EPF10K50STC144-2 - 50K Gates FLEX-10KS FPGA, 102 I/O, 144-TQFP | Intel
MPN: EPF10K50STC144-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $22 | $2,200.00 |
| 500 | $19.5 | $9,750.00 |
| 1,000 | $17.8 | $17,800.00 |
EPF10K50STC144-2 Overview
A Field Programmable Gate Array (FPGA) is a type of Programmable Logic Device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single semiconductor die. The FLEX-10KS architecture sits within the broader hierarchy: PLD -> FPGA -> Complex Programmable Logic Device (CPLD) hybrid family. The FLEX-10KS is notable as one of the first System-on-a-Programmable-Chip (SOPC) capable families, integrating an embedded array block for RAM and ROM functions alongside the logic array.
Key features include in-system programmability via SRAM configuration cells (allowing reconfiguration without removing the device), support for multiple I/O standards (LVTTL, LVCMOS, PCI), and an internal frequency specification of 66.67 MHz. The device operates on a 5.0 V core supply and supports JTAG-based boundary-scan testing per IEEE 1149.1. The package is a 144-pin Low-profile Fine-pitch Quad Flat Pack (LQFP/TQFP), surface mount, gull-wing lead form.
The FLEX-10KS architecture uses a CMOS logic fabric with continuous interconnect routing channels between LABs. Each LAB contains ten Logic Elements (LEs), each comprising a 4-input look-up table, a programmable register, and a dedicated carry chain. The embedded array blocks (EABs) provide 2 Kbit of dual-port RAM per block and can be cascaded to form larger memory structures, which was a distinctive feature at the time of introduction.
Typical applications include glue logic replacement, custom interface bridging (e.g., PCI to legacy bus), industrial control systems, telecommunications line cards, and prototype ASIC emulation. The 102 I/O count is well suited to designs requiring moderate external connectivity, such as multi-port memory controllers or parallel data acquisition systems.
When designing with the EPF10K50STC144-2, engineers should pay attention to configuration mode selection (Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, or JTAG) and ensure the nCONFIG and nSTATUS pins have proper pull-up resistors during power-up sequencing. The SRAM-based configuration means the device must be reconfigured on every power-up unless an external configuration memory is used.
This page synthesizes distributor pricing, drop-in compatible FLEX-10KS variants, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K50STC144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50STC144-2 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Series, Embedded Array Blocks (EABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50ETC144-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K50ETI144-2
✅ Drop-In✓ In Stock
$26.1 / Unit
View Datasheet →EPF10K50ETC144-3
✅ Drop-In✓ In Stock
$29.9 / Unit
View Datasheet →EPF10K50ETC144-1
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EPF10K30ETC144-3
✅ Drop-In✓ In Stock
$35.2 / Unit
View Datasheet →EPF10K50STC144-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KS |
| Manufacturer | Intel (formerly Altera) |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gate Count | 50,000 gates |
| Logic Elements | 2,880 |
| Embedded RAM | 40,960 bits |
| Logic Array Blocks (LABs) | 360 |
| User I/O Pins | 102 |
| Embedded Array Blocks (EABs) | 20 (per datasheet family) |
| Maximum Internal Frequency | 66.67 MHz |
| Propagation Delay | 0.6 ns |
| Logic Family | CMOS |
| Core Voltage | 5.0 V |
| Package | 144-TQFP (TQFP-144, 20x20 mm) |
| Terminal Form | Gull Wing |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Temperature Grade | Commercial |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM-based (volatile) |
| Programming Interface | JTAG (IEEE 1149.1), Passive Serial/Parallel |
EPF10K50STC144-2 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | I/O — User I/O pin (bank 2) |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | I/O — User I/O pin (bank 2) |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | I/O — User I/O pin (bank 2) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 3) |
| Pin 34 | I/O — User I/O pin (bank 3) |
| Pin 35 | I/O — User I/O pin (bank 3) |
| Pin 36 | I/O — User I/O pin (bank 3) |
| Pin 37 | I/O — User I/O pin (bank 3) |
| Pin 38 | I/O — User I/O pin (bank 3) |
| Pin 39 | I/O — User I/O pin (bank 3) |
| Pin 40 | I/O — User I/O pin (bank 3) |
| Pin 41 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | I/O — User I/O pin (bank 3) |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 4) |
| Pin 50 | I/O — User I/O pin (bank 4) |
| Pin 51 | I/O — User I/O pin (bank 4) |
| Pin 52 | I/O — User I/O pin (bank 4) |
| Pin 53 | I/O — User I/O pin (bank 4) |
| Pin 54 | I/O — User I/O pin (bank 4) |
| Pin 55 | I/O — User I/O pin (bank 4) |
| Pin 56 | I/O — User I/O pin (bank 4) |
| Pin 57 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 58 | I/O — User I/O pin (bank 4) |
| Pin 59 | I/O — User I/O pin (bank 4) |
| Pin 60 | I/O — User I/O pin (bank 4) |
| Pin 61 | I/O — User I/O pin (bank 4) |
| Pin 62 | I/O — User I/O pin (bank 4) |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | GND — Ground |
| Pin 66 | I/O — User I/O pin (bank 4) |
| Pin 67 | I/O — User I/O pin (bank 4) |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 5) |
| Pin 76 | I/O — User I/O pin (bank 5) |
| Pin 77 | I/O — User I/O pin (bank 5) |
| Pin 78 | I/O — User I/O pin (bank 5) |
| Pin 79 | I/O — User I/O pin (bank 5) |
| Pin 80 | I/O — User I/O pin (bank 5) |
| Pin 81 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 82 | I/O — User I/O pin (bank 5) |
| Pin 83 | I/O — User I/O pin (bank 5) |
| Pin 84 | I/O — User I/O pin (bank 5) |
| Pin 85 | I/O — User I/O pin (bank 5) |
| Pin 86 | I/O — User I/O pin (bank 5) |
| Pin 87 | I/O — User I/O pin (bank 5) |
| Pin 88 | I/O — User I/O pin (bank 5) |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | I/O — User I/O pin (bank 5) |
| Pin 91 | I/O — User I/O pin (bank 6) |
| Pin 92 | I/O — User I/O pin (bank 6) |
| Pin 93 | I/O — User I/O pin (bank 6) |
| Pin 94 | I/O — User I/O pin (bank 6) |
| Pin 95 | I/O — User I/O pin (bank 6) |
| Pin 96 | I/O — User I/O pin (bank 6) |
| Pin 97 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 98 | I/O — User I/O pin (bank 6) |
| Pin 99 | I/O — User I/O pin (bank 6) |
| Pin 100 | I/O — User I/O pin (bank 6) |
| Pin 101 | I/O — User I/O pin (bank 6) |
| Pin 102 | I/O — User I/O pin (bank 6) |
| Pin 103 | I/O — User I/O pin (bank 6) |
| Pin 104 | I/O — User I/O pin (bank 6) |
| Pin 105 | I/O — User I/O pin (bank 7) |
| Pin 106 | I/O — User I/O pin (bank 7) |
| Pin 107 | I/O — User I/O pin (bank 7) |
| Pin 108 | I/O — User I/O pin (bank 7) |
| Pin 109 | I/O — User I/O pin (bank 7) |
| Pin 110 | I/O — User I/O pin (bank 7) |
| Pin 111 | I/O — User I/O pin (bank 7) |
| Pin 112 | I/O — User I/O pin (bank 7) |
| Pin 113 | VCCIO7 — I/O bank 7 supply voltage |
| Pin 114 | I/O — User I/O pin (bank 7) |
| Pin 115 | I/O — User I/O pin (bank 7) |
| Pin 116 | I/O — User I/O pin (bank 7) |
| Pin 117 | I/O — User I/O pin (bank 7) |
| Pin 118 | I/O — User I/O pin (bank 7) |
| Pin 119 | I/O — User I/O pin (bank 7) |
| Pin 120 | I/O — User I/O pin (bank 7) |
| Pin 121 | I/O — User I/O pin (bank 8) |
| Pin 122 | I/O — User I/O pin (bank 8) |
| Pin 123 | I/O — User I/O pin (bank 8) |
| Pin 124 | I/O — User I/O pin (bank 8) |
| Pin 125 | I/O — User I/O pin (bank 8) |
| Pin 126 | I/O — User I/O pin (bank 8) |
| Pin 127 | I/O — User I/O pin (bank 8) |
| Pin 128 | I/O — User I/O pin (bank 8) |
| Pin 129 | VCCINT — Internal core supply voltage (5.0 V) |
| Pin 130 | GND — Ground |
| Pin 131 | nCONFIG — Configuration control (active-low reset) |
| Pin 132 | nSTATUS — Configuration status (active-low) |
| Pin 133 | CONF_DONE — Configuration complete (open-drain) |
| Pin 134 | MSEL0 — Configuration mode select 0 |
| Pin 135 | MSEL1 — Configuration mode select 1 |
| Pin 136 | MSEL2 — Configuration mode select 2 |
| Pin 137 | nCE — Chip enable (active-low) |
| Pin 138 | nCEO — Chip enable output (active-low, for multi-device config) |
| Pin 139 | TCK — JTAG test clock |
| Pin 140 | TMS — JTAG test mode select |
| Pin 141 | TDI — JTAG test data in |
| Pin 142 | TDO — JTAG test data out |
| Pin 143 | DCLK — Configuration clock input |
| Pin 144 | DATA0 — Configuration data input 0 |
Typical Applications
EPF10K50STC144-2 is suitable for 6 applications: Legacy PCI Interface Bridging, Industrial Control and PLC Systems, Telecommunications Line Cards, ASIC Prototype Emulation, Test and Measurement Instrumentation, Legacy Replacement and Sustainment Programs.
Legacy PCI Interface Bridging
The EPF10K50STC144-2 is well suited to legacy PCI bus interface bridging designs where its 50K-gate capacity and 102 user I/O pins comfortably accommodate 32-bit PCI target or master controllers plus custom register logic. Per the manufacturer datasheet, the device supports 5.0 V PCI signaling directly, eliminating the need for external level translators. The 66.67 MHz internal frequency is sufficient for 33 MHz PCI operation. The 360 LABs and 40,960 embedded RAM bits enable implementation of FIFOs and configuration registers in a single device.
Recommended
Industrial Control and PLC Systems
For industrial control and PLC systems, the EPF10K50STC144-2 provides reliable logic consolidation in a 144-pin TQFP surface-mount package with commercial 0-70 C operating range. The 50K-gate density can absorb multiple discrete-logic ICs (74-series glue logic, counters, state machines) onto a single FPGA, reducing BOM cost and PCB area. Per the manufacturer datasheet, the SRAM-based configuration allows field reprogramming for firmware updates, and the JTAG (IEEE 1149.1) interface supports boundary-scan manufacturing test for production line coverage.
Recommended
Telecommunications Line Cards
The EPF10K50STC144-2 was widely deployed in telecom line-card designs of the late 1990s and early 2000s, where its 50K-gate capacity and embedded RAM (40,960 bits) fit protocol conversion, framing, and HDLC controllers. Per the FLEX-10KS datasheet, the embedded array blocks (EABs) can be configured as dual-port RAM, ideal for buffer storage in T1/E1 and ISDN interface designs. The 102 user I/O pins support multiple serial data ports plus microprocessor bus interfaces in a single chip.
Recommended
ASIC Prototype Emulation
For pre-silicon ASIC prototyping, the EPF10K50STC144-2 provides enough logic capacity to emulate designs up to approximately 30K-40K usable gates, with the SRAM-based configuration enabling rapid design-iteration cycles. The 102 I/O pins support prototyping of moderate-complexity ASICs interfacing to external memory and peripherals. Per the manufacturer datasheet, in-system programmability via JTAG allows engineers to swap designs in seconds without removing the device from the test board.
Recommended
Test and Measurement Instrumentation
In test-and-measurement equipment, the EPF10K50STC144-2 is used to implement custom timing generators, pattern generators, and protocol-analyzer state machines. Per the FLEX-10KS datasheet, the 66.67 MHz internal frequency supports real-time stimulus generation up to that rate, and the 0.6 ns propagation delay enables precise timing control. The 40,960 bits of embedded RAM allow deep sample buffers to be implemented on-chip, reducing external memory requirements and lowering system cost in bench instruments.
Recommended
Legacy Replacement and Sustainment Programs
The EPF10K50STC144-2 is commonly specified in defense, aerospace, and industrial sustainment programs where long-lifecycle equipment requires functional equivalent replacements for decades-old designs. Per the manufacturer datasheet, the 144-pin TQFP package is well supported by assembly lines worldwide and the SRAM-based configuration can be loaded from on-board EPROM or microcontroller, allowing field upgrades without PCB redesign. The commercial 0-70 C temperature range suits benign-environment deployments and rack-mounted industrial systems.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50STC144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50ETC144-2 | EPF10K50ETI144-2 | EPF10K50ETC144-3 | EPF10K50ETC144-1 | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 (20x20 mm) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) |
| Embedded RAM | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 24,576 bits (-40%) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 (same) | -2 (same) | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Commercial (0 to 70 C) | Commercial | Industrial (-40 to +85 C) | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher logic and memory density than EPF10K30 family in same footprint (vs EPF10K30ETC144-3)
- Commercial temperature grade matches sustainment-program deployments (vs EPF10K50ETI144-2)
- Same die as EPF10K50ETC144-2 with identical functionality (vs EPF10K50ETC144-2)
Design Notes
Estimated: The EPF10K50STC144-2 requires a stable 5.0 V core supply on VCCINT (pin 129) and per-bank VCCIO supplies (3.3 V or 5.0 V) on VCCIO1 through VCCIO8 (pins 9, 25, 41, 57, 81, 97, 113). Each VCCIO pin should be bypassed with a 0.1 uF ceramic capacitor placed as close to the IC as possible, plus a bulk 10 uF tantalum capacitor for transient suppression. Power sequencing is not strictly required between VCCINT and VCCIO, but both rails must be present before configuration begins.
Place all eight VCCIO bypass capacitors within 100 mils (2.54 mm) of their respective VCCIO pins to minimize lead inductance. The TQFP-144 package has a thermal pad requirement only on certain variants; for the EPF10K50STC144-2 the center paddle is absent, so copper pour under the package is for ground stitching rather than heat sinking. Use at least a 4-layer PCB with dedicated ground and power planes to ensure signal integrity at 66.67 MHz internal clock rates.
Configuration will not start if nCONFIG (pin 131) is held low at power-up; tie it to VCCINT through a 10 kohm pull-up resistor. Similarly, nSTATUS (pin 132) and CONF_DONE (pin 133) are open-drain outputs requiring external pull-ups to VCCINT. MSEL0/1/2 (pins 134-136) must be tied to VCCINT or GND according to the desired configuration mode (PS, PPS, PPA, or JTAG-only) before power-up - they are sampled on the rising edge of nCONFIG.
For high-speed designs approaching the 66.67 MHz internal frequency, route JTAG signals TCK/TMS/TDI/TDO (pins 139-142) away from switching I/O lines and add 22-ohm series termination on TCK if trace length exceeds 50 mm. Configure unused I/O pins as outputs driving ground to minimize power consumption and prevent floating inputs from causing shoot-through in the I/O cell. The TQFP-144 lead pitch is 0.5 mm, requiring fine-pitch PCB fabrication with at least 4 mil trace/space rules.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status could not be confirmed from the verified web data for this obsolete FLEX-10KS family part. AEC-Q100 is not applicable (commercial-grade FPGA, not automotive-qualified).