EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel
MPN: EPF10K30ETI144-2N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.4 | $23,400.00 |
EPF10K30ETI144-2N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits between fixed-function ASICs and general-purpose processors in the design hierarchy: ASIC > FPGA > CPLD > PLD > programmable logic. FPGAs like the FLEX 10KE family extend traditional gate-array logic with on-chip embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration of megafunctions such as microcontrollers, FIFOs, DSP filters, and custom peripherals.
Key features of the EPF10K30ETI144-2N include 102 user I/O pins, 216 Logic Array Blocks (LABs) in the structured Logic Element array, a MultiVolt I/O interface supporting 2.5 V/3.3 V/5.0 V mixed-voltage operation, PCI-compliant I/O buffers with selectable pull-up clamping diodes, slew-rate control, and open-drain output options configured on a pin-by-pin basis via Altera logic options. The embedded array blocks (EABs) provide synchronous dual-port RAM, ROM, and multiplier implementations without external memory.
The FLEX 10KE architecture combines a fine-grained Logic Element fabric with coarse-grained Embedded Array Blocks, a flexible interconnect (FastTrack), and a continuous I/O ring supporting a variety of single-ended and differential I/O standards. This hybrid fabric allows designers to implement glue logic, state machines, and memory-intensive megafunctions on a single chip while preserving deterministic timing for the FPGA fabric. The 0.22 µm process provides mature, low-power operation with extensive third-party tool support from the legacy Altera MAX+PLUS II and Quartus flows.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, PCI interface bridging, prototype ASIC replacement, and low-volume embedded systems requiring on-chip memory and flexible I/O voltage. The 144-TQFP footprint supports a hand-solderable, low-cost PCB assembly process that is well suited to industrial and legacy designs.
When designing with this device, ensure the Quartus or MAX+PLUS II toolchain version is matched to the FLEX 10KE device support, because newer Quartus releases have removed legacy FLEX device support. For new designs, consider migrating to the MAX II or Cyclone families, since FLEX 10KE is a mature, last-time-buy product line.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog, and design considerations not collected in a single place in the manufacturer datasheet.
Drop-in alternatives for EPF10K30ETI144-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30ETI144-2N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30ETI144-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$41.5 / Unit
View Datasheet →EPF10K30ETC144-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$14.25 / Unit
View Datasheet →EPF10K30ETC144-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$37.8 / Unit
View Datasheet →EPF10K30ETC144-3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$26.75 / Unit
View Datasheet →EPF10K30ETC144-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$35.2 / Unit
View Datasheet →EPF10K30ETI144-2N Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Series | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| User I/O Pins | 102 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| Package | 144-pin TQFP (LQFP-144) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 |
| Lead-Free (N suffix) | Yes |
EPF10K30ETI144-2N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | VCCIO1 — I/O supply for bank 1 (MultiVolt: 2.5/3.3/5.0 V) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | I/O — User I/O pin (bank 1) |
| Pin 21 | I/O — User I/O pin (bank 1) |
| Pin 22 | I/O — User I/O pin (bank 1) |
| Pin 23 | I/O — User I/O pin (bank 1) |
| Pin 24 | I/O — User I/O pin (bank 1) |
| Pin 25 | GND — Ground |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | I/O — User I/O pin (bank 2) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | I/O — User I/O pin (bank 2) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | VCCIO2 — I/O supply for bank 2 (MultiVolt: 2.5/3.3/5.0 V) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | I/O — User I/O pin (bank 2) |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | I/O — User I/O pin (bank 2) |
| Pin 43 | I/O — User I/O pin (bank 2) |
| Pin 44 | I/O — User I/O pin (bank 2) |
| Pin 45 | I/O — User I/O pin (bank 2) |
| Pin 46 | I/O — User I/O pin (bank 2) |
| Pin 47 | I/O — User I/O pin (bank 2) |
| Pin 48 | I/O — User I/O pin (bank 2) |
| Pin 49 | GND — Ground |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | I/O — User I/O pin (bank 3) |
| Pin 58 | I/O — User I/O pin (bank 3) |
| Pin 59 | I/O — User I/O pin (bank 3) |
| Pin 60 | I/O — User I/O pin (bank 3) |
| Pin 61 | I/O — User I/O pin (bank 3) |
| Pin 62 | VCCIO3 — I/O supply for bank 3 (MultiVolt: 2.5/3.3/5.0 V) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | I/O — User I/O pin (bank 3) |
| Pin 66 | I/O — User I/O pin (bank 3) |
| Pin 67 | I/O — User I/O pin (bank 3) |
| Pin 68 | I/O — User I/O pin (bank 3) |
| Pin 69 | I/O — User I/O pin (bank 3) |
| Pin 70 | I/O — User I/O pin (bank 3) |
| Pin 71 | I/O — User I/O pin (bank 3) |
| Pin 72 | I/O — User I/O pin (bank 3) |
| Pin 73 | GND — Ground |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 4) |
| Pin 76 | I/O — User I/O pin (bank 4) |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | I/O — User I/O pin (bank 4) |
| Pin 81 | I/O — User I/O pin (bank 4) |
| Pin 82 | I/O — User I/O pin (bank 4) |
| Pin 83 | I/O — User I/O pin (bank 4) |
| Pin 84 | I/O — User I/O pin (bank 4) |
| Pin 85 | I/O — User I/O pin (bank 4) |
| Pin 86 | VCCIO4 — I/O supply for bank 4 (MultiVolt: 2.5/3.3/5.0 V) |
| Pin 87 | I/O — User I/O pin (bank 4) |
| Pin 88 | I/O — User I/O pin (bank 4) |
| Pin 89 | I/O — User I/O pin (bank 4) |
| Pin 90 | I/O — User I/O pin (bank 4) |
| Pin 91 | I/O — User I/O pin (bank 4) |
| Pin 92 | I/O — User I/O pin (bank 4) |
| Pin 93 | I/O — User I/O pin (bank 4) |
| Pin 94 | I/O — User I/O pin (bank 4) |
| Pin 95 | I/O — User I/O pin (bank 4) |
| Pin 96 | I/O — User I/O pin (bank 4) |
| Pin 97 | GND — Ground |
| Pin 98 | TDI — JTAG Test Data In |
| Pin 99 | TMS — JTAG Test Mode Select |
| Pin 100 | TCK — JTAG Test Clock |
| Pin 101 | nCONFIG — Configuration control (active low) |
| Pin 102 | VCCINT — Core supply (2.5 V) |
| Pin 103 | nSTATUS — Configuration status (active low) |
| Pin 104 | CONF_DONE — Configuration done indicator |
| Pin 105 | DCLK — Configuration clock input |
| Pin 106 | DATA0 — Configuration data input (LSB) |
| Pin 107 | GND — Ground |
| Pin 108 | VCCINT — Core supply (2.5 V) |
| Pin 109 | DATA1 — Configuration data input |
| Pin 110 | DATA2 — Configuration data input |
| Pin 111 | DATA3 — Configuration data input |
| Pin 112 | DATA4 — Configuration data input |
| Pin 113 | DATA5 — Configuration data input |
| Pin 114 | DATA6 — Configuration data input |
| Pin 115 | DATA7 — Configuration data input (MSB) |
| Pin 116 | GND — Ground |
| Pin 117 | CLK0 — Clock input 0 |
| Pin 118 | CLK1 — Clock input 1 |
| Pin 119 | CLK2 — Clock input 2 |
| Pin 120 | VCCINT — Core supply (2.5 V) |
| Pin 121 | GND — Ground |
| Pin 122 | I/O — User I/O pin (bank 4) |
| Pin 123 | I/O — User I/O pin (bank 4) |
| Pin 124 | I/O — User I/O pin (bank 1) |
| Pin 125 | I/O — User I/O pin (bank 1) |
| Pin 126 | I/O — User I/O pin (bank 1) |
| Pin 127 | I/O — User I/O pin (bank 1) |
| Pin 128 | I/O — User I/O pin (bank 1) |
| Pin 129 | I/O — User I/O pin (bank 1) |
| Pin 130 | I/O — User I/O pin (bank 1) |
| Pin 131 | I/O — User I/O pin (bank 1) |
| Pin 132 | I/O — User I/O pin (bank 1) |
| Pin 133 | I/O — User I/O pin (bank 1) |
| Pin 134 | I/O — User I/O pin (bank 1) |
| Pin 135 | I/O — User I/O pin (bank 1) |
| Pin 136 | I/O — User I/O pin (bank 1) |
| Pin 137 | I/O — User I/O pin (bank 1) |
| Pin 138 | I/O — User I/O pin (bank 1) |
| Pin 139 | I/O — User I/O pin (bank 1) |
| Pin 140 | I/O — User I/O pin (bank 1) |
| Pin 141 | I/O — User I/O pin (bank 1) |
| Pin 142 | I/O — User I/O pin (bank 1) |
| Pin 143 | I/O — User I/O pin (bank 1) |
| Pin 144 | I/O — User I/O pin (bank 1) |
Typical Applications
EPF10K30ETI144-2N is suitable for 6 applications: Industrial Control and Factory Automation, Telecommunications Line-Card Glue Logic, PCI Interface Bridge and Adapter Cards, ASIC Replacement and Prototype Emulation, Legacy Embedded Systems and Long-Lifecycle Industrial Designs, Education, Hobby and Legacy Design Reproduction.
Industrial Control and Factory Automation
The EPF10K30ETI144-2N suits industrial control designs because of its industrial temperature range (-40 °C to +85 °C) and 102 user I/O pins, which can absorb the multiple sensor inputs, relay-driver outputs, and isolated communication links typical of a PLC or machine controller. The FLEX 10KE embedded array blocks (EABs, 24,576 bits of synchronous dual-port RAM) handle FIFOs, control tables, and protocol buffers without external memory, reducing board complexity. The MultiVolt I/O interface supports 5 V tolerant inputs on a 2.5 V core supply, allowing direct connection to legacy 5 V industrial sensors and HMI displays. Designers should budget clock-tree margin and use the JTAG boundary-scan to validate solder joints during factory production.
Recommended
Telecommunications Line-Card Glue Logic
Telecommunications line cards require deterministic glue logic between a framer, TDM switch, and backplane SERDES. The EPF10K30ETI144-2N provides 1,728 logic elements for cell/packet delineation, alarm monitoring, and watchdog functions, with the embedded EABs implementing small FIFOs that smooth TDM bursts at line rates up to 200 MHz. The PCI-compliant I/O buffers (3.3 V/33 MHz) allow direct connection to a backplane processor through the PCI bus, while the slew-rate-controlled outputs reduce EMI on the densely populated line card. Pair the device with an EPM7128A CPLD for power-up sequencing and an EPC2 configuration PROM for in-system reprogrammability.
Recommended
PCI Interface Bridge and Adapter Cards
The EPF10K30ETI144-2N is a natural fit for legacy PCI adapter cards, where its PCI-compliant I/O buffers (3.3 V, 33 MHz, 102 user I/O) implement the 32-bit PCI target or master interface, plus local bus glue logic, scatter-gather DMA engines, and on-chip FIFOs. The 24,576 bits of embedded SRAM provide the data-path buffer between PCI bursts and the local bus, while the 0.22 µm CMOS process keeps active power within the PCI 5 V signaling budget. For a 5 V PCI slot, set VCCIO to 5.0 V; for a 3.3 V Universal PCI slot, set VCCIO to 3.3 V. Add a resistive divider on the JTAG chain to allow in-system programming through the PCI backplane.
Recommended
ASIC Replacement and Prototype Emulation
For ASIC replacement and rapid prototyping, the EPF10K30ETI144-2N provides 30,000 gates of logic plus 24 Kbits of on-chip memory, which is sufficient to emulate most sub-system-level ASICs for low-to-medium volume production. Designers can iterate on the Quartus or MAX+PLUS II netlist, then port the verified logic to an ASIC for cost reduction in high volume. The 144-TQFP package is hand-solderable and breadboard-friendly for prototype builds, while the same die is available in 256-FBGA and 484-FBGA packages for the final production design. The FLEX 10KE embedded array blocks also support megafunctions such as multipliers and microsequencers.
Recommended
Legacy Embedded Systems and Long-Lifecycle Industrial Designs
Long-lifecycle industrial designs (e.g., medical, aerospace, transportation) that were prototyped in the late 1990s and early 2000s often lock in the FLEX 10KE silicon to avoid re-validation. The EPF10K30ETI144-2N preserves the design's binary compatibility, the JTAG programming flow, and the existing PCB layout. The MultiVolt I/O bank allows direct connection to 5 V and 3.3 V peripherals on the same board, while the industrial temperature range ensures operation in uncontrolled environments. For maintenance and repair, the EPC2 configuration PROM provides in-system programming, and the 144-TQFP package can be reworked with standard hot-air stations.
Recommended
Education, Hobby and Legacy Design Reproduction
The EPF10K30ETI144-2N is well suited to university FPGA labs, hobby projects, and the reproduction of legacy designs that target the FLEX 10KE family. The 144-TQFP is hand-solderable on a 0.5 mm pitch, and the legacy MAX+PLUS II and Quartus toolchains (older versions) still support the FLEX 10KE device, allowing students to learn first-generation FPGA design flows including Logic Element mapping, EAB megafunction instantiation, and JTAG configuration. The 30,000-gate complexity is large enough for teaching soft-core microcontrollers, simple DSP, and bus architectures but small enough to keep synthesis times short on a laptop.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30ETI144-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30ETI144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-3N | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster Fmax) | -3 (faster Fmax) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free (Pb-free) | Yes (N suffix) | No | Yes | No | Yes | No |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process / Family | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE |
Key Differentiators
- Industrial temperature range with Pb-free packaging (vs EPF10K30ETC144-2N)
- Pb-free (N suffix) for RoHS-compliant reflow assembly (vs EPF10K30ETI144-2)
- Speed grade -2 with stable timing closure margin (vs EPF10K30ETC144-3N)
Design Notes
The FLEX 10KE family uses a 2.5 V VCCINT core and a separate MultiVolt VCCIO supply per I/O bank (2.5/3.3/5.0 V). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk capacitor per bank. For mixed-voltage designs, set VCCIO independently per bank to allow 5 V peripherals on bank 1 and 3.3 V peripherals on bank 2 without external level shifters.
Newer Quartus versions (15.0 and later) have removed FLEX 10KE device support. Use Quartus II 13.0sp1 or earlier, or the legacy MAX+PLUS II toolchain, to synthesize for this device. For new designs, plan a migration path to the MAX II CPLD or Cyclone FPGA families before committing the PCB layout.
Route the JTAG chain (TCK/TMS/TDO/TDI) as a daisy chain with each device's TDO feeding the next device's TDI; keep the chain length under 6 inches to stay below the 10 MHz TCK limit of the Altera ByteBlaster. Add 4.7 kΩ pull-ups on TMS, TDI, and nCONFIG to VCCIO to ensure a defined idle state during board power-up. Decouple the configuration PROM (EPC2LC20N) with 0.1 µF + 10 µF and route DCLK as a short, impedance-controlled trace to minimize configuration timing violations.
Compliance Information
The 'N' suffix indicates Pb-free reflow-compatible lead finish per the Altera ordering information. RoHS/REACH/AEC-Q100 explicit status is not stated in the provided data and is marked unknown. FPGAs in this family are not typically AEC-Q100 qualified - this part is intended for industrial (not automotive) designs.
