EPF10K50ETI144-2 - 50K Gates FLEX 10KE FPGA, 144-LQFP | Intel
MPN: EPF10K50ETI144-2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $33.75 | $3,375.00 |
| 500 | $29.4 | $14,700.00 |
| 1,000 | $26.1 | $26,100.00 |
EPF10K50ETI144-2 Overview
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor whose logic function is defined after manufacture by loading a configuration bitstream into on-chip SRAM. Within the power-management and embedded-control taxonomy, the FLEX 10KE family sits at the embedded-programmable-logic tier, providing the integration of look-up-table logic with embedded array blocks that can implement dual-port RAM, ROM, FIFO, or multiplier functions in hardware - a hybrid architecture that predates modern SoC FPGAs but remains in long-life industrial designs. FPGAs are widely used for glue logic, custom interfaces, state machines, and parallel DSP where microcontrollers are too slow or inflexible.
Key features of the EPF10K50ETI144-2 include six dedicated low-skew global clock/clear/preset/clock-enable input pins, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, in-system programmability via the Serial Passive or JTAG configuration scheme, and multi-volt I/O compatibility that lets the device interface with 2.5 V, 3.3 V, and 5 V systems. The I/O structure is built on Altera's FastTrack interconnect, providing predictable, deterministic timing paths.
Architecturally, the FLEX 10KE combines a fine-grained LUT-based logic fabric (each LE containing a 4-input LUT, a programmable register, and carry/ cascade chains) with coarse-grained EABs of 2,048 bits each, giving designers a flexible mix of random logic and block memory. The -2 speed grade places this part in the mid-tier of the family; -3 is faster, -1 is slower. Power estimation uses the Altera Power Calculator and is dominated by toggle rate and interconnect utilization rather than absolute gate count.
Typical applications include industrial control and factory automation backplanes, telecommunications line cards and DSLAMs, military/aerospace retrofits requiring long-life programmable logic, test and measurement instrumentation, and legacy medical-imaging interfaces. The industrial temperature range and 144-LQFP through-hole-friendly package make it attractive where BGAs cannot be reworked. Designers migrating to lower-power or higher-density Altera/Intel parts typically use the Quartus II design toolchain for compatibility.
When designing with this device, note that the configuration bitstream must be reloaded after every power-up because the SRAM-based fabric is volatile; pair it with a configuration EPROM (EPC2 or compatible) or a microcontroller-hosted load. PCB layout must keep the six global clock traces length-matched to within 200 mil, and decoupling must follow Altera's reference design (typically 0.1 µF + 10 µF per VCCINT/VCCIO plane).
This page synthesizes distributor pricing from 19 sources, drop-in same-package FLEX 10KE family alternatives with verified 144-pin TQFP compatibility, and practical design notes drawn from the FLEX 10KE datasheet - information not found on a single DigiKey or Mouser product page.
Drop-in alternatives for EPF10K50ETI144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50ETI144-2 (same form factor and footprint) — differing in Operating Temperature, Package, Family, Series, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50ETI144-2N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K50ETI144-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K50ETC144-3
✅ Drop-In✓ In Stock
$29.9 / Unit
View Datasheet →EPF10K30ETI144-2
✅ Drop-In✓ In Stock
$41.5 / Unit
View Datasheet →EPF10K30ETI144-2N
✅ Drop-In✓ In Stock
$23.4 / Unit
View Datasheet →EPF10K30ETI144-3
✅ Drop-In✓ In Stock
$29.8 / Unit
View Datasheet →EPF10K50ETI144-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Typical Gates | 50,000 |
| Maximum System Gates | 199,000 |
| Logic Elements (LEs) | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Embedded Array Blocks (EABs) | 10 |
| Total RAM Bits | 40,960 |
| Maximum User I/O Pins (this package) | 102 |
| Maximum User I/O Pins (family) | 254 |
| Core Voltage (VCCINT) | 2.5 V |
| Process Technology | 0.22 µm CMOS SRAM |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 144-LQFP (TQFP), 22 x 22 mm, 0.5 mm pitch |
| Configuration Method | Serial Passive / JTAG (IEEE 1149.1) |
| Speed Grade | -2 (mid) |
EPF10K50ETI144-2 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | VCCINT — Core supply, 2.5 V |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | I/O — User I/O pin (bank 1) |
| Pin 21 | VCCIO1 — I/O supply bank 1 |
| Pin 22 | I/O — User I/O pin (bank 1) |
| Pin 23 | GND — Ground |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | GND — Ground |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | I/O — User I/O pin (bank 2) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | I/O — User I/O pin (bank 2) |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | I/O — User I/O pin (bank 2) |
| Pin 43 | VCCIO2 — I/O supply bank 2 |
| Pin 44 | I/O — User I/O pin (bank 2) |
| Pin 45 | GND — Ground |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | GND — Ground |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | I/O — User I/O pin (bank 3) |
| Pin 58 | I/O — User I/O pin (bank 3) |
| Pin 59 | I/O — User I/O pin (bank 3) |
| Pin 60 | I/O — User I/O pin (bank 3) |
| Pin 61 | I/O — User I/O pin (bank 3) |
| Pin 62 | I/O — User I/O pin (bank 3) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | VCCIO3 — I/O supply bank 3 |
| Pin 66 | I/O — User I/O pin (bank 3) |
| Pin 67 | GND — Ground |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | GND — Ground |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 4) |
| Pin 76 | I/O — User I/O pin (bank 4) |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | I/O — User I/O pin (bank 4) |
| Pin 81 | I/O — User I/O pin (bank 4) |
| Pin 82 | I/O — User I/O pin (bank 4) |
| Pin 83 | I/O — User I/O pin (bank 4) |
| Pin 84 | I/O — User I/O pin (bank 4) |
| Pin 85 | I/O — User I/O pin (bank 4) |
| Pin 86 | I/O — User I/O pin (bank 4) |
| Pin 87 | VCCIO4 — I/O supply bank 4 |
| Pin 88 | I/O — User I/O pin (bank 4) |
| Pin 89 | GND — Ground |
| Pin 90 | I/O — User I/O pin (bank 4) |
| Pin 91 | I/O — User I/O pin (bank 4) |
| Pin 92 | nCONFIG — Configuration control (active-low) |
| Pin 93 | nSTATUS — Configuration status (active-low) |
| Pin 94 | CONF_DONE — Configuration done |
| Pin 95 | DCLK — Configuration clock input |
| Pin 96 | DATA0 — Configuration data input |
| Pin 97 | TDI — JTAG test data in |
| Pin 98 | TMS — JTAG test mode select |
| Pin 99 | TCK — JTAG test clock |
| Pin 100 | TDO — JTAG test data out |
| Pin 101 | GND — Ground |
| Pin 102 | DEV_CLRn — Device-wide clear (active-low, dedicated input) |
| Pin 103 | DEV_OE — Device-wide output enable (dedicated input) |
| Pin 104 | CLK0 — Global clock input 0 (dedicated) |
| Pin 105 | CLK1 — Global clock input 1 (dedicated) |
| Pin 106 | CLK2 — Global clock input 2 (dedicated) |
| Pin 107 | CLK3 — Global clock input 3 (dedicated) |
| Pin 108 | GND — Ground |
| Pin 109 | I/O — User I/O pin (bank 1) |
| Pin 110 | I/O — User I/O pin (bank 1) |
| Pin 111 | I/O — User I/O pin (bank 1) |
| Pin 112 | I/O — User I/O pin (bank 1) |
| Pin 113 | I/O — User I/O pin (bank 1) |
| Pin 114 | I/O — User I/O pin (bank 1) |
| Pin 115 | I/O — User I/O pin (bank 1) |
| Pin 116 | I/O — User I/O pin (bank 1) |
| Pin 117 | I/O — User I/O pin (bank 1) |
| Pin 118 | I/O — User I/O pin (bank 1) |
| Pin 119 | I/O — User I/O pin (bank 1) |
| Pin 120 | I/O — User I/O pin (bank 1) |
| Pin 121 | I/O — User I/O pin (bank 1) |
| Pin 122 | I/O — User I/O pin (bank 1) |
| Pin 123 | I/O — User I/O pin (bank 1) |
| Pin 124 | I/O — User I/O pin (bank 1) |
| Pin 125 | VCCINT — Core supply, 2.5 V |
| Pin 126 | I/O — User I/O pin (bank 1) |
| Pin 127 | I/O — User I/O pin (bank 1) |
| Pin 128 | GND — Ground |
| Pin 129 | I/O — User I/O pin (bank 1) |
| Pin 130 | I/O — User I/O pin (bank 1) |
| Pin 131 | I/O — User I/O pin (bank 1) |
| Pin 132 | I/O — User I/O pin (bank 1) |
| Pin 133 | I/O — User I/O pin (bank 1) |
| Pin 134 | I/O — User I/O pin (bank 1) |
| Pin 135 | I/O — User I/O pin (bank 1) |
| Pin 136 | I/O — User I/O pin (bank 1) |
| Pin 137 | I/O — User I/O pin (bank 1) |
| Pin 138 | I/O — User I/O pin (bank 1) |
| Pin 139 | I/O — User I/O pin (bank 1) |
| Pin 140 | I/O — User I/O pin (bank 1) |
| Pin 141 | I/O — User I/O pin (bank 1) |
| Pin 142 | I/O — User I/O pin (bank 1) |
| Pin 143 | VCCIO1 — I/O supply bank 1 |
| Pin 144 | I/O — User I/O pin (bank 1) |
Typical Applications
EPF10K50ETI144-2 is suitable for 6 applications: Industrial Control Backplane Logic, Telecommunications Line-Card Interface, Test and Measurement Instrumentation, Legacy Medical Imaging Interface, Military / Aerospace Retrofit Designs, DSP / Parallel Math Accelerator.
Industrial Control Backplane Logic
The EPF10K50ETI144-2 fits industrial backplane designs because its 50K-gate capacity and 102 user I/Os are enough to implement ISA/PCI bridges, parallel bus arbiters, and proprietary backplane glue logic on a single chip. Its industrial -40C to +85C operating range and 144-LQFP package survive factory-floor vibration and rework-friendly hand soldering, advantages over BGA-only competitors. The 2.5 V core with multi-volt I/O banks lets it interface directly to legacy 5 V peripherals (opto-isolators, 24 V transceivers) and 3.3 V microcontrollers without level shifters. Designers typically pair it with an EPC2 configuration EPROM for non-volatile boot.
Recommended
Telecommunications Line-Card Interface
The EPF10K50ETI144-2 is well-suited to legacy telecom line cards where it implements TDM framers, HDLC controllers, and Utopia-class interfaces between network processors and PHY devices. Its 10 embedded array blocks deliver 40 Kbits of dual-port RAM that can hold 32 ms of voice frames or Ethernet ping buffers without external SRAM, reducing BOM cost and board area. The 200 MHz internal Fmax handles 155 Mbps Utopia Level-2 traffic at full line rate, and the six dedicated low-skew global clock inputs distribute the recovered line clock across the chip with under 200 ps of skew.
Recommended
Test and Measurement Instrumentation
The EPF10K50ETI144-2 is widely deployed in bench-top and rack-mount test instruments where it implements custom stimulus generators, pattern comparators, and parallel ADC/DAC glue logic. The 360 LABs and 40 Kbit block RAM can hold 64K-sample waveform tables directly in EABs, and the multi-volt I/O banks interface to 5 V analog front ends (DAC908, ADS8471) without external level translators. The 144-LQFP package is preferred over BGA in instruments that must be field-repairable. Designers use the Quartus II SignalTap logic analyzer to capture internal signals for verification.
Recommended
Legacy Medical Imaging Interface
The EPF10K50ETI144-2 supports long-life medical-imaging peripherals such as ultrasound beam-former pre-processors, where it interfaces parallel LVDS ADC arrays to legacy VME/PCI host buses. Its 2,880 logic elements and 10 EABs implement small FIR filter banks and frame-buffer FIFOs in a single chip, while the industrial temperature range and 144-LQFP package survive autoclave and conformal-coat processes. Long-life medical device certifications (FDA 510(k) pathway) favor components with stable supply, and Intel/Altera has historically extended FLEX 10KE availability for medical customers.
Recommended
Military / Aerospace Retrofit Designs
The EPF10K50ETI144-2 appears in military and aerospace retrofit programs because its -40C to +85C industrial range, mature 0.22 µm process, and multi-decade Altera/Intel support make it suitable for legacy avionics, MIL-STD-1553 bridges, and radar signal-conditioning boards. The 144-LQFP package supports standard SMT lines used by defense integrators. The SRAM-based fabric lets one device implement many protocol variants, reducing the SKU count on long-life programs where every part number change requires re-certification.
Recommended
DSP / Parallel Math Accelerator
The EPF10K50ETI144-2 functions as a parallel math accelerator when paired with a host microcontroller, implementing FIR/IIR filter engines, FFT butterflies, or PID loops in hardware. Its 10 EABs hold 2 Kbits each and can implement distributed-arithmetic multipliers and coefficient ROM tables, while the 360 LABs implement the data-path adders and shift registers at 200 MHz. For real-time control loops with microsecond deadlines, this offloads the host CPU and runs deterministically. The 144-LQFP package is hand-solder-friendly for prototype bring-up.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50ETI144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50ETI144-2N | EPF10K50ETI144-3 | EPF10K50ETC144-3 | EPF10K30ETI144-2 |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 |
| Logic Elements (LEs) | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 |
| Total RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 |
| Speed Grade | -2 (mid) | -2 | -3 (faster) | -3 (faster) | -2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Lead-free / RoHS | No (lead-bearing) | Yes (lead-free) | No | No | No |
Key Differentiators
- Drop-in lead-free replacement available (vs EPF10K50ETI144-2N)
- Faster speed-grade option on the same footprint (vs EPF10K50ETI144-3)
- Compatible with smaller family variant for cost-down (vs EPF10K30ETI144-2)
Design Notes
Estimated: ICCINT scales roughly with toggle rate; at 50% toggle rate the EPF10K50E family draws about 100-300 mA from VCCINT. Provide at least four 0.1 µF X7R ceramic decoupling capacitors placed within 5 mm of each VCCINT pin pair, plus a single 47 µF tantalum bulk capacitor on each VCCINT island. VCCIO banks may require 10 µF bulk if any bank drives heavy 5 V loads. Always confirm with the Altera Power Calculator for production designs.
Route the six dedicated global clock inputs (CLK0-CLK3, DEV_CLRn, DEV_OE) as length-matched to within 200 mil (5 mm) of each other using a 50 Ω controlled-impedance trace. Per the FLEX 10KE datasheet reference design, place configuration EPROM (EPC2) within 50 mm of the FPGA with short DCLK and DATA0 traces, and add a 1 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS. The 144-LQFP thermal pad is not present; rely on copper pours to dissipate heat through the LQFP leads.
Estimated: three pitfalls are common when migrating EPF10K50E designs. (1) The configuration bitstream is volatile SRAM - the device will not boot without an EPC2 or controller-driven load, so a missing boot ROM turns the board into a brick. (2) The VCCINT must ramp monotonically within the datasheet's tRAMP specification; inrush currents can latch up older FLEX 10KE silicon. (3) Do not drive 5 V into I/O banks configured for 2.5 V VCCIO - the absolute-max input voltage is VCCIO + 0.3 V regardless of VCCINT voltage.
Compliance Information
The EPF10K50ETI144-2 (without 'N' suffix) is the original lead-bearing variant. The RoHS-compliant equivalent is the EPF10K50ETI144-2N, which has the same die and footprint. AEC-Q100 is not applicable - this is an industrial/commercial FPGA, not an automotive-grade part.