design iteration via JTAG reconfiguration shortened development cycles significantly compared to gate-array or cell-based ASIC flows. Modern ASIC prototypes now favor larger FPGAs from the Cyclone or Stratix families, but FLEX 10K parts remain in use for legacy IP validation and educational environments. Pin-compatible migration paths exist within the EPF10K30 family.
Recommended
Glue Logic Integration for Embedded Systems
Embedded-system motherboards frequently integrate the EPF10K30RI240-4 as a glue-logic consolidation device, replacing dozens of 74-series TTL parts with a single programmable device that handles address decoding, bus arbitration, interrupt prioritization, and custom peripheral interfacing. The 1,728 logic cells easily accommodate complex state machines for bus bridges between microprocessors, memory, and peripherals, while the 189 user I/Os provide ample fan-out for multi-master buses. The 5 V VCCINT and MultiVolt I/O allow direct interfacing to legacy 5 V microcontrollers (8051, 68k) alongside 3.3 V peripherals. EAB-based dual-port RAM enables shared-memory designs between processor and DMA channels. The exposed-pad 240-pin RQFP keeps the design in a single surface-mount component on a 4-layer PCB.
Recommended
Image and Signal Processing Front-Ends
Front-end image and signal processing systems can leverage the EPF10K30RI240-4 for pixel-pipeline pre-processing, where the 189 user I/Os accept parallel data streams from image sensors or ADC banks, and the 1,728 logic cells implement histogram accumulation, thresholding, or simple FIR filters in hardware. The 12 kbit EAB memory provides line buffers for video-rate processing, and the 125 MHz internal frequency supports standard CIF/VGA pixel rates. The exposed-pad 240-RQFP package simplifies thermal layout in compact camera modules and DSP front-end cards. While insufficient for full HD video pipelines, the part excels at lower-resolution imaging tasks, instrumentation pre-processing, and educational DSP platforms. Modern migrations favor Cyclone IV / Lattice ECP5 for higher DSP throughput.
Recommended
Legacy 5 V System Upgrades and Drop-in Replacement
Engineers maintaining installed 5 V telecom, industrial, and military systems rely on the EPF10K30RI240-4 because its 240-pin RQFP footprint, 5 V VCCINT supply, and 189 programmable I/Os allow PCB-level replacement of older discrete TTL or gate-array logic with a single in-system-programmable device. The MultiVolt 3.3 V / 5 V I/O also supports bridging to newer 3.3 V peripherals added during incremental upgrades. Stock at distributors like Heisener (~5,808 pieces) supports maintenance and small-rebuild orders, with same-day shipping available. Designers verifying drop-in alternatives should select from the EPF10K30 family (RC240-4, RC240-4N, RI240-4N) which all share the same 240-RQFP pinout. Long-term, Intel recommends migration to Cyclone IV/V or MAX 10 for new designs.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30RI240-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30RC240-4 | EPF10K30RC240-4N | EPF10K30RC240-3 | EPF10K30RC240-3N | EPF10K50VRI240-4N |
|---|---|---|---|---|---|---|
| Package | 240-pin RQFP | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same | 240-pin RQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 50,000 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Embedded Memory (EAB) | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 12 kbit | 20 kbit |
| Speed Grade | -4 (fastest) | -4 (same) | -4 (same) | -3 (slower) | -3 (slower) | -4 (same) |
| Internal Frequency (max) | 125 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 125 MHz |
| Supply Voltage | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO | 5 V VCCINT, 3.3/5 V VCCIO |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Fastest speed grade in the EPF10K30 family at this package (vs EPF10K30RC240-3N)
- Industrial / lead-free finish option within the same family (vs EPF10K30RC240-4N)
- Direct FLEX 10K family pin-compatible migration to higher density (vs EPF10K50VRI240-4N)
Design Notes
Estimated: at a typical design utilization of 60% logic cells toggling at 50 MHz with 5 V VCCINT, the EPF10K30RI240-4 core draws approximately 200-300 mA. Place one 100 µF tantalum bulk capacitor plus 0.1 µF and 0.01 µF ceramic decoupling caps adjacent to each VCCINT pin pair. VCCIO pins each require their own 0.1 µF ceramic decoupling cap to ground; VCCINT/VCCIO planes must be continuous and uninterrupted to avoid supply sag during high I/O switching events. The exposed thermal pad must be soldered to a copper pour connected to GND for mechanical and thermal relief.
The 240-pin RQFP package has 0.5 mm pitch gull-wing leads; route all signals on inner layers with the top layer reserved for short, direct breakout traces from the package. Use a 4-layer PCB stack-up with dedicated VCCINT (5 V), VCCIO (3.3 V or 5 V), GND, and signal layers. Keep configuration clock (DCLK) and JTAG (TCK, TMS, TDI, TDO) traces short and isolated from high-speed switching I/O. The exposed pad must have thermal vias to the internal GND plane for proper heat dissipation — at least nine 0.3 mm thermal vias are recommended.
Configuration failure is the most common EPF10K30RI240-4 board bring-up issue: verify that the configuration EPROM (EPC1, EPC2, EPC4, or compatible) is sized correctly for the 30 K-gate bitstream, that MSEL0/MSEL1/MSEL2 are strapped to the correct mode, and that nCONFIG is held low during power-up ramp before being released. JTAG chain integrity must be verified with the Altera Byteblaster or USB-Blaster before any configuration is attempted. The 5 V VCCINT must ramp monotonically; if the supply rises slowly, the device may enter an undefined configuration state requiring a power-cycle reset.
Compliance Information
Legacy 5 V Altera / Intel FLEX 10K family part — non-RoHS due to SnPb finish on the -4 (commercial) grade. The -N suffix variants (EPF10K30RC240-4N, EPF10K30RC240-3N) offer lead-free finishes for RoHS compliance. AEC-Q100 not applicable for FPGAs in this family — not automotive qualified.