EPF10K100EQC240-3 - FLEX 10KE FPGA 100K Gates 2.5V | Intel
MPN: EPF10K100EQC240-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 500 | $61.2 | $30,600.00 |
| 1,000 | $55.5 | $55,500.00 |
EPF10K100EQC240-3 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect that engineers can reconfigure after manufacturing. FPGAs sit in the broader programmable logic device (PLD) hierarchy and are used as glue logic, prototyping vehicles, and small-to-medium volume ASIC replacements in industrial, telecommunications, and embedded systems. The FLEX 10KE family specifically extends the original FLEX 10K architecture by adding embedded system blocks (ESBs) for dual-port RAM and ROM functions.
Key features of the EPF10K100EQC240-3 include 624 logic array blocks (LABs), 12 embedded system blocks providing up to 24,576 RAM bits in dual-port mode, four phase-locked loops (PLLs) for clock management, and multi-voltage I/O support allowing 2.5 V, 3.3 V, or 5.0 V interface to surrounding logic. The -3 speed grade offers the fastest commercial timing closure available in the FLEX 10KE family, with pin-to-pin logic delays optimized through the Quartus II / MAX+PLUS II design software flow.
The device architecture combines look-up table (LUT)-based logic with FastTrack continuous routing and embedded array blocks (EABs), giving designers a flexible platform for implementing state machines, register-rich datapaths, and on-chip memory simultaneously. Four dedicated clock inputs and four PLL blocks support complex multi-clock domain designs common in telecommunications backplanes and industrial control.
Typical applications include telecommunications line cards, industrial control and factory automation, military and aerospace prototype designs, ASIC prototyping, and legacy replacement designs that were originally targeted at the FLEX 10KE platform. The wide PQFP package footprint is often chosen for hand-rework-friendly prototypes and through-hole-friendly adapter boards where BGA packages would be impractical.
When designing with this device, ensure the Quartus II (legacy) or MAX+PLUS II toolchain is available because newer Quartus Prime releases have dropped FLEX 10KE device support. JTAG boundary-scan is supported for in-system programming via the ByteBlasterMV or equivalent download cable. Decoupling strategy requires 0.1 µF capacitors at every VCCINT/VCCIO pin pair, with bulk capacitance sized for the SRAM configuration current during in-system reconfiguration.
This page synthesizes distributor stock and lead-time signals, verified drop-in same-package FLEX 10KE alternatives, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for EPF10K100EQC240-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC240-3 (same form factor and footprint) — differing in Family, Configuration Method, Operating Temperature, Total RAM Bits, Package / Case.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC240-2
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EPF10K100EQC240-2N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EPF10K100EQC240-2X
✅ Drop-In✓ In Stock
$62 / Unit
View Datasheet →EPF10K100EQC240-1
✅ Drop-In✓ In Stock
$18.5 / Unit
View Datasheet →EPF10K100BQC240-3
✅ Drop-In✓ In Stock
$16.95 / Unit
View Datasheet →EPF10K100EQC240-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements / Cells | 4,992 |
| Total Gates | 100,000 typical |
| Logic Array Blocks (LABs) | 624 |
| Total RAM Bits | 49,152 |
| Embedded System Blocks (ESBs) | 12 |
| User I/O Count | 189 |
| Core Voltage (VCCINT) | 2.5 V (±0.25 V) |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V |
| Operating Frequency (max) | 200 MHz |
| Process Technology | 0.25 µm SRAM |
| Package | 240-pin PQFP (32.1 × 32.1 mm) |
| Speed Grade | -3 (fastest commercial) |
| PLL Count | 4 |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Configuration Method | SRAM + JTAG / PS / AS modes |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Mounting Type | Surface Mount |
EPF10K100EQC240-3 240-pin pqfp (32.1 × 32.1 mm) Pin Configuration Guide
Pin configuration for EPF10K100EQC240-3 (240-pin pqfp (32.1 × 32.1 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K100EQC240-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K100EQC240-3 is suitable for 6 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping, Legacy Military and Aerospace Designs, Test and Measurement Instrumentation, Embedded Computing and Storage Controllers.
Telecommunications Line Cards
The EPF10K100EQC240-3 fits legacy telecommunications line-card designs that require moderate logic density, multi-voltage I/O for 5 V bus interfacing, and reliable SRAM-based reconfiguration. The device's 189 user I/Os and 4,992 logic elements provide capacity for implementing TDM bus multiplexers, HDLC controllers, and framer interfaces on a single chip. Its 240-pin PQFP package simplifies hand-rework and field replacement on legacy telecom backplanes, while the four PLLs support multiple E1/T1 clock domains from a single reference. Designers should note the 2.5 V core draw requires a dedicated LDO rather than the legacy 3.3 V rail, and that NRND status requires long-term buffer stock planning.
Recommended
Industrial Control and Factory Automation
In industrial PLC, motor drive, and SCADA controller platforms, the EPF10K100EQC240-3 provides enough logic capacity for PID control loops, encoder interfaces, and fieldbus protocol bridges without external ASICs. Its 5 V-tolerant I/O banks allow direct connection to legacy 24 V optically-isolated industrial I/O via standard buffers. The 100K-gate density and 49,152 RAM bits accommodate multi-axis motion-control state machines and runtime-configurable firmware overlays via JTAG. Engineers should pair this device with industrial-temperature support logic since the -3 speed grade is commercial-only; for harsh environments the -2N or -1N speed grades are mandatory.
Recommended
ASIC Prototyping
The EPF10K100EQC240-3 served as an ASIC emulation vehicle in the late 1990s and early 2000s for ASICs in the 50K-80K usable-gate range. The FLEX 10KE architecture closely matches gate-array timing characteristics, making it a faithful prototype vehicle before committing to masked-array silicon. Designers can implement one or two EPF10K100E devices in parallel to prototype larger ASICs, with JTAG-based configuration allowing fast iteration cycles. Today, modern ASIC prototyping typically uses Cyclone V or Stratix IV devices, but EPF10K100EQC240-3 remains useful for maintaining legacy ASIC-replacement designs in long-lifecycle industrial and military programs.
Recommended
Legacy Military and Aerospace Designs
The EPF10K100EQC240-3 supports existing defense electronics programs where form-fit-function replacement is required and design revalidation is prohibitively expensive. Military programs often specify Altera FLEX 10KE devices for backward compatibility with fielded equipment, and the PQFP package is preferred for hand-rework in depot maintenance scenarios. Designers in this segment must plan for last-time-buy procurement because the device is NRND and Intel/Altera does not provide MIL-PRF-38535 certified variants of this family. Long-term buffer stock of 3-5 years of forecasted demand is recommended to bridge obsolescence risk.
Recommended
Test and Measurement Instrumentation
The EPF10K100EQC240-3 is used in legacy ATE, oscilloscope, and signal-generator platforms where it performs DSP-style datapath processing, timing generation, and bus-interface functions. The 200 MHz internal performance supports real-time DSP at audio-bandwidth rates and stimulus pattern generation at 100 MHz+. Its 5 V-tolerant I/O simplifies interface to legacy ADC/DAC front-ends that operate from ±5 V analog supplies. Engineers retrofitting older T&M gear should note that JTAG-based in-field updates are well-supported via USB-Blaster, allowing bug fixes without returning equipment to depot.
Recommended
Embedded Computing and Storage Controllers
The EPF10K100EQC240-3 fits legacy RAID controller, SCSI/SATA bridge, and embedded computing card designs requiring moderate logic density and 5 V host-bus compatibility. Its 49,152 RAM bits accommodate 4 KB of dual-port buffering, sufficient for small FIFO structures in storage controllers. The PQFP-240 package remains popular in PCI-card designs where the through-hole-friendly adapter pattern simplifies board rework. Designers should note the device's 2.5 V core requires careful sequencing relative to 3.3 V and 5 V rails to avoid latch-up during power-up, and that the Quartus II legacy toolchain must be preserved for ongoing firmware updates.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC240-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC240-2 | EPF10K100EQC240-2N | EPF10K100EQC240-2X | EPF10K100EQC240-1 | EPF10K100BQC240-3 |
|---|---|---|---|---|---|---|
| Package | 240-pin PQFP | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same | 240-pin PQFP - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Speed Grade | -3 (fastest commercial) | -2 (slower) | -2N (slower, industrial) | -2X (slower, lead-free) | -1 (slowest commercial) | -3 (same speed grade) |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KB (no dual-port ESB) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 24,576 (single-port only) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Fastest commercial speed grade in FLEX 10KE 100K-gate family (vs EPF10K100EQC240-2)
- Full FLEX 10KE architecture with dual-port ESB memory (vs EPF10K100BQC240-3)
- 240-pin PQFP package simplifies hand-rework and field replacement (vs EPF10K100EFC484-3 (BGA))
Design Notes
The EPF10K100EQC240-3 requires a 2.5 V ±5% core supply (VCCINT) and a separate I/O supply (VCCIO) configurable for 2.5 V / 3.3 V / 5.0 V. Place a 100 µF bulk capacitor near each VCCINT pin pair and 0.1 µF ceramic decoupling at every VCCINT-to-GND pair within 5 mm trace length. SRAM-based FPGAs draw inrush current during configuration; ensure the regulator can source 500 mA peak during multi-second configuration. Estimated quiescent current for VCCINT is 50-150 mA post-configuration depending on logic utilization and clock activity.
The PQFP-240 package has a theta_JA of approximately 28 °C/W with minimal copper pour on a 4-layer FR-4 board. At full 100K-gate utilization and 200 MHz internal clock, expect 0.5-1.0 W internal dissipation, giving a 14-28 °C junction rise above ambient. For high-utilization industrial designs, add a 2 cm² copper pour under the exposed die-pad region and 4-oz copper on outer layers if available. Thermal shutdown is not implemented in the silicon; designers must prevent ambient temperatures above 70 °C (commercial grade) or 85 °C (industrial -N grade).
Route all four dedicated clock inputs (CLK0-CLK3) with controlled-impedance 50 Ω traces and length matching within 25 mils if they feed a common PLL. Place the JTAG TCK, TMS, TDI, TDO signals with 4-mil traces and 4-mil clearance to avoid coupling noise into boundary-scan sampling. Keep configuration mode pins (MSEL0/MSEL1) far from clock edges to prevent mode-flip glitches during power-up. PQFP-240 lead pitch is 0.5 mm, requiring a minimum 5-mil trace between pads and 0.25 mm via-in-pad design rules.
Estimated: When migrating a design from EPF10K100EQC240-2 to -3, recompile because the place-and-route engine will use different timing models. Do not assume JTAG IDCODE is identical across speed grades; verify the BSDL file matches the exact ordering part number. Do not apply 5 V input signals to any I/O pin when VCCIO is 2.5 V or 3.3 V - damage will result. The device is SRAM-based and loses configuration on power-down; non-volatile memory or a microporcessor-driven PS configuration scheme must be provided.
Compliance Information
RoHS and lead-free status marked unknown because the FLEX 10KE family was designed before RoHS legislation took full effect; -2X variants provide lead-free reflow compatibility. AEC-Q100 not applicable as this is not an automotive-grade part. Conflict minerals compliance follows Intel's standard CMRT declaration.
