EPF10K50GC403-4 - FLEX 10KA FPGA, 50K Gates, 403-Pin CPGA | Altera
MPN: EPF10K50GC403-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68.5 | $34,250.00 |
| 1,000 | $62 | $62,000.00 |
EPF10K50GC403-4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement arbitrary digital logic. Within the broader semiconductor taxonomy, an FPGA is a type of programmable logic device (PLD), itself a sub-category of digital logic ICs and ultimately a member of integrated circuits used for digital computation and signal processing. The FLEX 10KA family was the industry's first family to deliver System-on-a-Programmable-Chip (SOPC) integration, combining embedded array blocks (EABs) for memory and specialized megafunctions with general-purpose logic.
Key features include 20 embedded array blocks (EABs) for implementing efficient memory and specialized logic functions, multiVolt I/O supporting 3.3 V and 5 V interfaces, JTAG boundary-scan testing per IEEE 1149.1, and in-system programmability via the built-in SRAM configuration memory. The device's SRAM-based configuration allows unlimited re-programming in the field, making it suitable for prototyping, hardware emulation, and design revisions late in the product lifecycle. It is fully supported by the Altera MAX+PLUS II and Quartus design flows, with comprehensive synthesis, simulation, and timing-analysis tool support.
The architecture combines a logic array, embedded array, and fast interconnect network. The embedded array is implemented by EABs that can be configured as ROM, RAM, dual-port RAM, or first-in-first-out (FIFO) buffers, providing megafunctions such as multipliers, microcontrollers, and DSP primitives. The logic array implements general combinatorial and sequential logic. FastTrack interconnect provides predictable, low-skew routing for high-fanout nets and clock distribution.
Typical applications include glue logic replacement, custom interface bridging (PCI, ISA, UART, I2C, SPI), telecom line-card controllers, industrial control and automation logic, prototyping for ASIC designs, and embedded DSP co-processing. The 403-pin CPGA package is chosen for applications requiring high pin count and reliable through-hole soldering, including legacy industrial systems, military, and aerospace platforms where ceramic packaging offers superior hermeticity and thermal performance.
When designing with this device, ensure that the configuration scheme (EPC, microcontroller, or JTAG) is provisioned in the board design and that the JTAG chain order is documented for boundary-scan testing. For new designs, engineers should evaluate the migration path to the Altera Cyclone series, which offers higher logic density, lower power, and modern package options at significantly lower cost.
This page synthesizes distributor availability, drop-in alternatives from the FLEX 10K family, and practical design notes not collected in the original FLEX 10KA datasheet.
Drop-in alternatives for EPF10K50GC403-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50GC403-4 (same form factor and footprint) — differing in Embedded Array Blocks (EABs), Family, Package, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50GC403-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$68 / Unit
View Datasheet →EPF10K50GC403-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KA |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| Embedded Array Blocks (EABs) | 20 |
| Maximum Internal Clock Frequency | 125 MHz |
| Speed Grade | -4 |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage | 4.75 V to 5.25 V (5 V nominal) |
| I/O Standards | 3.3 V or 5 V configurable (multiVolt) |
| Package | 403-pin CPGA (Ceramic Pin Grid Array) |
| Mounting Type | Through-hole (CPGA) |
| Configuration Memory | SRAM (in-system programmable) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
EPF10K50GC403-4 403-pin cpga (ceramic pin grid array) Pin Configuration Guide
Pin configuration for EPF10K50GC403-4 (403-pin cpga (ceramic pin grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50GC403-4.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50GC403-4 is suitable for 6 applications: Telecom Line-Card Controller, Industrial Control and Automation Logic, ASIC Prototyping and Hardware Emulation, Custom Interface Bridging (PCI, ISA, UART, I2C, SPI), Legacy Military and Aerospace Systems, Embedded DSP Co-Processing.
Telecom Line-Card Controller
The EPF10K50GC403-4's 2,880 logic elements, 20 EABs providing 40 Kbits of embedded memory, and 5 V multiVolt I/O make it well suited to telecom line-card glue logic and custom protocol bridging. Its 125 MHz internal clock supports T1/E1 framing, HDLC controllers, and time-slot interchangers with predictable timing closure in the -4 speed grade. Embedded array blocks implement lookup tables and small FIFOs without consuming general-purpose logic, allowing compact line-card designs that must fit on legacy backplanes with 5 V power. Unlike an ASIC, the EPF10K50GC403-4 allows late-stage protocol revisions via SRAM reconfiguration.
Recommended
Industrial Control and Automation Logic
Industrial PLCs and motion-control boards historically used the EPF10K50GC403-4 as a customizable logic hub for sensor aggregation, PWM generation, encoder decoding, and deterministic state machines. The 5 V supply tolerance matches legacy 24 V-to-5 V industrial rails, and the 403-pin CPGA package offers socketed field replacement - critical for factory-floor maintenance where downtime is expensive. The -4 speed grade's conservative timing margins provide margin against industrial temperature swings. Migration paths target modern Cyclone 10 LP for new designs.
Recommended
ASIC Prototyping and Hardware Emulation
The EPF10K50GC403-4 was widely used as an ASIC prototyping vehicle because its SRAM-based configuration allows unlimited design iterations before committing to mask production. A design team could map an ASIC's RTL onto one or more FLEX 10K devices running at near-real-time speeds, validating firmware and timing in parallel. The 20 EABs provide embedded memory for bus-functional models, and the 125 MHz headroom supports most ASIC clock domains. While modern ASIC prototyping favors large FPGAs like Stratix, the EPF10K50GC403-4 remains valuable for legacy emulation farms and educational labs.
Recommended
Custom Interface Bridging (PCI, ISA, UART, I2C, SPI)
Engineers used the EPF10K50GC403-4 to bridge mismatched bus protocols - for example, ISA-to-PCI, UART-to-SPI, or legacy parallel buses to modern serializers - without waiting for an ASIC spin. The 403-pin CPGA pin count supports wide data buses (32-bit data plus control), and the multiVolt I/O allows direct connection to both 3.3 V and 5 V peripherals on the same board. The 125 MHz clock rate and -4 grade timing closure accommodate moderate-bandwidth bridges (tens of MHz). For new designs, modern Cyclone IV E with PCI Express IP is preferred, but legacy cards retain the EPF10K50GC403-4 as a service part.
Recommended
Legacy Military and Aerospace Systems
The 403-pin ceramic CPGA package, hermetic sealing, and 5 V supply tolerance made the EPF10K50GC403-4 attractive for legacy military and aerospace platforms where reliability under thermal and vibration stress outweighs cost. EABs implement error-correction codecs and memory-mapped telemetry buffers, while the FPGA fabric hosts custom avionics interfaces. Obsolescence management programs maintain EPF10K50GC403-4 inventory for line-replaceable units on legacy aircraft, naval systems, and ground vehicles. For new aerospace programs, radiation-tolerant Microsemi (Microchip) RTG4 or Xilinx Virtex-5QV are recommended.
Recommended
Embedded DSP Co-Processing
The EPF10K50GC403-4's EABs implement high-speed multipliers, accumulators, and FIR filter primitives, allowing it to offload DSP workloads from a host microcontroller or DSP chip. With 125 MHz headroom and 20 EABs providing distributed multiply-accumulate resources, the device delivers tens of MMACs - sufficient for audio-band DSP, motor control loops, and basic modems. The SRAM-based configuration allows field updates to DSP firmware without board respin. New designs benefit from modern Cyclone V with dedicated DSP blocks, but EPF10K50GC403-4 remains common in legacy DSP co-processor boards.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50GC403-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50GC403-3 | EPF10K50ETC144-3 | EPF10K50EQC240-3 | EPF10K50EFC484-2 | EPF10K100GC503-3 |
|---|---|---|---|---|---|---|
| Package | 403-pin CPGA | 403-pin CPGA (same) | 144-pin TQFP | 240-pin QFP | 484-pin FBGA | 503-pin CPGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 4,992 |
| Typical Gates | 50K | 50K | 50K | 50K | 50K | 100K |
| Embedded Array Blocks (EABs) | 20 | 20 | 20 | 20 | 20 | 24 |
| Speed Grade | -4 | -3 (faster) | -3 (faster) | -3 (faster) | -2 (faster) | -3 (faster) |
| Maximum Internal Clock | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz | 125 MHz |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 2.5 V (10KE) | 5 V |
| Pin Compatibility | Reference | Drop-in (same 403-pin CPGA) | Not pin-compatible (different package) | Not pin-compatible (different package) | Not pin-compatible (FBGA) | Not pin-compatible (503 vs 403 pins) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Exact same-package drop-in upgrade with faster speed grade (vs EPF10K50GC403-3)
- Higher density in same CPGA family (vs EPF10K100GC503-3)
- 5 V supply supports legacy industrial backplanes (vs EPF10K50EFC484-2 (FLEX 10KE variant))
Design Notes
The EPF10K50GC403-4 requires a stable 5 V supply at 4.75 V to 5.25 V with adequate decoupling. Place 0.1 µF ceramic capacitors near every VCC pin and a single bulk 47 µF tantalum or aluminum polymer capacitor at the board's power entry point. During configuration the device draws higher transient current; the EPC configuration device should share the same 5 V rail with proper sequencing. Power-on ramp should be monotonic; voltage droops below 4.75 V during configuration can corrupt the bitstream and cause reconfiguration loops.
The 403-pin ceramic CPGA package has a typical θJA of approximately 18 °C/W (still air, no heatsink) per the FLEX 10KA datasheet. At maximum toggle activity on all I/O, internal junction temperatures can rise 30-40 °C above ambient. For industrial temperature grade (-40 °C to +85 °C ambient), ensure that worst-case power dissipation stays below 1.5 W to maintain junction below 125 °C. Forced-air cooling or a clip-on heatsink is recommended for sealed enclosures.
The CPGA package requires plated-through-hole sockets or soldered pin sockets for prototype bring-up. Use a quality machine-pin socket (e.g., 3M Textool or equivalent) rated for repeated insertion cycles. PCB pad geometry should match the 2.54 mm pin pitch standard. For soldered assemblies, use a grounded ESD wrist strap and a controlled-tip soldering iron to avoid thermal shock to the ceramic body. The exposed die side of the CPGA should not contact conductive surfaces.
Configuration failures are the most common EPF10K50GC403-4 design issue. Verify that the nCONFIG, nSTATUS, and CONF_DONE pins have proper pull-ups and that the JTAG chain order matches the Quartus programmer's expected sequence. The CONF_DONE pin must reach logic-high within the datasheet-specified configuration time or the device enters an error state. Always instantiate the altsyncram megafunction from the Quartus library for EAB-based memory rather than inferring it - inferred memory does not use EABs efficiently.
Route the global clock pins (CLK0-CLK3, or dedicated clock inputs per package variant) on the inner signal layers with a continuous ground plane beneath for controlled impedance. Keep clock traces under 50 mm with no more than two vias to minimize skew. For high-speed I/O (>50 MHz), use 50 Ω controlled-impedance traces with series damping resistors near the FPGA output. Separate analog and digital ground planes if the board mixes the FPGA with ADC/DAC components, joining them only at a single point near the FPGA's GND pins.
Compliance Information
CPGA package suggests non-RoHS lead-containing construction typical of legacy ceramic-packaged FPGAs. Compliance certifications were not found in the verified web data; consult Altera/Intel PSG legacy product documentation for definitive status. Part is marked obsolete.
