Intel

EPF10K50ETC144-3 - FLEX 10KE 50K Gates 144-TQFP FPGA | Intel

MPN: EPF10K50ETC144-3 ✗ End of Life

In Stock Ships in 1-3 business days

2.5 V Vdss 102 Package 166.67 MHz Speed 40,960 bits Memory

From $29.9 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$45.5	$45.50
10	$41.2	$412.00
100	$37.8	$3,780.00
500	$33.5	$16,750.00
1,000	$29.9	$29,900.00

ℹ️ All prices are in USD

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EPF10K50ETC144-3 Overview

The Intel (formerly Altera) EPF10K50ETC144-3 is a member of the FLEX 10KE family of embedded programmable logic devices (PLDs), providing System-on-a-Programmable-Chip (SOPC) integration with 50,000 typical gates, 2,880 logic cells, 40,960 bits of embedded memory, and 360 LABs/CLBs in a 144-pin TQFP (also referenced as TQFP-144) surface-mount package.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O cells are defined by a user-supplied bitstream after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) - alongside CPLDs, PALs, and GALs - and represent the highest-density, highest-performance tier used for glue logic, custom DSP, ASIC prototyping, and full system integration. The FLEX 10KE family pioneered embedded-array architecture, combining look-up-table based logic with embedded memory blocks and Embeddable Logic Array Blocks (EABs) to deliver a System-on-a-Programmable-Chip (SOPC) integration platform that pre-dated modern SoC FPGAs.

Key features include 102 user I/O pins (274 maximum in the family), 0.22 µm CMOS process technology, 166.67 MHz maximum internal frequency, 0.6 ns propagation delay, 2.5 V core supply, and SameFrame pin compatibility across the FLEX 10KE family for design migration. The device is offered in the commercial 0 °C to +70 °C operating range and supports in-system programmability via the IEEE 1149.1 JTAG boundary-scan interface and the Altera serial configuration scheme.

The EPF10K50ETC144-3 is built on a 0.22 µm four-metal-layer CMOS process, with 3.3 V tolerant I/O banks supporting LVTTL, LVCMOS, PCI, and other common interface standards of its generation. Its SRAM-based configuration memory allows unlimited reconfiguration but requires a configuration PROM or microcontroller to load the bitstream at power-up. The -3 speed grade corresponds to a faster device-bin than the -4 grade, enabling higher Fmax for clocked logic paths.

Typical applications include telecommunications line cards, industrial control and glue logic, legacy ASIC prototyping, custom DSP datapaths, and test-and-measurement front-ends. Designers value the FLEX 10KE family for deterministic pin-to-pin timing and abundant memory for small to medium-density designs where modern FPGA tools would be overkill. The 144-pin TQFP package also makes the part hand-solderable for prototyping.

When designing with this part, note that the SRAM configuration cells must be loaded from a serial or parallel PROM on every power-up; plan a configuration clock source and ensure all unused I/O pins are configured as inputs with weak pull-ups to avoid floating-input quiescent current. The SameFrame pin migration path is supported only with the 484-pin FineLine BGA package, so TQFP-144 designs are not directly migratable to higher I/O-count packages without board rework.

This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives within the FLEX 10KE family, and practical design notes not found in the manufacturer datasheet - all cross-referenced against XAIPART's internal FLEX 10K part database.

Drop-in alternatives for EPF10K50ETC144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K50ETC144-3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Embedded Array Blocks (EABs), Series.

EPF10K30ETC144-2

Intel

Package: 144-LQFP (TQFP, 20x20 mm)

Operating Temperature: 0C to +70C (Commercial)

Process Technology: CMOS, SRAM-based